A method for producing a plurality of holes in a curved surface, wherein the individual holes are removed layer by layer, the first layers to be removed of the holes being arranged at different distances in a Z-direction of the laser, the holes each being processed in a specific focal position, wherein only the holes detected from the same focal position are processed.

A method for producing a plurality of holes in a curved surface, wherein the individual holes are removed layer by layer, the first layers to be removed of the holes being arranged at different distances in a Z-direction of the laser, the holes each being processed in a specific focal position, wherein only the holes detected from the same focal position are processed.

Described herein is an electronics circuit board design tool. The tool includes a substantially planar non-conductive substrate adapted to be positioned on an electronics breadboard. The substrate includes a plurality of guide apertures at locations corresponding to predefined electrical inputs of the breadboard such that electronic components are able to be connected to the electronics breadboard through respective ones of the guide apertures. The tool also includes indicia printed on a surface of substrate. The indicia is indicative of the type or position of electrical connections or components to be connected with the breadboard through corresponding ones of the guide apertures.

A paper machine clothing has a plurality of through-channels formed in a usable region. The through-channels extend through the substrate to connect the upper and lower sides. The through-channels are non-cylindrical with a cross-sectional area becoming smaller along a thickness direction of the substrate from the upper side to a middle region of the substrate. An upper rim of at least one of the plurality of through-channels directly contacts an upper rim of at least one other neighboring through-channel of the plurality of through-channels, wherein the upper rims of both neighboring through-channels have at least three common local maxima, including two outer common local maxima and one intermediate common local maximum that is located between the two outer common local maxima. There is also described a method of producing such a paper machine clothing.

A paper machine clothing has a plurality of through-channels formed in a usable region. The through-channels extend through the substrate to connect the upper and lower sides. The through-channels are non-cylindrical with a cross-sectional area becoming smaller along a thickness direction of the substrate from the upper side to a middle region of the substrate. An upper rim of at least one of the plurality of through-channels directly contacts an upper rim of at least one other neighboring through-channel of the plurality of through-channels, wherein the upper rims of both neighboring through-channels have at least three common local maxima, including two outer common local maxima and one intermediate common local maximum that is located between the two outer common local maxima. There is also described a method of producing such a paper machine clothing.

A carrier tape hole processing device using laser drilling is provided. The carrier tape hole processing device includes a carrier tape formed in a band shape, a work unit configured to move the carrier tape while supporting the carrier tape, a laser drilling module disposed above the work unit and configured to irradiate a laser beam to the carrier tape placed on the work unit, a position recognition unit configured to detect a position and a moving speed of the carrier tape placed on the work unit, and a control unit configured to adjust a position of the laser beam irradiated by the laser drilling module. The control unit adjusts an irradiation position of the laser beam such that the laser beam follows the carrier tape according to the moving speed of the carrier tape detected by the position recognition unit.

A carrier tape hole processing device using laser drilling is provided. The carrier tape hole processing device includes a carrier tape formed in a band shape, a work unit configured to move the carrier tape while supporting the carrier tape, a laser drilling module disposed above the work unit and configured to irradiate a laser beam to the carrier tape placed on the work unit, a position recognition unit configured to detect a position and a moving speed of the carrier tape placed on the work unit, and a control unit configured to adjust a position of the laser beam irradiated by the laser drilling module. The control unit adjusts an irradiation position of the laser beam such that the laser beam follows the carrier tape according to the moving speed of the carrier tape detected by the position recognition unit.

A method includes forming an insulating layer over a package. The package has a plurality of locations where openings are subsequently formed. A first laser shot is performed, location by location, on each of the locations across the package. A first laser spot of the first laser shot overlaps with each of the locations. The first laser shot removes a first portion of the insulating layer below the first laser spot. Another laser shot is performed, location by location, on each of the locations across the package. Another laser spot of the another laser shot overlaps with each of the locations. The another laser shot removes another portion of the insulating layer below the another laser spot. Performing the another laser shot, location by location, on each of the locations across the package is repeated multiple times, until desired portions of the insulating layer are removed.

A method includes forming an insulating layer over a package. The package has a plurality of locations where openings are subsequently formed. A first laser shot is performed, location by location, on each of the locations across the package. A first laser spot of the first laser shot overlaps with each of the locations. The first laser shot removes a first portion of the insulating layer below the first laser spot. Another laser shot is performed, location by location, on each of the locations across the package. Another laser spot of the another laser shot overlaps with each of the locations. The another laser shot removes another portion of the insulating layer below the another laser spot. Performing the another laser shot, location by location, on each of the locations across the package is repeated multiple times, until desired portions of the insulating layer are removed.

Embedded die packaging for semiconductor devices and methods of fabrication wherein conductive vias are provided to interconnect contact areas on the die and package interconnect areas. Before embedding, a protective masking layer is provided selectively on regions of the electrical contact areas where vias are to be formed by laser drilling. The material of the protective masking layer is selected to protect against over-drilling and/or to control absorption properties of surface of the pad metal to reduce absorption of laser energy during laser drilling of micro-vias, thereby mitigating physical damage, overheating or other potential damage to the semiconductor device. The masking layer may be resistant to surface treatment of other regions of the electrical contact areas, e.g. to increase surface roughness to promote adhesion of package dielectric.