A laser machining device includes a storage unit configured to store a reference value based on an energy amount of returning light when laser light is emitted, in a state where external optical system is not contaminated, toward a reflection plate with a predetermined output low enough not to melt or deform the reflection plate such that a focus position of the laser light aligns with a predetermined position, and a processing condition correction unit configured to correct, prior to laser machining, a processing condition in accordance with the contamination level of the external optical system, wherein the processing condition correction unit includes a laser power correction section configured to correct a laser power of the processing condition based on the measurement value measured by a returning light measurement unit and the reference value.

A laser apparatus may include a spectrum controller and a spectrum modulator. The spectrum controller may control a center wavelength and/or a bandwidth of a spectrum of a laser beam. The spectrum modulator may modulate the spectrum of the laser beam having the center wavelength and/or the bandwidth controlled by the spectrum controller. Thus, the laser beam may have the spectrum optimal for a semiconductor fabrication process. Particularly, the substrate may be accurately diced using the laser beam having the optimal spectrum.

The invention relates to an apparatus 100, 200, 300, 700 and a method 400 for machining a workpiece 101 with a laser beam 102. The apparatus 100, 200, 300, 700 comprises a machining unit 103 configured to provide a pressurized fluid jet 104 onto the workpiece 101 and to couple the laser beam 102 through at least one optical element 105 into the fluid jet 104 towards the workpiece 101. Further, it comprises a sensing unit 107 arranged to receive a laser-induced electromagnetic radiation 106 propagating away from the workpiece 101 through the fluid jet 104 and through at least one optical element, and configured to convert the received radiation 106 into a signal 108. The apparatus 100, 200, 300, 700 also comprises a signal processing unit 109 configured determine a state of machining the workpiece 101 based on the signal 108.

Laser processing head (20) of the present disclosure includes housing (30), transparent protector (40), and temperature sensor (70). Housing (30) includes an optical path of processing laser light (LB). Transparent protector (40) is detachably fixed to housing (30), passes processing laser light (LB), and suppresses dust of work material (W) entering into housing (30). Here, the dust is generated from the work material (W) irradiated with processing laser light (LB). Temperature sensor (70) detects the temperature of transparent protector (40).

A laser processing device includes a beam splitter disposed between a focusing lens and a protective window, a return light measurement unit configured to measure intensity distribution of a return light reflected from a workpiece and returning to an external optical system via the beam splitter, a storage unit configured to store at least one of normal pattern data representing the intensity distribution of the return light when the protective window is in normal condition and abnormal pattern data representing the intensity distribution of the return light when the protective window is contaminated, a processing unit configured to perform a process of detecting contamination of the protective window during laser processing based on measurement data about the return light and at least one of the normal pattern data and the abnormal pattern data, and a warning unit configured to warn of contamination of the protective window in accordance with the process.

To allow compensation of position error of a laser beam from a target position in a laser machine in response to temperature change while the compensation is to be affected intricately by a plurality of optical parts and constituting members. A machine learning device performs machine learning on a laser machine comprising a plurality of galvanometer mirrors for reflection of a laser beam and a plurality of galvanometer motors for driving corresponding ones of the galvanometer mirrors to rotate, and scanning the laser beam over a workpiece. The machine learning device comprises: input data acquisition unit that acquires at least two detected temperatures from the galvanometer mirrors and the galvanometer motors as input data; label acquisition unit that acquires a coefficient as a label for calculating a machining target position from an actual position of machining with the laser beam on the workpiece; and learning unit that performs supervised learning using a set of the label and the input data as training data to construct a mathematical model for calculating the machining target position from the actual machining position on the workpiece on the basis of the at least two detected temperatures.

A laser control device includes a processor configured to control, when a control circuit of a laser device detects occurrence of an abnormality in a laser oscillator or a laser optical system and stops laser output from the laser oscillator, the control circuit based on a result of determining whether to enable or disable re-outputting of laser light from the laser oscillator by inputting, to a classifier, input data being at least a part of environmental data and state data about the laser device in a predetermined period including a stop time of laser output. Then, the state data and the input data in the predetermined period include at least one of time-series data about a light amount of laser light and time-series data about a light amount of return light propagating in a direction opposite to a direction of the laser light in the predetermined period.

A condenser lens for collecting a laser beam (300) is disposed between the laser oscillator and the incident end surface of the optical fiber. The laser beam (300) is divided into a plurality of beams (303, 304). The power of the laser beam (304) is measured and maximized by adjusting the position of the condenser lens. The FFP of the laser beam (303) is measured and minimized by adjusting the position of the condenser lens. These adjusted positions are stored as the first and second lens positions. The FFP of the laser beam (303) is measured while the condenser lens is being moved between these positions so as to make the BPP not more than a predetermined value.

A bonding method includes: an oxide-film forming step, on an irradiated surface, an oxide film having a film thickness corresponding to a first output and an irradiation time of an oxide-film-forming laser beam; a first reflected-laser-beam detection step of detecting a second output; a first absorptance computing step of computing a first absorptance for the oxide-film-forming laser beam; laser-beam switching step of switching the oxide-film-forming laser beam radiated onto the irradiated surface to a heat-bonding laser beam; and a heat bonding step of heating a first bonding surface until the temperature thereof reaches a predetermined bonding temperature, and bonding the first bonding surface to a second bonding surface.

A process fiber (20) includes a first light transmitter configured to transmit the processing laser beam emitted from a processing laser source (12) of a laser processing system (1); a measuring laser source (14); and a second light transmitter fixed to the first light transmitter along the length of the first light transmitter and configured to transmit the measuring laser beam emitted from the measuring laser source (14). The bending radius of the first light transmitter at a predetermined position is detected based on the measuring laser beam reflected by the second light transmitter.