The present invention relates to a curable composition containing (A) a side chain-containing cyclic molecule in which three or more side chains each having a polymerizable functional group introduced at a terminal are introduced ((A) cyclic polyfunctional monomer), and (B) a polymerizable monomer having a polymerizable functional group polymerizable with the side chain-containing cyclic molecule ((B) another polymerizable monomer). The present invention provides a curable composition from which a cured article having high abrasion resistance and enabling exhibition of excellent mechanical properties and photochromic properties is obtained. In particular, the present invention can provide a curable composition from which a cured article suitable for use as a polishing pad or a photochromic spectacle lens can be obtained.

A polishing pad contains: a polishing layer having a polishing surface for polishing a workpiece; and a cushion layer disposed on the side of the polishing layer opposite from the polishing surface. With regard to the ratio (tanδ) of the storage elastic modulus E′ to the loss elastic modulus E″ of the whole polishing pad, as obtained through dynamic viscoelasticity measurement using frequency dispersion (25° C.) in a bending mode, the ratio of the maximum value of tanδ measured at 100-1000 rad/s (tanδ.sub.max100-100) to the maximum value of tanδ measured at 1 to 10 rad/s (tanδ.sub.max1-10) is 0.75 to 1.30.

A polishing pad contains: a polishing layer having a polishing surface for polishing a workpiece; and a cushion layer disposed on the side of the polishing layer opposite from the polishing surface. With regard to the ratio (tanδ) of the storage elastic modulus E′ to the loss elastic modulus E″ of the whole polishing pad, as obtained through dynamic viscoelasticity measurement using frequency dispersion (25° C.) in a bending mode, the ratio of the maximum value of tanδ measured at 100-1000 rad/s (tanδ.sub.max100-100) to the maximum value of tanδ measured at 1 to 10 rad/s (tanδ.sub.max1-10) is 0.75 to 1.30.

Embodiments herein generally relate to polishing pads and method of forming polishing pads. In one embodiment, a polishing pad having a polishing surface that is configured to polish a surface of a substrate is provided. The polishing pad includes a polishing layer. At least a portion of the polishing layer comprises a continuous phase of polishing material featuring a plurality of first regions having a first pore-feature density and a plurality of second regions having a second pore-feature density that is different from the first pore-feature density. The plurality of first regions are distributed in a pattern in an X-Y plane of the polishing pad in a side-by-side arrangement with the plurality of second regions and individual portions or ones of the plurality of first regions are interposed between individual portions or ones of the plurality of second regions.

Embodiments herein generally relate to polishing pads and method of forming polishing pads. In one embodiment, a polishing pad having a polishing surface that is configured to polish a surface of a substrate is provided. The polishing pad includes a polishing layer. At least a portion of the polishing layer comprises a continuous phase of polishing material featuring a plurality of first regions having a first pore-feature density and a plurality of second regions having a second pore-feature density that is different from the first pore-feature density. The plurality of first regions are distributed in a pattern in an X-Y plane of the polishing pad in a side-by-side arrangement with the plurality of second regions and individual portions or ones of the plurality of first regions are interposed between individual portions or ones of the plurality of second regions.

CMP polishing pads or layers made from a polyurethane reaction product of a reaction mixture comprising (i) a liquid aromatic isocyanate component comprising one or more aromatic diisocyanates or a linear aromatic isocyanate-terminated urethane prepolymer, and (ii) a liquid polyol component comprising a) one or more polymeric polyols, b) from 12 to 40 wt. %, based on the total weight of the liquid polyol component, of a curative mixture of one or more small chain difunctional polyols having from 2 to 9 carbon atoms, a liquid aromatic diamine, wherein the mole ratio of the total moles of hydroxyl and amino moieties in the liquid polyol, small chain difunctional polyols and liquid aromatic diamine to mole of isocyanate in the aromatic diisocyanates or linear aromatic isocyanate-terminated urethane prepolymer ranges from 1.0:1.0 to 1.15:1.0. The polishing layer is capable of forming a total texture depth, as measured by Sdr, a parameter defined by the ISO 25178 standard, upon treatment by a surface conditioning disk, in the range of from 0 to 0.4. Also disclosed is a chemical mechanical polishing method using the polishing pad together with a ceria abrasive slurry.

