Patent classifications
B24B21/08
Abrasive Belt Grip
An abrasive belt grip is an apparatus that is used to apply a finish to a knife blade. The apparatus includes a casing, a carbide plate, a drive roller, an idle roller, a heat-sinking saddle, a cooling system, and a serpentine belt. The casing is used as a structural base to mount all of the aforementioned components. The conveying movement of the serpentine belt allows the apparatus to apply a finish onto the knife blade. The conveying movement of the serpentine belt is driven by the rotation of the drive roller and is stabilized by the rotation of the idle roller. The carbide plate provides a flat backing for the serpentine belt as a knife blade is pressed against the serpentine belt. The heat-sinking saddle draws heat away from the serpentine belt and the carbide plate, while the cooling system exhausts that heat out of the casing.
GRINDING DEVICE FOR CREATING SURFACE STRUCTURES
A grinding device has at least one endless grinding belt guided over deflection elements in at least one direction of circulation (P3) and a press-on arrangement which is configured and arranged such that it exerts a force from the inside on the grinding belt in a press-on area. The press-on arrangement comprises a base body and at least one press-on element arranged on the side of the base body facing the inner side of the grinding belt. The at least one press-on element is connected to the base body via a Velcro or adhesive connection. The grinding device can be a component of a belt grinding machine.
GRINDING DEVICE FOR CREATING SURFACE STRUCTURES
A grinding device has at least one endless grinding belt guided over deflection elements in at least one direction of circulation (P3) and a press-on arrangement which is configured and arranged such that it exerts a force from the inside on the grinding belt in a press-on area. The press-on arrangement comprises a base body and at least one press-on element arranged on the side of the base body facing the inner side of the grinding belt. The at least one press-on element is connected to the base body via a Velcro or adhesive connection. The grinding device can be a component of a belt grinding machine.
POLISHING APPARATUS AND PRESSING PAD FOR PRESSING POLISHING TOOL
A polishing apparatus which can keep a width of a polishing tool constant when a peripheral portion of a substrate is polished by the polishing tool is disclosed. The polishing apparatus includes a substrate holder 3 configured to hold a substrate W and to rotate the substrate W and a pressing pad 50 configured to press a polishing tool 23 against a peripheral portion of the substrate W held by the substrate holder 3. The pressing pad 50 includes an elastic member 55 having a pressing surface 55a configured to press the polishing tool 23 against the peripheral portion of the substrate W and a support member 56 configured to support the elastic member 55. The support member 56 has a recess 57 formed in a front surface 56a of the support member 56, the elastic member 55 being capable of entering the recess 57.
Grinding or Sanding Machine
The present invention comprises a Grinding or sanding machine for grinding or sanding a surface of a workpiece (8), wherein the grinding or sanding machine has at least one transportation device for transporting a workpiece (8) in a transportation direction; at least one revolving grinding or sanding belt (2); and at least one pressure beam (12) for exerting a pressure in the direction of the transportation device on the grinding or sanding belt (2),
wherein a plate (14) which is mounted so as to be movable in a plane that is perpendicular to the direction of the exertable pressure is disposed between the grinding or sanding belt (2) and the pressure beam (12).
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
A method and an apparatus for processing a peripheral portion of a substrate, such as a wafer, are disclosed. The substrate processing method includes: holding a substrate on a substrate stage; rotating the substrate stage and the substrate about an axis of the substrate stage; directing a laser beam to an edge portion of the rotating substrate to form an annular crack in the substrate; and pressing a polishing tool against the edge portion of the rotating substrate to form a stepped recess in a peripheral portion of the substrate.
Sanding pad lining carrier with recesses
The present invention relates to lining carrier for a sanding pad lining, in particular for use with a sanding pad for pressing sanding surfaces against workplaces in segment-belt and wide-belt sanding machines. Here, the lining carrier has at least one recess, in particular a groove.
Sanding pad lining carrier with recesses
The present invention relates to lining carrier for a sanding pad lining, in particular for use with a sanding pad for pressing sanding surfaces against workplaces in segment-belt and wide-belt sanding machines. Here, the lining carrier has at least one recess, in particular a groove.
POLISHING APPARATUS
A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.
POLISHING APPARATUS
A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.