A bonding material having a first layer containing Sn as a main component thereof and a second layer containing a metal having a higher melting point than that of Sn as a main component thereof, wherein the first layer and the second layer are laminated on each other, and an amount of Sn in the first layer is larger than a stoichiometric amount of Sn that forms an intermetallic compound between the Sn and the metal.

A brazing material outer coat and a method for preparing the same, an in-situ synthetic metal-coated flux-cored silver brazing material and a method for preparing the same, a welding method and a joint body, wherein the in-situ synthetic metal-coated flux-cored silver brazing material comprises a flux core and a brazing material outer coat wrapping the flux core, the brazing material outer coat comprises, in percentage by weight: silver Ag 20.036.0%, copper Cu 35.045.0%, zinc Zn 27.037.0%, tin Sn 1.03.0%, phosphorus P 0.1%0.5%, nickel Ni 0.52.0%, germanium Ge 0.10.3%, and lithium Li 0.10.3%, the flux core comprises, in percentage by weight: elemental boron micropowder 5.010.0%, sodium borohydride 5.010.0%, potassium fluoroborate 15.030.0%, boric anhydride 25.040.0%, sodium fluoride 10.030.0%, sodium bifluoride 2.04.0%, and copper sulfate 1.05.0%. The in-situ synthetic metal-coated flux-cored silver brazing material in the present disclosure realizes self-reaction in a brazing process to coat a layer of copper film on a surface of a brazed metal, the core of the brazing material has good wettability, good flowability, self-brazing function, and zinc being hard to volatilize, the flux coat has high activity, low hygroscopicity, few carbon residues, good plasticity and toughness, etc. The present disclosure is particularly suitable for brazing pipeline components of stainless steel, manganese brass and so on.

A thermal bonding sheet includes a pre-sintering layer containing copper particles and polycarbonate.

A sputtering target-backing plate assembly obtained by bonding a sputtering target and a backing plate using a brazing material, wherein a braze bonding layer which bonds the sputtering target and the backing plate contains a material having thermal conductivity that is higher than that of the brazing material in an amount of 5 vol % or more and 50 vol % or less, and a thickness of the braze bonding layer is 100 m or more and 700 m or less. An object is to prevent the seepage of the brazing material while maintaining the thickness of the braze bonding layer.

Provided is a solder material having oxidation resistance at the time of melting solder or after melting it, as well as managing a thickness of oxide film at a fixed value or less before melting the solder. A Cu core ball 1A is provided with a Cu ball 2A for keeping a space between a semiconductor package and a printed circuit board and a solder layer 3A that covers the Cu ball 2A. The solder layer 3A is composed of Sn or a solder alloy whose main component is Sn. For the Cu core ball 1A, lightness is equal to or more than 65 in the L*a*b* color space and yellowness is equal to or less than 7.0 in the L*a*b* color space, and more preferably, the lightness is equal to or more than 70 and the yellowness thereof is equal to or less than 5.1.

An aluminum alloy brazing sheet for a heat exchanger includes a three-layer material in which a brazing material layer, an intermediate layer, and a core material are cladded and stacked, the intermediate layer is formed of an aluminum alloy which can include Mn, Si, Fe, and Cu, with the balance being Al and inevitable impurities, the core material is formed of an aluminum alloy which can include Si, Fe, Cu, and Mn, with the balance being Al and inevitable impurities, and the brazing material layer is formed of an aluminum alloy including Si, with the balance being Al and inevitable impurities.

An aluminum foil having a high adhesiveness to solder and containing at least one of Sn and Bi, in which a ratio of a total mass of Sn and Bi to a total mass of the aluminum foil is 0.0075 mass % or more and 15 mass % or less.

This aluminum alloy brazing sheet is provided with: a core material comprising 2.0 mass % or less (including 0 mass %) of Mg and a remainder of Al and unavoidable impurities; and a brazing material comprising Si, Bi, Mg, and a remainder of Al and unavoidable impurities. The aluminum alloy brazing sheet satisfies the expressions 3C.sub.Si13, 0.13C.sub.Mg.sup.0.3C.sub.Bi0.58C.sub.Mg.sup.0.45, C.sub.Mg-b0.1, and 0.2C.sub.Mg1.1 when the Si content of the brazing material is denoted by C.sub.Si, the Bi content of the brazing material is denoted by C.sub.Bi, the Mg content of the brazing material is denoted by C.sub.Mg-b, the Mg content of the core material is denoted by C.sub.Mg-c, and C.sub.Mg=C.sub.Mg-b+C.sub.Mg-c/2.

A copper-based brazing material comprises an alloy having nickel in a proportion of from 20 to 35 percent by weight, zinc in a proportion of from 5 to 20 percent by weight, manganese in a proportion of from 5 to 20 percent by weight, chromium in a proportion of from 1 to 10 percent by weight, silicon in a proportion of from 0.1 to 5 percent by weight and molybdenum in a proportion of from 0 to 7 percent by weight, each based on the total weight of the alloy, and the remainder being copper and unavoidable impurities. The alloy is in particular free from boron, phosphorus and lead. The brazing material can be used for induction brazing of components made of iron materials for exhaust systems in motor vehicles.

The present applicant presents a structure intended for high temperature use above 30 C. comprising multiple components having metal-to-metal or metal-to-ceramic contacting surfaces wherein the surfaces are joined by a braze composed of pure aluminum. Anticipated devices include but are not limited to igniters as well as electronic applications in the automotive and aerospace industries.