A field device for processing and automation technology includes a first and a second component that can each be mechanically connected at a joining surface by means of a joining point. Two metal surface layers are each applied at least to the joining surface of the first component and the joining surface of the second component. The metal of the surface layers is different from the metal of the first and/or the metal of the second component. A joining material is applied between the respective joining surfaces of the two components, wherein the joining material includes particles at least partially consisting of a metal that corresponds with the metal of the surface layers The joining of the two components occurs at a joining temperature below 300° C.

A silver-copper cutting electrode assembly, and method of manufacture is provided with optimized attributes to allow for improved durability, integrity and manufacturability. An electrode has a silver tip portion which is brazed to a copper body portion where the silver portion and joint have a particular structural relationship.

Disclosed is a Ni—Cr-based brazing alloy including, on the basis of mass %: 15%<Cr<30%; 3%<P<12%; 0%≤Si<8%; 0.01%<C<0.06%; 0%≤Ti+Zr<0.1%; 0.01%<V<0.1%; 0%≤Al<0.01%; 0.005%<O<0.025%; 0.001%<N<0.050%; 0%≤Nb<0.1%; and the balance being Ni and incidental impurities. Inequality (1): 0.2≤0.24V %/C %≤1.0 is satisfied if the alloy contains no Nb, and Inequality (2): 0.2≤(0.24V %+0.13Nb %)/C %≤1.0 is satisfied if the alloy contains Nb. Also disclosed is an inexpensive Ni—Cr-based brazing alloy containing a trace amount of V for use in the production of stainless steel heat exchangers and other steel articles. The alloy has a low liquidus temperature and high corrosion resistance, and achieves high brazing strength.

Disclosed is a Ni—Cr-based brazing alloy including, on the basis of mass %: 15%<Cr<30%; 3%<P<12%; 0%≤Si<8%; 0.01%<C<0.06%; 0%≤Ti+Zr<0.1%; 0.01%<V<0.1%; 0%≤Al<0.01%; 0.005%<O<0.025%; 0.001%<N<0.050%; 0%≤Nb<0.1%; and the balance being Ni and incidental impurities. Inequality (1): 0.2≤0.24V %/C %≤1.0 is satisfied if the alloy contains no Nb, and Inequality (2): 0.2≤(0.24V %+0.13Nb %)/C %≤1.0 is satisfied if the alloy contains Nb. Also disclosed is an inexpensive Ni—Cr-based brazing alloy containing a trace amount of V for use in the production of stainless steel heat exchangers and other steel articles. The alloy has a low liquidus temperature and high corrosion resistance, and achieves high brazing strength.

Structures for a tool surface of a downhole tool are constructed from a metal clay molded in a wet state. The wet state clay is a workable combination that can have a braze alloy grain, a tungsten carbide grain, and a binder. Additional cutting inserts can be embedded in the molded clay. Heat treatment applied to the molded metal clay causing the binder to be combusted and consumed. The braze alloy melts and then cools into a fused state with the tungsten carbide grain therein. The structure can affix to the tool surface of the tool by first being fused and then attached by brazing to the tool. Alternatively, the structure can be positioned in a fusible state adjacent the tool surface. When the heat treatment is applied, the structure fuses together and forms a metallurgical bond with the tool surface of the tool.

A high melt superalloy powder mixture is provided for use with additive manufacturing or welding metal components or portions thereof. The high melt superalloy powder may include by weight about 7.7% to about 18% chromium, about 10.6% to about 11% cobalt, about 4.5% to about 6.5% aluminum, about 10.6% to about 11% tungsten, about 0.3% to about 0.55% molybdenum, about 0.05% to about 0.08% carbon, and at least 40% nickel.

A method of pretinning a guidewire core made of shape memory alloy and having an elongate axis, comprising: placing a ball of solder in a pocket in a soldering block; melting the ball of solder; holding a guidewire core over the ball of solder; lowering the guidewire core into the ball of solder; removing the guidewire from the ball of solder.

Provided is a solid wire for gas metal arc welding, solid wire being suitable as a welding material for high-Mn steel materials and generating less fume during welding. The solid wire of the present invention has a composition containing, in mass %, C: 0.20 to 0.80%, Si: 0.15 to 0.90%, Mn: 15.0 to 30.0%, P: 0.030% or less, S: 0.030% or less, Al: 0.020% or less, Ni: 0.01 to 10.00%, Cr: 6.0 to 15.0%, Mo: 0.01 to 3.50%, O: 0.010% or less, N: 0.120% or less, and the balance being Fe and incidental impurities.

Provided is a solid wire for gas metal arc welding, solid wire being suitable as a welding material for high-Mn steel materials and generating less fume during welding. The solid wire of the present invention has a composition containing, in mass %, C: 0.20 to 0.80%, Si: 0.15 to 0.90%, Mn: 15.0 to 30.0%, P: 0.030% or less, S: 0.030% or less, Al: 0.020% or less, Ni: 0.01 to 10.00%, Cr: 6.0 to 15.0%, Mo: 0.01 to 3.50%, O: 0.010% or less, N: 0.120% or less, and the balance being Fe and incidental impurities.

A solder material may include nickel and tin. The nickel may include first and second amounts of particles. A sum of the particle amounts is a total amount of nickel or less. The first amount is between 5 at % and 60 at % of the total amount of nickel. The second amount is between 10 at % and 95 at % of the total amount of nickel. The particles of the first amount have a first size distribution, the particles of the second amount have a second size distribution, 30% to 70% of the first amount have a particle size in a range of about 5 μm around a particle size the highest number of particles have according to the first size distribution, and 30% to 70% of the second amount have a particle size in a range of about 5 μm around a particle size the highest number of particles have according to the second size distribution.