A brazing sheet brazing suitable for brazing performed in an inert gas atmosphere or in a vacuum without using a flux has a three-layer composition. An aluminum alloy core material contains Mg: 1.3 mass % or less. An aluminum alloy intermediate material is layered on the core material and contains Mg: 0.40-6.0 mass %. An aluminum alloy filler material is layered on the intermediate material and contains Si: 6.0-13.0 mass %, Bi: 0.0040-0.070 mass %, and Mg: 0.050-0.10 mass %.

A copper-based brazing material comprises an alloy having nickel in a proportion of from 20 to 35 percent by weight, zinc in a proportion of from 5 to 20 percent by weight, manganese in a proportion of from 5 to 20 percent by weight, chromium in a proportion of from 1 to 10 percent by weight, silicon in a proportion of from 0.1 to 5 percent by weight and molybdenum in a proportion of from 0 to 7 percent by weight, each based on the total weight of the alloy, and the remainder being copper and unavoidable impurities. The alloy is in particular free from boron, phosphorus and lead. The brazing material can be used for induction brazing of components made of iron materials for exhaust systems in motor vehicles.

A bonding member 10 used for bonding a semiconductor device 20 and a substrate 30, the bonding member including: a thermal stress relieving layer 11 made of any of Ag, Cu, Au, and Al; a first Ag brazing material layer 12 containing Ag and Sn as main components and provided on a side of the thermal stress relieving layer to which the semiconductor device is bonded; a second Ag brazing material layer 13 containing Ag and Sn as main components and provided on a side of the thermal stress relieving layer to which the substrate is bonded; a first barrier layer 14 made of Ni and/or Ni alloy and provided between the thermal stress relieving layer and the first Ag brazing material layer; and a second barrier layer 15 made of Ni and/or Ni alloy and provided between the stress relieving layer and the second Ag brazing material layer, in which a thermal conductivity of the bonding member after a power cycle test is 200 W/m.Math.K or more.

A flux-free brazing aluminum alloy brazing sheet includes: a core material formed of aluminum alloy comprising Si of 0.50 to 0.90 mass %, Cu of 0.30 to 2.50 mass %, and Mn of 1.40 to 1.80 mass %, with a Mg content limited to 0.05 mass % or less, and with the balance being Al and inevitable impurities; an intermediate material being formed of aluminum alloy comprising Mg of 0.40 to 1.00 mass %, and Zn of 2.00 to 6.00 mass %, with the balance being Al and inevitable impurities; and a brazing material being formed of aluminum alloy comprising Si of 6.00 to 13.00 mass %, Mg of 0.05 to 0.40 mass %, and Bi of 0.010 to 0.050 mass %, with the balance being Al and inevitable impurities.

An aluminum alloy brazing sheet used for brazing in an inert gas atmosphere without using flux includes a core material of aluminum or aluminum alloy, and a brazing material of aluminum alloy including Si of 4.0 mass % to 13.0 mass % and cladding one side surface or both side surfaces of the core material. One or both of the core material and the brazing material includes any one or two or more types of X atoms (X is Mg, Li, Be, Ca, Ce, La, Y, and Zr). The aluminum alloy brazing sheet is a brazing sheet in which oxide particles including the X atoms and having a volume change ratio of 0.99 or lower with respect to an oxide film before brazing heating are formed on a surface thereof, by brazing heating.

Provided is a method of manufacturing a semiconductor having a double-sided substrate including preparing a first substrate on which a specific pattern is formed to enable electrical connection, preparing at least one semiconductor chip bonded to a metal post, bonding the at least one semiconductor chip to the first substrate, bonding a second substrate to the metal post, forming a package housing by packaging the first substrate and the second substrate to expose a lead frame, and forming terminal leads toward the outside of the package housing. Accordingly, the semiconductor chip and the metal post are previously joined to each other and are respectively bonded to the first substrate and the second substrate so that damage generated while bonding the semiconductor chip may be minimized and electrical properties and reliability of the semiconductor chip may be improved.

The invention belongs to the field of additive manufacturing of amorphous alloy, and discloses a laser 3D printing forming system of amorphous alloy foil and a forming method thereof. The unnecessary material of the amorphous alloy foil is cut by a first laser and then the remaining portion is selectively scanned and heated by a second laser so that the amorphous alloy is heated to be in a superplastic state in the supercooled liquid region. Then, the amorphous alloy foil is rolled by a preheated roller in combination with the ultrasonic vibration to achieve interatomic bonding between layers of the amorphous alloy foil, and the amorphous alloy foil is then rapidly cooled, so that an amorphous alloy part with a large size, a complicated shape and a porous structure is formed. The invention has overcome the limitation of the size and shape of the amorphous alloy prepared by the traditional amorphous alloy preparation methods, and uses amorphous alloy foil as a raw material, which has lower cost than the traditional 3D printing amorphous powder. In addition, a roller is used to roll the ultra-thin amorphous alloy foil such that the prepared amorphous alloy part has a more compact internal structure.

The invention relates to a rolled fin stock material from an 3xxx-series aluminium alloy comprising, in wt. %, Mn 0.7% to 2.0%, Si 0.4% to 1.5%, Zn up to 4%, Fe up to 0.8%, Zr 0.02% to 0.40%, Sc 0.01% to 0.6%, Ni up to 0.3%, Cu up to 0.5%, Mg up to 2%, Cr up to 0.3%, Ti up to 0.3%, the balance aluminium and tolerable impurities. The invention further relates to a brazed assembly of components incorporating such a fin stock material.

The invention concerns a method for the manufacturing of a clad sheet product comprising a core layer (6) and at least one cladding layer, the method comprising rolling an assembly of a core layer and at least one cladding layer and reducing the thickness to a desired gauge, the core layer being made of an aluminium alloy, the at least one cladding layer comprising a centre section (2) and at least two edge sections (4, 5) positioned at opposite sides of the centre section (2) along the edges of the at least one cladding layer, the centre section being made of a material being an aluminium alloy or a composite material comprising a matrix of aluminium or an aluminium alloy, the edge sections along (4, 5) the edges being made of a material different from the material of the centre section, wherein the edge sections (4, 5) are cut off during or after the rolling. The invention further concerns a cladding plate useful in the method.

A process for producing an amorphous ductile brazing foil is provided. According to one example embodiment, the method includes providing a molten mass, and rapidly solidifying the molten mass on a moving cooling surface with a cooling speed of more than approximately 10.sup.5° C./sec to produce an amorphous ductile brazing foil. A process for joining two or more parts is also provided. The process includes inserting a brazing foil between two or more parts to be joined, wherein the parts to be joined have a higher melting temperature than that the brazing foil to form a solder joint and the brazing foil comprises an amorphous, ductile Ni-based brazing foil; heating the solder joint to a temperature above the liquidus temperature of the brazing foil to form a heated solder joint; and cooling the heated solder joint, thereby forming a brazed joint between the parts to be joined.