A joined body according to the invention is a ceramic/aluminum joined body including: a ceramic member; and an aluminum member made of aluminum or an aluminum alloy, in which the ceramic member and the aluminum member are joined to each other, the ceramic member is formed of silicon nitride containing magnesium, and a joining layer in which magnesium is contained in an aluminum-silicon-oxygen-nitrogen compound is formed at a joining interface between the ceramic member and the aluminum member.

A device for manufacturing a plate solder according to the present invention includes a reel on which a thread solder is wound; a cutter that cuts the thread solder, provided between the reel and an end part of the thread solder extending from the reel; an aggregating part that aggregates a plurality of cut thread solders such that the plurality of thread solders are in contact with one another; and a roller that rolls the plurality of aggregated thread solders and pressure bonds them to one another to form a plate solder.

A strip intended for the manufacture of brazed heat exchangers, having a core made of an aluminium alloy with the composition (weight %): Si: 0.10-0.30%, preferably 0.15-0.25% Fe<0.20% Cu: 0.75-1.05%, preferably 0.75-1.02%, more preferably 0.75-1.0% Mn: 1.2-1.7%, preferably 1.2-1.55%, more preferably 1.25-1.4% Mg<0.03% preferably <0.025%, more preferably <0.015% Zn<0.1% Ti<0.15% other elements <0.05% each and <0.15% in total, remainder aluminium.

The present invention has as its technical problem to prevent cracking when producing a steel sheet by ferritic stainless steel sheet and provide a ferritic stainless steel sheet excellent in toughness and a part using the same. To solve this technical problem, the present invention provides steel comprised of, by mass %, C: 0.001 to 0.030%, Si: 0.01 to 1.00%, Mn: 0.01 to 1.00%, P: 0.010 to 0.050%, S: 0.0002 to 0.0100%, Cr: 10.0 to 20.0%, N: 0.001 to 0.030%, Nb: 0.10 to 0.40%, B: 0.0002 to 0.0030%, Al: 0.005 to 0.100%, and a balance of Fe and unavoidable impurities in which the amount of solute Nb being less than or equal to a smaller value of 0.20 and (Nb content-0.08) mass %.

A method for the repair of a heater, or an electrostatic chuck, using a ceramic top layer joined with a hermetically sealed joint. The heater or electrostatic chuck may be machined down to remove a damaged top surface, and to allow for the joining of a new top surface. The new top pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.

A ductile boron bearing nickel based welding material which includes boron within the range of 0.4-0.6 wt. % B, carbon from a trace amount to 0.04 wt. % C, 17-23 wt. % Cr, 0.35-10 wt. % Mo, 0.1-4.15 wt. % Nb with nickel or iron and impurities to balance for manufacturing of welding and brazing wires, powders and foils used in the repair of various articles made of nickel, cobalt and iron based alloys.

The present invention relates to a method of bonding at a faying surface two substrates of -titanium aluminide alloy having a -single phase region at elevated temperatures, comprising the steps of applying a braze material of a titanium alloy consisting of from 10 to 35 at. % aluminum, from 5 to 30 at. % iron and/or nickel, and optionally other alloying elements present in the substrate material in quantities (at. %) up to their content in the substrate material, the remainder being titanium, at the faying surface of the substrates, and subjecting the substrates and braze material to an elevated temperature in the -single phase region of the substrate, and joining the substrate at the crack interface by transient liquid phase bonding.

The present invention relates to a method of bonding two substrates of titanium aluminide alloy at a faying surface, comprising the steps of applying a braze material of a titanium alloy consisting of from 10 to 35 at. % aluminum, from 5 to 30 at. % iron and/or nickel, and optionally other alloying elements present in the substrate material in quantities (at. %) up to their content in the substrate material, the remainder being titanium, at the faying surface of the substrates, and subjecting the substrates and braze material to an elevated temperature above the melting point of the braze material and below -solvus temperature of the -titanium aluminide alloy, and joining the substrates by transient liquid phase bonding.

Provided are a thermal bonding sheet capable of suppressing inhibition of sintering of sinterable metallic particles by an organic component, thereby imparting sufficient bonding reliability to a power semiconductor device, and a thermal bonding sheet with a dicing tape having the thermal bonding sheet. A thermal bonding sheet has a precursor layer that is to become a sintered layer by heating, and the precursor layer has sinterable metallic particles and an organic component, a 95% weight loss temperature of the organic component is 150 C. or more and 300 C. or less when thermogravimetry of the thermal bonding sheet is performed under an air atmosphere at a heating rate of 10 C./min.

A bonding sheet according to the present invention contains a matrix resin; solder particles; and a fluxing agent. The bonding sheet has a surface with a surface roughness Sa of 2.5 ?m or less.