An electronic control device includes: a circuit board; an electronic component; and a bonding portion bonding the circuit board and the electronic component to each other. The bonding portion contains Sn as a main component, Bi and Sb in a total content ratio of 3 wt % or more, and Ag in a content of 3 to 3.9 wt %, with no In.

A method of creating a cladded tool with a distributor including a feed mechanism and an energy source. The method includes providing a substrate and distributing particulate material from the feed mechanism onto the substrate. The particulate material includes agglomerated particles with diameters between 30 and 100 microns. The method also includes activating the energy source to produce a beam spot on the particulate material, the substrate, or both and at least partially melting the particulate material, the substrate, or both with the beam spot to form a bonded layer of particulate material on the substrate.

Methods for die attachment of multichip and single components including flip chips may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.

Undercooled liquid metallic core-shell particles, whose core is stable against solidification at ambient conditions, i.e. under near ambient temperature and pressure conditions, are used to join or repair metallic non-particulate components. The undercooled-shell particles in the form of nano-size or micro-size particles comprise an undercooled stable liquid metallic core encapsulated inside an outer shell, which can comprise an oxide or other stabilizer shell typically formed in-situ on the undercooled liquid metallic core. The shell is ruptured to release the liquid phase core material to join or repair a component(s).

A composition of a nickel-based alloy mixture which can be used for welding via especially liquid metal deposition or as a powder bed of an additive manufacturing method. The metallic powder mixture includes a cobalt (Co) or nickel (Ni) based super alloy, a NiCoCrAlY—X-composition wherein X=Silicon (Si), Tantalum (Ta), Rhenium (Re) and/or Iron (Fe), a metallic braze material, wherein the melting point of the braze material is at least 10K lower than the melting point of the cobalt (Co) or nickel (Ni) based superalloy.

A method may include removing a portion of a base component adjacent to a damaged portion of the base component to define a repair portion of the base component. The base component may include a cobalt- or nickel-based superalloy, and the repair portion of the base component may include a through-hole extending from a first surface of the base component to a second surface of the base component. The method also may include forming a braze sintered preform to substantially reproduce a shape of the through-hole. The braze sintered preform may include a Ni- or Co-based alloy. The method additionally may include placing the braze sintered preform in the through-hole and heating at least the braze sintered preform to cause the braze sintered preform to join to the repair portion of the base component and change a microstructure of the braze sintered preform to a brazed and diffused microstructure.

A solder alloy which suppresses the change in a solder paste over time, exhibits excellent wettability, decreases the temperature difference between the liquidus-line temperature and the solidus temperature, and exhibits high mechanical properties, as well as a solder powder and a solder joint are provided. The solder alloy has an alloy constitution composed of: 10 ppm by mass or more and less than 25 ppm by mass of As; at least one selected from the group consisting of 0 ppm by mass to 25000 ppm by mass of Bi and 0 ppm by mass to 8000 ppm by mass of Pb; and a remaining amount of Sn; and satisfies both the formula (1) and the formula (2),

300≤3As+Bi+Pb  (1)

0<2.3×10.sup.−4×Bi+8.2×10.sup.−4×Pb≤7  (2) in the formula (1) and the formula (2), As, Bi, and Pb each represents an amount thereof (ppm by mass) in the alloy constitution.

Disclosed herein are embodiments of a powder feedstock, such as for bulk welding, which can produce welds. The powder feedstock can include high levels of boron, and may be improved over previously used cored wires. Coatings can be formed from the powder feedstock which may have high hardness in certain embodiments, and low mass loss under ASTM standards.

A welding method using coated abrasive particles, coated abrasive particles, coating system and sealing system which uses particles, in which a hard material layer is applied around abrasive particles such as cubic boron nitride (cBN) and protects against oxidation during welding. The hard material compound in the coating may include a carbide, in particular titanium carbide. A sealing system is composed of stator and rotor blade having the layer system.

A method for joining a first metal part with a second metal part, the metal parts having a solidus temperature above 1100° C., includes applying a melting depressant composition on a surface of the first metal part, the melting depressant composition including a melting depressant component that includes at least 25 wt % boron and silicon for decreasing a melting temperature of the first metal part; bringing the second metal part into contact with the melting depressant composition at a contact point on said surface; heating the first and second metal parts to a temperature above 1100° C.; and allowing a melted metal layer of the first metal component to solidify, such that a joint is obtained at the contact point. The boron at least partly originates from a boron compound selected from any of the following compounds: boric acid, borax, titanium diboride and boron nitride. The melting depressant composition and related products are also described.