A processing method for processing an SiC ingot includes a peel-off zone forming step of applying a processing pulsed laser beam having a wavelength transmittable through the ingot to the ingot while positioning a focused spot of the processing pulsed laser beam at a depth corresponding to a thickness of a wafer to be peeled off from the ingot, to form belt-shaped peel-off zones each including cracks in the ingot, a reflected beam detecting step of applying an inspecting laser beam having a wavelength transmittable through the ingot and reflectable from cracks of the peel-off zones and detecting an intensity of a beam reflected by the cracks, and a processing laser beam output power adjusting step of adjusting an output power of the processing pulsed laser beam to keep the intensity of the reflected beam detected in the reflected beam detecting step within a predetermined range.

A laser beam spot shape correcting method includes a laser beam irradiating step of irradiating a concave mirror with a laser beam, an imaging step of imaging reflected light by a beam profiler, an image forming step of forming an XZ plane image or a YZ plane image from an XY plane image imaged in the imaging step, and a comparing step of comparing the image formed in the image forming step with an XZ plane image or a YZ plane image of an ideal laser beam. A phase pattern displayed on a display unit of a spatial light modulator is changed such that the XZ plane image or the YZ plane image formed in the image forming step coincides with the XZ plane image or the YZ plane image of the ideal laser beam.

A laser processing apparatus includes: a laser light source configured to generate a laser beam; a plurality of scanners, wherein each of the plurality of scanners is configured to move the laser beam along a processing path so that the laser beam is irradiated onto a corresponding workpiece of a plurality of workpieces, respectively; a plurality of lenses respectively disposed between the plurality of scanners and the plurality of workpieces; and a measuring circuit spaced apart from the plurality of lenses with the plurality of workpieces interposed therebetween, wherein: the measuring circuit moves along a measuring path and measures a characteristic of the laser beam; and the measuring path overlaps the processing path of each of the plurality of scanners.

This shaping apparatus is equipped with: a movement system which moves a target surface; a measurement system for acquiring position information of the target surface in a state movable by the movement system, a beam shaping system that has a beam irradiation section and a material processing section which supplies a shaping material irradiated by a beam from beam irradiation section; and a controller. On the basis of 3D data of a three-dimensional shaped object to be formed on a target surface and position information of the target surface acquired using the measurement system, the controller controls the movement system and the beam shaping system such that a target portion on the target surface is shaped by supplying the shaping material while moving the target surface and the beam from beam irradiation section relative to each other.

Disclosed herein is a laser beam measurement system that includes a beam measurement device, a positioning apparatus, and a control system. The beam measurement device can include an imager and a plurality of optical elements configured to form an optical path to the imager within the beam measurement device. The positioning apparatus is configured to adjust a position of the beam measurement device relative to a build plate of a laser powder bed fusion system. The control system is configured to determine an intended measurement position to observe a laser beam profile of the laser powder bed fusion system, determine a target position of a beam measurement device to align with the intended measurement position, and command an adjustment of one or more aspects of the beam measurement device to achieve alignment of the target with the intended measurement position.

A sensor arrangement/evaluation which allows piercing detection within a fiber optic cable connector by means of two photodetectors independent of power, pulse frequency and pulse length.

A detector is configured to detect an output of a reflected beam from an exit end surface of a parallel plate. A determination unit is configured to determine that an abnormality occurs in the parallel plate when a detection value of the detector is smaller than a determination threshold.

A laser processing machine includes: a lens for condensing a laser beam; an actuator changing a relative position between the lens and a workpiece to change a focal position of the laser beam with respect to the workpiece; a protective glass disposed between the lens and the workpiece; a detector detecting a focal position of the laser beam; and a controller configured to control the actuator, the controller configured to obtain a current deviation amount of the focal position from a target position using the detector, the controller configured to obtain a relationship data, wherein the relationship data indicates relationship between a deviation amount of the focal position from the target position and a spot diameter of the laser beam on a surface of the workpiece when contaminant adheres the protective glass, the controller configured to estimate a current spot diameter of the laser beam on the surface using the current deviation amount and the relationship data, the controller configured to control the actuator to correct the current spot diameter using the current deviation amount and an estimated current spot diameter.

A system for analyzing laser beam characteristics in high-speed laser motion systems, wherein the high-speed laser motion systems comprise multiple lasers each having a field of view that generates non-stationary laser beams and a build platform positioned at a predetermined location relative to the non-stationary laser beams, comprising at least one mounted pin-hole sensor that receives laser light generated by the non-stationary laser beams; an actuation device that includes either: the at least one pin-hole sensor; or an optical device that directs the laser light to the at least one pin-hole sensor; and wherein the actuation device is actuated into an operating environment above the build platform.

A laser system connectable to an exposure apparatus includes a spectrometer configured to acquire a measurement waveform from an interference pattern of laser light output from the laser system, and a processor configured to calculate a convolution spectrum waveform using the measurement waveform and a first intermediate function obtained through a process of deconvolution of an aerial image function of the exposure apparatus with an instrument function of the spectrometer.