A flux for soldering includes a base resin, a solvent, and an activating agent. The base resin contains a rosin. An amount of the rosin to be incorporated is from 0% by weight to 30% by weight with respect to a total amount of the base resin. The activating agent includes a compound having a plurality of carboxyl groups on a cyclohexyl structure represented by a general formula (1). ##STR00001##
X is (a) one or more carboxyl groups, or (b) one or more carboxyl groups and at least one selected from a hydrogen atom, chloro group, bromo group, alkyl group, and cyclohexyl group. A position of the X is not limited. A number of the X is one or more. The X may have either one of the (a) and (b) alone, or a plurality of the (a) and (b) in combination.

The invention has an object to provide a flux for rapid heating method used in the rapid heating method such as a laser reflow, the flux being able to suppress any scattering of the solder alloy, and a solder paste for the rapid heating method. The flux contains rosin, a glycol-ether-based solvent, an organic acid, and a thixotropic agent, wherein the solvent is a glycol-based solvent having a low boiling point that is not more than 200 degrees C., content of the solvent having the low boiling point is not less than 20 weight % to not more than 40 weight %. The solder paste is obtained by mixing this flux with solder alloy powder. When the solvent having a high boiling point that is more than 200 degrees C. is further contained, the solvent having the low boiling point of not less than 60 weight % in relation to the whole of the solvent is contained.

The invention has an object to provide a flux for rapid heating method used in the rapid heating method such as a laser reflow, the flux being able to suppress any scattering of the solder alloy, and a solder paste for the rapid heating method. The flux contains rosin, a glycol-ether-based solvent, an organic acid, and a thixotropic agent, wherein the solvent is a glycol-based solvent having a low boiling point that is not more than 200 degrees C., content of the solvent having the low boiling point is not less than 20 weight % to not more than 40 weight %. The solder paste is obtained by mixing this flux with solder alloy powder. When the solvent having a high boiling point that is more than 200 degrees C. is further contained, the solvent having the low boiling point of not less than 60 weight % in relation to the whole of the solvent is contained.

A method of using a tungsten inert gas (TIG) welding flux for super duplex stainless steel (SDSS) is used to solve the problems of low weld depth/width ratio, low corrosion resistance, and arc blow existing in the conventional TIG welding flux for duplex stainless steel. The TIG welding flux for SDSS includes 20-30 wt % of silicon dioxide (SiO.sub.2), 20-25 wt % of titanium dioxide (TiO.sub.2), 15-20 wt % of vanadium dioxide (VO.sub.2), 10-15 wt % of molybdenum trioxide (MoO.sub.3), 10-15 wt % of zirconium diboride (ZrB.sub.2), 5-10 wt % of aluminum nitride (AlN), 5-10 wt % of manganese carbonate (MnCO.sub.3) and 5-10 wt % of nickel carbonate (NiCO.sub.3).

A method of using a tungsten inert gas (TIG) welding flux for super duplex stainless steel (SDSS) is used to solve the problems of low weld depth/width ratio, low corrosion resistance, and arc blow existing in the conventional TIG welding flux for duplex stainless steel. The TIG welding flux for SDSS includes 20-30 wt % of silicon dioxide (SiO.sub.2), 20-25 wt % of titanium dioxide (TiO.sub.2), 15-20 wt % of vanadium dioxide (VO.sub.2), 10-15 wt % of molybdenum trioxide (MoO.sub.3), 10-15 wt % of zirconium diboride (ZrB.sub.2), 5-10 wt % of aluminum nitride (AlN), 5-10 wt % of manganese carbonate (MnCO.sub.3) and 5-10 wt % of nickel carbonate (NiCO.sub.3).

Improved steel welds, article for making the same, and methods of making the same are provided. The present disclosure provides advantageous erosion, corrosion and/or cracking resistant weld metal. More particularly, the present disclosure provides high manganese (Mn) weld metal compositions having enhanced erosion, corrosion and/or cracking resistance, articles for the production of the high manganese weld metal compositions having enhanced erosion, corrosion, and/or cracking resistance, and methods for fabricating high manganese weld metal compositions having enhanced erosion, corrosion and/or cracking resistance.

An adhesive for a semiconductor, comprising an epoxy resin, a curing agent, and a compound having a group represented by the following formula (1): ##STR00001##
wherein R.sup.1 represents an electron-donating group.

An adhesive for a semiconductor, comprising an epoxy resin, a curing agent, and a compound having a group represented by the following formula (1): ##STR00001##
wherein R.sup.1 represents an electron-donating group.

Rosin-free thermosetting flux formulations for enhancing the mechanical reliability of solder joints. In accordance with one or more aspects, a solder paste as shown and described herein imparts improved or enhanced solder joint properties relating to at least one of drop shock, thermal cycling, thermal shock, shear strength, flexural strength performance, and/or other thermal-mechanical performance attributes.

Rosin-free thermosetting flux formulations for enhancing the mechanical reliability of solder joints. In accordance with one or more aspects, a solder paste as shown and described herein imparts improved or enhanced solder joint properties relating to at least one of drop shock, thermal cycling, thermal shock, shear strength, flexural strength performance, and/or other thermal-mechanical performance attributes.