B23K35/362

Solder Paste and Solder Joint

Provided is a flux for a solder paste that can prevent peeling from electrode, which is seen in a component, a thickness of which is reduced, such a semiconductor package like BGA. Rosin, a glycol-ether-based solvent, an organic acid, a thixotropic agent, a halogen compound, and an imidazole compound are contained and the halogen compound is either an amine hydrohalide or an organohalogen compound or a combination of them. Their addition amounts stay within a range satisfying a formula of 2.5-X-0.625Y≧0 in which the addition amount of the amine hydrohalide is indicated by X (weight %) and the addition amount of the organohalogen compound is indicated by Y (weight %). However, the addition amount X of the amine hydrohalide and the addition amount Y of the organohalogen compound are such that 0≦X≦2.5 and 0≦Y≦4, excluding a range of 0≦X<0.02 and 0≦Y<0.1.

Solder Paste and Solder Joint

Provided is a flux for a solder paste that can prevent peeling from electrode, which is seen in a component, a thickness of which is reduced, such a semiconductor package like BGA. Rosin, a glycol-ether-based solvent, an organic acid, a thixotropic agent, a halogen compound, and an imidazole compound are contained and the halogen compound is either an amine hydrohalide or an organohalogen compound or a combination of them. Their addition amounts stay within a range satisfying a formula of 2.5-X-0.625Y≧0 in which the addition amount of the amine hydrohalide is indicated by X (weight %) and the addition amount of the organohalogen compound is indicated by Y (weight %). However, the addition amount X of the amine hydrohalide and the addition amount Y of the organohalogen compound are such that 0≦X≦2.5 and 0≦Y≦4, excluding a range of 0≦X<0.02 and 0≦Y<0.1.

Welding electrode

An electrode (10) is presented including a sheath (14) formed of a ductile material, an outer coating (16) including a flux material, and a core (12) including at least one of flux material and alloying material. The ductile material may be an extrudable subset of elements of a desired superalloy material and the alloying material may include elements that complement the ductile material to form a desired superalloy material when the electrode is melted. The outer coating may be formed of a flexible bonding material or it may be segmented (18, 20) to facilitate bending the electrode onto a spool. Any hygroscopic material of the electrode may be included in the core to protect it from exposure to atmospheric moisture.

Welding electrode

An electrode (10) is presented including a sheath (14) formed of a ductile material, an outer coating (16) including a flux material, and a core (12) including at least one of flux material and alloying material. The ductile material may be an extrudable subset of elements of a desired superalloy material and the alloying material may include elements that complement the ductile material to form a desired superalloy material when the electrode is melted. The outer coating may be formed of a flexible bonding material or it may be segmented (18, 20) to facilitate bending the electrode onto a spool. Any hygroscopic material of the electrode may be included in the core to protect it from exposure to atmospheric moisture.

SOLDER COMPOSITION AND ELECTRONIC BOARD

A solder composition of the invention includes: a flux composition containing a component (A) in a form of a rosin-based resin, a component (B) in a form of an activator, a component (C) in a form of a solvent and a component (D) in a form of a thixotropic agent; and a component (E) in a form of a solder powder. The component (C) in a form of the solvent contains a component (C1) in a form of a isobornyl cyclohexanol and a component (C2) in a form of a solvent whose viscosity at 20 degrees C. is 10 mPa.Math.s or less and whose boiling point ranges from 220 degrees C. to 245 degrees C.

SOLDER COMPOSITION AND ELECTRONIC BOARD

A solder composition of the invention includes: a flux composition containing a component (A) in a form of a rosin-based resin, a component (B) in a form of an activator, a component (C) in a form of a solvent and a component (D) in a form of a thixotropic agent; and a component (E) in a form of a solder powder. The component (C) in a form of the solvent contains a component (C1) in a form of a isobornyl cyclohexanol and a component (C2) in a form of a solvent whose viscosity at 20 degrees C. is 10 mPa.Math.s or less and whose boiling point ranges from 220 degrees C. to 245 degrees C.

Flux recovery device and soldering device

A flux recovery device that recovers a flux component from a gaseous mixture. The flux recovery device includes a first water spray unit that sprays water into a gaseous mixture containing the flux component, a separation unit that includes an introduction port for introducing the gaseous mixture into which water is sprayed from the first water spray unit, and a second water spray unit that forms a precipitation flow inside of the separation unit. The separation unit uses a swirling flow to separate the flux component from the gaseous mixture. A condensation unit cools water vapor generated in the separation unit to change the water vapor to water droplets, thereby removing the water vapor. Water vapor generated in a separation unit is cooled by a condensation unit, recovered as water droplets, and reused.

Flux recovery device and soldering device

A flux recovery device that recovers a flux component from a gaseous mixture. The flux recovery device includes a first water spray unit that sprays water into a gaseous mixture containing the flux component, a separation unit that includes an introduction port for introducing the gaseous mixture into which water is sprayed from the first water spray unit, and a second water spray unit that forms a precipitation flow inside of the separation unit. The separation unit uses a swirling flow to separate the flux component from the gaseous mixture. A condensation unit cools water vapor generated in the separation unit to change the water vapor to water droplets, thereby removing the water vapor. Water vapor generated in a separation unit is cooled by a condensation unit, recovered as water droplets, and reused.

FLUX-CORED WIRE FOR ARC WELDING OF DUPLEX STAINLESS STEEL AND WELD METAL

A flux-cored wire for are welding of a duplex stainless steel includes a stainless-steel sheath filled with a flux and contains, with respect to the total mass of the wire, predetermined amounts of Cr, Ni, Mo, N, Mn, and Si, in which letting a Ti alloy content in terms of Ti be [Ti] and letting an Al alloy content in terms of Al be [Al], [Ti] and [Al] are predetermined values, and in which parameter A expressed as A=[Ti]+2×[Al] satisfies a predetermined value, and the balance is composed of Fe, a slag-forming component, and incidental impurities.

FLUX-CORED WIRE FOR ARC WELDING OF DUPLEX STAINLESS STEEL AND WELD METAL

A flux-cored wire for are welding of a duplex stainless steel includes a stainless-steel sheath filled with a flux and contains, with respect to the total mass of the wire, predetermined amounts of Cr, Ni, Mo, N, Mn, and Si, in which letting a Ti alloy content in terms of Ti be [Ti] and letting an Al alloy content in terms of Al be [Al], [Ti] and [Al] are predetermined values, and in which parameter A expressed as A=[Ti]+2×[Al] satisfies a predetermined value, and the balance is composed of Fe, a slag-forming component, and incidental impurities.