CMP polishing pads or layers made from a polyurethane reaction product of a reaction mixture comprising (i) a liquid aromatic isocyanate component comprising one or more aromatic diisocyanates or a linear aromatic isocyanate-terminated urethane prepolymer, and (ii) a liquid polyol component comprising a) one or more polymeric polyols, b) from 12 to 40 wt. %, based on the total weight of the liquid polyol component, of a curative mixture of one or more small chain difunctional polyols having from 2 to 9 carbon atoms, a liquid aromatic diamine, wherein the mole ratio of the total moles of hydroxyl and amino moieties in the liquid polyol, small chain difunctional polyols and liquid aromatic diamine to mole of isocyanate in the aromatic diisocyanates or linear aromatic isocyanate-terminated urethane prepolymer ranges from 1.0:1.0 to 1.15:1.0. The polishing layer is capable of forming a total texture depth, as measured by Sdr, a parameter defined by the ISO 25178 standard, upon treatment by a surface conditioning disk, in the range of from 0 to 0.4. Also disclosed is a chemical mechanical polishing method using the polishing pad together with a ceria abrasive slurry.

CMP polishing pads or layers made from a polyurethane reaction product of a reaction mixture comprising (i) a liquid aromatic isocyanate component comprising one or more aromatic diisocyanates or a linear aromatic isocyanate-terminated urethane prepolymer, and (ii) a liquid polyol component comprising a) one or more polymeric polyols, b) from 12 to 40 wt. %, based on the total weight of the liquid polyol component, of a curative mixture of one or more small chain difunctional polyols having from 2 to 9 carbon atoms, a liquid aromatic diamine, wherein the mole ratio of the total moles of hydroxyl and amino moieties in the liquid polyol, small chain difunctional polyols and liquid aromatic diamine to mole of isocyanate in the aromatic diisocyanates or linear aromatic isocyanate-terminated urethane prepolymer ranges from 1.0:1.0 to 1.15:1.0. The polishing layer is capable of forming a total texture depth, as measured by Sdr, a parameter defined by the ISO 25178 standard, upon treatment by a surface conditioning disk, in the range of from 0 to 0.4.

CMP polishing pads or layers made from a polyurethane reaction product of a reaction mixture comprising (i) a liquid aromatic isocyanate component comprising one or more aromatic diisocyanates or a linear aromatic isocyanate-terminated urethane prepolymer, and (ii) a liquid polyol component comprising a) one or more polymeric polyols, b) from 12 to 40 wt. %, based on the total weight of the liquid polyol component, of a curative mixture of one or more small chain difunctional polyols having from 2 to 9 carbon atoms, a liquid aromatic diamine, wherein the mole ratio of the total moles of hydroxyl and amino moieties in the liquid polyol, small chain difunctional polyols and liquid aromatic diamine to mole of isocyanate in the aromatic diisocyanates or linear aromatic isocyanate-terminated urethane prepolymer ranges from 1.0:1.0 to 1.15:1.0. The polishing layer is capable of forming a total texture depth, as measured by Sdr, a parameter defined by the ISO 25178 standard, upon treatment by a surface conditioning disk, in the range of from 0 to 0.4.

Embodiments of the disclosure include a polishing pad for planarizing a surface of a substrate during a polishing process. The polishing pad includes a base layer, comprising a first material composition, and a polishing layer disposed over the base layer. The polishing layer includes a second material composition that is exposed at a polishing surface of the polishing pad, wherein the polishing surface is configured to contact the surface of the substrate during the polishing process. The second material composition includes a polishing layer material having a hardness that is greater than 50 on a Shore D scale, a yield point strength, a yield point strength strain, a break point strength, and an elongation at break point strain, wherein a magnitude of a difference between the elongation at break point strain and the yield point strength strain is greater than the magnitude of yield point strength strain when measured at room temperature.