A method for manufacturing a container includes injecting a first material into a first mold to form a top portion of a preform. The first material and a second material are injected into the first mold to form a bottom portion of the preform. The preform is disposed in a second mold. The preform is blow molded into a finished container.

An injection molding machine includes: a first driving device rotating a screw provided inside a heating cylinder; a second driving device moving the screw forward and backward; a metering control section configured to, by controlling the first driving device and the second driving device, to meter resin while melting the resin, and thereafter rotate the screw in reverse to thereby reduce the pressure of the resin; a first sensor unit for detecting the pressure; a second sensor unit for detecting one or more kinds of physical quantities that affect the change of the pressure; and a prediction section predicting decompressing rotation information based on the pressure detected by the first sensor unit and the one or more kinds of physical quantities detected by the second sensor unit. The metering control section controls the first driving device based on the decompressing rotation information predicted by the prediction section.

An injection molding machine includes: a first driving device rotating a screw provided inside a heating cylinder; a second driving device moving the screw forward and backward; a metering control section configured to, by controlling the first driving device and the second driving device, to meter resin while melting the resin, and thereafter rotate the screw in reverse to thereby reduce the pressure of the resin; a first sensor unit for detecting the pressure; a second sensor unit for detecting one or more kinds of physical quantities that affect the change of the pressure; and a prediction section predicting decompressing rotation information based on the pressure detected by the first sensor unit and the one or more kinds of physical quantities detected by the second sensor unit. The metering control section controls the first driving device based on the decompressing rotation information predicted by the prediction section.

A hot runner process controller configured to monitor the status and operation of a hot runner system to autonomously generate information to improve the quality of injection molding process of a hot runner system having an inlet nozzle, one or more manifolds and one or more nozzles with actuator or without actuator, and one or more heating elements, the hot runner process controller is self-operating, and independent from the injection molding machine, includes: one or more sensors located on, in or at the hot runner system to detect the status and/or the operation of the hot runner system, and a processing unit and a memory. The processing unit is connected to the one or more sensors, wherein the memory stores data and program codes. The processing unit is configured to load and execute the program code to compare sensor information with the stored data and to determine if the hot runner system is in an operable status, and in case the hot runner system is in an operable status, configured to generate status information to activate the one or more heating elements and/or the one or more actuators enabling a production operation of the injection molding machine. In case the hot runner system is not in an operable status, configured to generate status information to deactivate the one or more heating elements and/or close or deactivate the one or more actuators disabling a production operation of the injection molding machine.

A hot runner process controller configured to monitor the status and operation of a hot runner system to autonomously generate information to improve the quality of injection molding process of a hot runner system having an inlet nozzle, one or more manifolds and one or more nozzles with actuator or without actuator, and one or more heating elements, the hot runner process controller is self-operating, and independent from the injection molding machine, includes: one or more sensors located on, in or at the hot runner system to detect the status and/or the operation of the hot runner system, and a processing unit and a memory. The processing unit is connected to the one or more sensors, wherein the memory stores data and program codes. The processing unit is configured to load and execute the program code to compare sensor information with the stored data and to determine if the hot runner system is in an operable status, and in case the hot runner system is in an operable status, configured to generate status information to activate the one or more heating elements and/or the one or more actuators enabling a production operation of the injection molding machine. In case the hot runner system is not in an operable status, configured to generate status information to deactivate the one or more heating elements and/or close or deactivate the one or more actuators disabling a production operation of the injection molding machine.

The invention relates to a method for encapsulating electronic components mounted on a carrier, including the steps of: placing the carrier with electronic components in a mould, introducing a liquid encapsulating material into the at least one mould cavity, wherein the pressure on an upper side remote from the carrier of at least one calibration component mounted on the carrier is measured by at least one pressure sensor located in the contact surface of a mould part. The invention also relates to a mould for encapsulating electronic components mounted on a carrier with such a method.

The invention relates to a method for encapsulating electronic components mounted on a carrier, including the steps of: placing the carrier with electronic components in a mould, introducing a liquid encapsulating material into the at least one mould cavity, wherein the pressure on an upper side remote from the carrier of at least one calibration component mounted on the carrier is measured by at least one pressure sensor located in the contact surface of a mould part. The invention also relates to a mould for encapsulating electronic components mounted on a carrier with such a method.

An injection apparatus of the invention injects a molding material supplied from a material supply port, and includes a die, a material supply apparatus that extrudes the molding material that is thread-like or strip-like via the die, and a material guide apparatus that guides the molding material supplied via the die to the material supply port. The material discharge port of the material supply apparatus and the die protrude downward in the material supply apparatus, and a pressure inside the material guide apparatus is reduced by a pressure reducing apparatus from a pressure reducing port provided above the material discharge port of the material supply apparatus and the die.

An injection apparatus of the invention injects a molding material supplied from a material supply port, and includes a die, a material supply apparatus that extrudes the molding material that is thread-like or strip-like via the die, and a material guide apparatus that guides the molding material supplied via the die to the material supply port. The material discharge port of the material supply apparatus and the die protrude downward in the material supply apparatus, and a pressure inside the material guide apparatus is reduced by a pressure reducing apparatus from a pressure reducing port provided above the material discharge port of the material supply apparatus and the die.

A mold apparatus for forming a molded part includes a mold body, a mold cavity formed in said mold body, a plurality of valve gates associated with said mold body, and a controller in communication with said plurality of valve gates. The controller is programmed to time opening of each valve gate based on a selected flow rate required to eliminate weld lines in the product.