A method for overmolding at least one line (40) comprises the steps: receiving the at least one line (40) in an opening (14) of a sealing element (10), wherein the opening (34) of the sealing element (10) is substantially complementary in shape to a peripheral geometry of the at least one line (40); mounting the sealing element (10) on a mold (30); overmolding the at least one line (40) received in the sealing element in a region (42) that is adjacent to the sealing element (10) and delimited by the sealing element (10); and removing from the mold (30) the sealing element (10) and the at least one line (40) received therein and overmolded in a region.

A method includes applying a mold chase to a fluid ejection die to at least partially define at least one cavity. The mold chase includes a feature to contact a fluid ejection portion of the fluid ejection die, and at least one structure separate from the feature to contact a first end portion adjacent a first end of the fluid ejection die. The method includes filling the at least one cavity with a mold compound to produce a molded carrier for the fluid ejection die.

A mold tool 1 is described for molding a semiconductor power module having an electrical contact pin 2 which includes an electrical contact portion 3 for contacting a substrate 4 with another electrical component. The pin 2 comprises a protruding portion 5 being a top-sided pin connector. The mold tool 1 includes a first 6 and a second mold die which, when brought together for molding, form a cavity to be filled with a mold compound for encapsulating electrical components of the semiconductor power module, and a recess 7 in the first die 6 which communicates with the cavity within the second die. The recess 7 is filled with a cushion-like soft material 8 into which the top-sided pin connector is pushed thereinto and completely surrounded by the soft material so that a sealing means is formed that prevents any contamination of the electrical contact portion 3 of the pin 2 by the molding compound introduced into the cavity. Furthermore, a method of manufacturing such a semiconductor power module is described.

A method for forming a composite component, comprising: locating a rigid composite element comprising a matrix interspersed with long fibre reinforcement in a mould that is shaped to define a cavity about the rigid element; loading a material comprising a matrix precursor interspersed with short fibre reinforcement into the cavity; and curing the matrix precursor.

A passive horn integrally formed using thermoplastic vulcanized rubber includes a first outer casing, a second outer casing, an inner casing and an iron piece. The first outer casing includes a sealing ring, a folding ring and a vibrating membrane, and the sealing ring, the folding ring and the vibrating membrane are integrally injection molded into the first outer casing. A groove is disposed in the second outer casing, and the first outer casing is disposed in the groove. The back surface of the vibrating membrane is provided with a casing groove sequentially embedded with the inner casing and the iron piece. Furthermore, a preparation method of a passive horn integrally formed using thermoplastic vulcanized rubber, which, under the condition of integrated injection molding, may improve the yield rate, ensure product quality, save assembly time and labor cost, and improve production efficiency.

A manufacturing equipment, for manufacturing a molded circuit board assembly of a camera module, includes an upper mould, a lower mould, a mould fixing arrangement, and a temperature controlling arrangement, wherein the mould fixing arrangement controls opening and closing of the upper mould and the lower mound. When a substrate board is placed between the upper mould and the lower mound, a molding cavity is further formed between the upper mould and the lower mound, wherein in the molding cavity, a supporting frame forming groove is formed for forming the module support, and a light window forming element is used for forming a light window. The temperature controlling arrangement provides a molding temperature, the module supporting frame is integrally molded on the substrate board to form the molded circuit board assembly.

A method of manufacturing a sensor device comprising: configuring a moulding support structure and a packaging mould so as to provide predetermined pathways to accommodate a moulding compound, the moulding support structure defining a first notional volume adjacent a second notional volume. An elongate sensor element and the moulding support structure are configured so that the moulding support structure fixedly carries the elongate sensor element and the elongate sensor element resides substantially in the first notional volume and extends towards the second notional volume, the elongate sensor element having an electrical contact electrically coupled to another electrical contact disposed within the second notional volume. The moulding support structure carrying (102) the elongate sensor element is disposed within the packaging mould (106). The moulding compound is then introduced (110) into the packaging mould during a predetermined period of time (112) so that the moulding compound fills the predetermined pathways, thereby filling the second notional volume and surrounding the elongate sensor element within the second notional volume without contacting the elongate sensor element.

An insert molding component includes a primary molding section having a concave portion formed in one surface thereof, the concave portion including stepped lower and upper concave portions, an insert component disposed on a bottom surface of the lower concave portion, a heat-insulating component disposed in the upper concave portion above an opening of the lower concave portion in which the insert component is disposed, and a secondary molding section disposed in contact with the one surface of the primary molding section.

A base-material/gasket unit mold which can reduce molding failure occurrence is provided. The mold includes a first half mold including a base material holding portion arranged on a first parting surface to hold a base material, and a second half mold having a second parting surface and used together with the first half mold to close and open the mold. The second half mold includes a gasket cavity defined on the second parting surface side to form a gasket main body on a surface of the base material, an isolated rubber cavity forming an isolated rubber portion isolated from the gasket main body on the surface of the base material, and a mold-pressing portion arranged around the isolated rubber cavity to press the base material when the mold is closed and having a recessed part defined on a press surface side to reduce deformation of the base material.

A connector (1) includes first terminals (3A), a first resin core (2A), second connector terminals (3B), second resin cores (2B) and an outer resin part (4). Base ends (312) of inner end parts (31A) of the first terminals (3A) face a second exposed surface (21B) of the second resin core (2B) with a clearance (S) formed between the base end parts (312) and the second exposed surface (21B). Tips (311) of the inner end parts (31A) of the first terminals (3A) are formed with bent tips (311A) projecting away from the second exposed surface (21B). The second exposed surface (21B) has a size to entirely surround the inner end parts (31A) of the first terminals (3A).