Embodiments of the disclosure include a polishing pad for planarizing a surface of a substrate during a polishing process. The polishing pad includes a base layer, comprising a first material composition, and a polishing layer disposed over the base layer. The polishing layer includes a second material composition that is exposed at a polishing surface of the polishing pad, wherein the polishing surface is configured to contact the surface of the substrate during the polishing process. The second material composition includes a polishing layer material having a hardness that is greater than 50 on a Shore D scale, a yield point strength, a yield point strength strain, a break point strength, and an elongation at break point strain, wherein a magnitude of a difference between the elongation at break point strain and the yield point strength strain is greater than the magnitude of yield point strength strain when measured at room temperature.

A method of using a polishing pad includes applying a slurry to a first location on the polishing pad. The method further includes rotating the polishing pad. The method further includes spreading the slurry across a first region of the polishing pad at a first rate, wherein the first region includes a plurality of first grooves. The method further includes spreading the slurry across a second region, surrounding the first region of the polishing pad at a second rate different from the first rate, wherein the second region includes a plurality of second grooves. The method further includes spreading the slurry across a third region, surrounding the second region of the polishing pad at a third rate less than the first rate and the second rate, wherein the third region includes a plurality of third grooves.

A method of using a polishing pad includes applying a slurry to a first location on the polishing pad. The method further includes rotating the polishing pad. The method further includes spreading the slurry across a first region of the polishing pad at a first rate, wherein the first region includes a plurality of first grooves. The method further includes spreading the slurry across a second region, surrounding the first region of the polishing pad at a second rate different from the first rate, wherein the second region includes a plurality of second grooves. The method further includes spreading the slurry across a third region, surrounding the second region of the polishing pad at a third rate less than the first rate and the second rate, wherein the third region includes a plurality of third grooves.

The present invention relates to a polishing pad including a polishing layer and a cushion layer, wherein a ratio E′.sub.B40/E′.sub.C40 of a storage elastic modulus at 40° C. in dynamic viscoelasticity measurement performed under a bending mode condition with a dry state, a frequency of 10 rad/s, and 20 to 100° C., E′.sub.B40, to a storage elastic modulus at 40° C. in dynamic viscoelasticity measurement performed under a compression mode condition with a dry state, a frequency of 10 rad/s, and 20 to 100° C., E′.sub.C40, is 3.0 or more and 15.0 or less, and a loss factor tan δ in the dynamic viscoelasticity measurement performed under the bending mode condition is 0.10 or more and 0.30 or less in a range of 40° C. or more and 70° C. or less.

The present invention relates to a polishing pad including a polishing layer and a cushion layer, wherein a ratio E′.sub.B40/E′.sub.C40 of a storage elastic modulus at 40° C. in dynamic viscoelasticity measurement performed under a bending mode condition with a dry state, a frequency of 10 rad/s, and 20 to 100° C., E′.sub.B40, to a storage elastic modulus at 40° C. in dynamic viscoelasticity measurement performed under a compression mode condition with a dry state, a frequency of 10 rad/s, and 20 to 100° C., E′.sub.C40, is 3.0 or more and 15.0 or less, and a loss factor tan δ in the dynamic viscoelasticity measurement performed under the bending mode condition is 0.10 or more and 0.30 or less in a range of 40° C. or more and 70° C. or less.

A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.

A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.

In one implementation, a method of forming a porous polishing pad is provided. The method comprises depositing a plurality of composite layers with a 3D printer to reach a target thickness. Depositing the plurality of composite layers comprises dispensing one or more droplets of a curable resin precursor composition onto a support. Depositing the plurality of composite layers further comprises dispensing one or more droplets of a porosity-forming composition onto the support, wherein at least one component of the porosity-forming composition is removable to form the pores in the porous polishing pad.

The present invention discloses a polishing pad comprising a laminate composed of a polishing layer, an adhesive layer, and a cushion layer, wherein the cushion layer has a water absorption rate of 100% or less, and a process for manufacturing the polishing pad.

The present invention discloses a polishing pad comprising a laminate composed of a polishing layer, an adhesive layer, and a cushion layer, wherein the cushion layer has a water absorption rate of 100% or less, and a process for manufacturing the polishing pad.