A flux includes: at least one liquid solvent that has one or more hydroxy groups and is liquid at ordinary temperature; and at least two solid solvents that respectively have one or more hydroxy groups and are solid at normal temperature, in which the content of each of the solid solvents is less than 40 mass % based on the total content of the liquid solvent and the solid solvents.

Utilizing a hydrogen compound source as an arc stabilizer is counter-intuitive to standard formulation design practices which often strive to limit or eliminate hydrogen from the welding arc and weld pool. The present disclosure is directed to a tubular metal-cored welding electrode that comprises a metallic sheath disposed around a granular metal core in which the granular metal core comprises an alginate arc stabilizer (as a hydrogen compound source) configured to release hydrogen near a surface of a workpiece during welding. The tubular metal-cored welding electrode may further comprise primary de-oxidizers such as manganese and silicon. In certain embodiments, the amount of manganese in the tubular metal-cored welding electrode may be minimized or eliminated. The tubular metal-cored welding electrode may also comprise nickel or titanium.

The invention described herein pertains generally to boric acid free flux composition in which boric acid and/or borax is substituted with a molar equivalent amount of potassium tetraborate tetrahydrate. In some embodiments, a phthalocyanine pigment is used to effect a color change at activation temperature.

Provided is a flux that allows soldering to be performed without requiring a step of removing a Cu-OSP film even with a Cu-OSP processed substrate. This flux containing rosin, an organic acid, a benzimidazole-based compound, and a solvent is characterized in that 30% by mass or more and 70% by mass or less of the rosin, 1% by mass or more and 10% by mass or less of the organic acid, 0.2% by mass or more and 10% by mass or less of the benzimidazole-based compound, and 20% by mass or more and 60% by mass or less of the solvent, wherein the benzimidazole-based compound is composed of at least one of 2-alkylbenzimidazole and a salt of 2-alkylbenzimidazole hydrohalide.

The present invention is a composite welding wire for fusion welding of components manufactured of superalloys. The composite weld wire includes a surface layer applied to the core wire in a green condition and bonded to the core wire. The surface layer includes alloying elements selected from among B and Si, the total bulk content of B and Si representing 0.5 to 4.0 wt. % of the composite welding wire. The boron and silicon alloying elements reduce the melting temperature and increase the solidification range of the weld pool, minimizing the incidence of weld cracking compared to welding without the coating. The green condition surface layer is comprised of more than 80 wt. % of the bulk content of the composite welding wire selected from the combination of B and Si.

A composition comprised of manganese or a compound thereof, a cellulosic material, a carbonate, titanium, and one or more from: an alloying agent, a slag-forming agent, an arc-stabilizing agent, wherein the cellulosic material is present at a concentration of 1% to 40%, by weight, and wherein the manganese or a compound thereof is present at a concentration of 0.5 to 5%, by weight, is disclosed. A method of depositing a weld metal on a surface is further disclosed.

A flux according to the present invention includes a phosphine oxide. It is thereby possible to provide a flux capable of improving solder wettability, a resin flux cored solder including the flux, and a solder paste including the flux.

The present invention relates to a metal paste including: a first metal powder including nickel (Ni); a second metal powder including at least one selected from the group consisting of tin (Sn), zinc (Zn), bismuth (Bi), and indium (In); and a dispersing agent, and to a thermoelectric module which adopts a bonding technique using the metal paste.

Provided is a flux containing not less than 11.0 degrees and not more than 17.0 of a contact angle between the flux and a resist substrate on which the flux has been printed to have 1.0 mm of a diameter and 0.15 mm of a thickness when heating the resist substrate at 150 degrees C. for 30 seconds and cooling the resist substrate to a room temperature. The flux also contains more than zero seconds and not more than 2.0 seconds of a zero-cross time when heating a Cu plate at 150 degrees C. in a thermostat oven for 12 hours, applying the flux onto the baked Cu plate, and dipping the baked Cu plate onto which the flux is applied into a Sn-3.0Ag-0.5Cu alloy at a dipping speed of 15 mm/sec and by 2.0 mm of a dipped depth.

Provided is a flux that is able to suppress any solder bridges even when it is applied to the narrow pitched electrodes such that the bridge occurs when using the past flux. The flux is characterized by containing 15% by mass or more and 35% by mass or less of polyoxyalkylene ethylenediamine, 2% by mass or more and 15% by mass or less of an organic acid, 10% by mass or more and 30% by mass or less of a base material, 3% by mass or more and 30% by mass or less of an amine and 20% by mass or more and 40% by mass or less of a solvent.