A method for manufacturing a resin pipe joint with a joint body includes the following steps. Preparing a mold and a supply device configured to supply molten resin. The mold includes a first mold for an outer shape of the joint body and a second mold for an inner shape of the joint body. Combining the second mold with the first mold to form a cavity, into which the molten resin is injectable, inside the mold. Supplying the molten resin to the cavity in the mold. Solidifying the molten resin in the cavity after stop of the supply of the molten resin from the supply device. The second mold has a gap that connects the cavity to a discharge space outside the cavity and allows gas to flow.

The disclosure includes a laminate tool and a process for producing laminate tooling with functional features between adjacent or non-adjacent laminate segments to provide mechanical leverage to demold a part, space for moving tool segments that allow features to be molded against the line of draw (eliminate die-locked conditions), and passage way for gas to travel.

A method includes placing a package structure into a mold chase, with top surfaces of device dies in the package structure contacting a release film in the mold chase. A molding compound is injected into an inner space of the mold chase through an injection port, with the injection port on a side of the mold chase. During the injection of the molding compound, a venting step is performed through a first venting port and a second venting port of the mold chase. The first venting port has a first flow rate, and the second port has a second flow rate different from the first flow rate.

A method includes placing a package structure into a mold chase, with top surfaces of device dies in the package structure contacting a release film in the mold chase. A molding compound is injected into an inner space of the mold chase through an injection port, with the injection port on a side of the mold chase. During the injection of the molding compound, a venting step is performed through a first venting port and a second venting port of the mold chase. The first venting port has a first flow rate, and the second port has a second flow rate different from the first flow rate.

A method of manufacturing an electronic device includes a step of housing an electronic component in a metal mold, then filling the metal mold with a molding material, wherein the metal mold includes a cavity having a rectangular planar shape and housing the electronic component, and a dummy cavity communicated with a side surface having the smallest gap with the electronic component out of four side surfaces included in the cavity, and in the step of filling the metal mold with the molding material, the molding material inflows into the cavity, and the molding material in the cavity inflows into the dummy cavity.

Golf ball methods and molds for quickly and efficiently eliminating air/gas from within a mold during golf ball manufacture and the improved golf balls resulting therefrom.

Golf ball methods and molds for quickly and efficiently eliminating air/gas from within a mold during golf ball manufacture and the improved golf balls resulting therefrom.

A semiconductor manufacturing device has a strip panel and a plurality of electrical components disposed over the strip panel. An encapsulant is disposed over the electrical components using a mold gate injector and directed in a path toward higher flow resistance for the encapsulant over the electrical components. The mold gate injector can be shifted toward a side of the strip panel with the path toward higher flow resistance for the encapsulant. The mold gate injector can have a discharge port smaller than the mold gate injector directed at the path toward higher flow resistance for the encapsulant. The discharge port injector can be shifted toward a side of the strip panel with the path toward higher flow resistance for the encapsulant. An air vent and air tank can be coupled to the mold gate injector to aid in release of excess air from the encapsulant.

A semiconductor manufacturing device has a strip panel and a plurality of electrical components disposed over the strip panel. An encapsulant is disposed over the electrical components using a mold gate injector and directed in a path toward higher flow resistance for the encapsulant over the electrical components. The mold gate injector can be shifted toward a side of the strip panel with the path toward higher flow resistance for the encapsulant. The mold gate injector can have a discharge port smaller than the mold gate injector directed at the path toward higher flow resistance for the encapsulant. The discharge port injector can be shifted toward a side of the strip panel with the path toward higher flow resistance for the encapsulant. An air vent and air tank can be coupled to the mold gate injector to aid in release of excess air from the encapsulant.

A mold insert has at least one filament cavity and a stack of at least a first and second insert plates, wherein the first plate has a front face that closely abuts a front face of the second insert plate. A portion of the a filament cavity is provided in at least one of the front faces of the first and second insert plates such that the filament cavity is open at a top surface of the mold insert but does not extend to a bottom surface of the mold insert. A venting cavity is provided in the same front face of the insert plate in which the portion of the at least one filament cavity is provided. The venting cavity, which is in air-conducting connection with the blind-hole end of the filament cavity, has a depth between 1 μm and 20 μm. A method of manufacturing the mold insert includes providing first and second insert plates, forming a portion of a filament cavity into at least one of the front faces of the insert plates, forming a venting cavity into the front face with the filament cavity, and bringing the front faces of the plates into close abutment to form a filament cavity.