A device for molding a semiconductor package including an upper mold configured to retain a substrate thereon, the substrate having semiconductor chips thereon, a lower mold defining a cavity and including a plurality of moving blocks, a bottom surface of the cavity defined by the moving blocks, the cavity configured to contain a molding resin, the moving blocks movably arranged under the cavity, a driving unit configured to movably drive the moving blocks, and a controller configured to control an raising order of the moving blocks by controlling the driving unit may be provided.

According to one embodiment, a mold includes a substrate clamping surface, a cavity, a suction part, a vent, an intermediate cavity, and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, communicates with the cavity, is recessed from the substrate clamping surface to a vent depth. The intermediate cavity is provided between the vent and the suction part on the path, communicates with the vent, and is recessed from the substrate clamping surface to an intermediate cavity depth deeper than the vent depth. The opening/closing part opens and closes the path and is provided between the intermediate cavity and the suction part on the path.

According to one embodiment, a mold includes a substrate clamping surface, a cavity, a suction part, a vent, an intermediate cavity, and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, communicates with the cavity, is recessed from the substrate clamping surface to a vent depth. The intermediate cavity is provided between the vent and the suction part on the path, communicates with the vent, and is recessed from the substrate clamping surface to an intermediate cavity depth deeper than the vent depth. The opening/closing part opens and closes the path and is provided between the intermediate cavity and the suction part on the path.

There is provided a structure for positioning a first mold part of a mold on a mold mounting face in an injection molding machine. The structure comprises a positioner configured to connect the first mold part to part of the injection molding machine, wherein the positioner is adjustable to position the first mold part on the mold mounting face. The structure further comprises controller executable instructions executable in a controller with which to resolve an alignment parameter of the mold using a feedback signal from a sensor. Further provided is a method of operating an injection molding machine which method comprises the steps of positioning a first mold part of a mold on a mold mounting face using a positioner and appreciating an alignment parameter of the mold with reference to a feedback signal from a sensor.

There is provided a structure for positioning a first mold part of a mold on a mold mounting face in an injection molding machine. The structure comprises a positioner configured to connect the first mold part to part of the injection molding machine, wherein the positioner is adjustable to position the first mold part on the mold mounting face. The structure further comprises controller executable instructions executable in a controller with which to resolve an alignment parameter of the mold using a feedback signal from a sensor. Further provided is a method of operating an injection molding machine which method comprises the steps of positioning a first mold part of a mold on a mold mounting face using a positioner and appreciating an alignment parameter of the mold with reference to a feedback signal from a sensor.

A system for programming a protection device for a molding machine includes a controller for actuating a plurality of molding machine actuators in an actuation sequence, each distinct actuation constituting a respective machine component actuation of an associated machine component. An HMI is operable to: present a GUI specific to a chosen machine component actuation; and for each of a plurality of other machine component actuations, define within the GUI, based on operator input, a rule specifying a state of the chosen machine component actuation relative to a state of the other machine component actuation for preventing interference between the two machine component actuations. The controller is configured, based on the rules defined within the GUI, to trigger an action, upon violation of any one of the rules, for reducing a risk of interference between the chosen machine component actuation and a respective one of the other machine component actuations.

A system for programming a protection device for a molding machine includes a controller for actuating a plurality of molding machine actuators in an actuation sequence, each distinct actuation constituting a respective machine component actuation of an associated machine component. An HMI is operable to: present a GUI specific to a chosen machine component actuation; and for each of a plurality of other machine component actuations, define within the GUI, based on operator input, a rule specifying a state of the chosen machine component actuation relative to a state of the other machine component actuation for preventing interference between the two machine component actuations. The controller is configured, based on the rules defined within the GUI, to trigger an action, upon violation of any one of the rules, for reducing a risk of interference between the chosen machine component actuation and a respective one of the other machine component actuations.

An injection molding apparatus 30 includes a turntable 5; first, second, and third molds disposed on the turntable 5; fourth, fifth, and sixth molds for opening and clamping the first, second, and third molds; and a first injection device 12, a second injection device 13, and a third injection device 14 for injecting a resin into the molds. Furthermore, the second injection device 13 and the third injection device 14 each include two injection ports, one of the two injection ports works as an injection port for primary and secondary injections, and the other is an injection port for a tertiary injection for injecting the resin along the outer peripheral portion of either one of a first member and a second member.

An injection molding apparatus 30 includes a turntable 5; first, second, and third molds disposed on the turntable 5; fourth, fifth, and sixth molds for opening and clamping the first, second, and third molds; and a first injection device 12, a second injection device 13, and a third injection device 14 for injecting a resin into the molds. Furthermore, the second injection device 13 and the third injection device 14 each include two injection ports, one of the two injection ports works as an injection port for primary and secondary injections, and the other is an injection port for a tertiary injection for injecting the resin along the outer peripheral portion of either one of a first member and a second member.

A method of detecting and compensating for a non-operational mold cavity in an injection molding apparatus having a plurality of mold cavities and an injection molding screw or ram includes injecting, via the injection molding screw or ram, a molten thermoplastic material into the plurality of mold cavities. The method includes measuring a first process parameter of the injection molding apparatus at a pre-determined time during or after the injecting. The method also includes determining, based on the first process parameter, whether one or more mold cavities of the plurality of mold cavities are non-operational. Then, when it is determined that one or more mold cavities are non-operational, the method includes automatically adjusting the first process parameter or a second process parameter of the injection molding apparatus.