A laminate substrate for receiving a semiconductor chip. Included are laminate layers stacked to form the laminate substrate, each laminate layer includes a core that includes particle-filled epoxy and a metallic layer on the core. At least one laminate layer has a radial cut through the metallic layer, the radial cut extending from a periphery of the at least one laminate layer towards a center of the at least one laminate layer. The radial cut cuts only through the metallic layer and does not cut through the core.

A plastic laminate structure including a plurality of, or a plurality of kinds of, plastic layers and an adhesive layer. The plastic layers are laminated together in a first direction. All the plastic layers are comprised exclusively of extruded plastic layers. The adhesive layer affixes together two of the plastic layers that are adjacent to each other in the first direction.

A stretch laminate is disclosed. The stretch laminate may include a first layer; a second layer; and one or more elastic members disposed between the first layer and the second layer. The first layer may include a nonwoven web material bearing a pattern of thermal bonds, including a plurality of bonds each having a length and a width, the length being oriented perpendicularly to the stretch direction and being greater than the width, for a majority of the bonds. The elastic member(s) may be joined with the first layer and the second layer while pre-strained in the stretch direction; when the stretch laminate is in a relaxed condition, at least the first layer may include a plurality of gathers comprising elongate ridges and valleys oriented transversely to the stretch direction. A disposable absorbent pant having an elasticized belt structure including the stretch laminate, is also disclosed.

The invention relates to an adhesive composition comprising at least one polyamide noted A, with a mean number of carbon atoms per nitrogen atom, noted C.sub.A, of between 4 and 8.5 and advantageously between 4 and 7; at least one polyamide noted B, with a melting point of greater than or equal to 180° C. and a mean number of carbon atoms per nitrogen atom, noted C.sub.B, of between 7 and 10 and advantageously between 7.5 and 9.5; at least one polyamide noted C, with a mean number of carbon atoms per nitrogen atom, noted C.sub.C, of between 9 and 18 and advantageously between 10 and 18; at least 50% by weight of the said composition being formed from one or more polyamides chosen from polyamides A, B and C, the mass-weighted mean of the heats of fusion of these polyamides in the said composition being greater than 25 J/g (DSC), the mean number of carbon atoms per nitrogen atom of the polyamides A, B and C also satisfying the following strict inequality: C.sub.A<C.sub.B<C.sub.C, and also to multilayer structures using the said composition.

A heat insulation material includes a laminate obtained by stacking fiber layers that include heat-resistant fibers, the fiber layers being bound with a thermosetting resin, wherein the laminate does not include a thermoplastic resin that has a heat-resistant temperature lower than that of the thermosetting resin, or includes only a small amount of a thermoplastic resin that has a heat-resistant temperature lower than that of the thermosetting resin.

A dimensionally stable universal floor covering includes a tufted textile having stitches and a reinforcement layer operatively connected to the stitches to provide dimensional stability for the entire floor covering. The reinforcement layer is made of fibers that are initially contained within a composition of adhesive and fibers. Mixing of the adhesive/fibers composition and/or injection of compressed air, assists in preparing the adhesive and fiber composition to be in the preferred condition and position prior to the forming of the reinforcement layer. Multiple sources of pressure, including vacuum, are applied in a controlled manner for moving the adhesive and fiber composition to form a reinforcement layer of fibers that is operatively connected to the stitches and/or to form a layer of fibers and adhesive that is contained within the stitches. The universal floor covering is selectively cut and transported in a roll for installation, and it can be conveniently recycled if necessary.

The invention relates to a flexible sheet comprising (i) a woven fabric comprising yarns containing polyethylene fibers; and (ii) a plastomer layer adhered to at least one surface of said woven fabric wherein said plastomer is a semi-crystalline copolymer of ethylene or propylene and one or more C2 to C12 α-olefin co-monomers and wherein said plastomer having a density as measured according to ISO1183 of between 870 and 930 kg/m3, wherein the flexible sheet has a shrinkage of at most 1.9%.

A cation-exchange membrane including: layer (I) containing repeating units (A) each represented by formula (1) and repeating units (S) each containing a sulfonic acid-type ion-exchange group, wherein the mass proportion of repeating units (A) based on the total mass proportion of repeating units (A) and repeating units (S) being 100% by mass is 53% by mass or more and 70% by mass or less; and layer (II) containing a fluorine-containing polymer containing a carboxylic acid-type ion-exchange group and disposed on layer (I), wherein the water content of layer (I) is 26% or more and 35% or less:

CF.sub.2—CF.sub.2  (1)

A method for making low shrink polyester films wherein the films are arranged in stacks, tentered, heat treated, and relaxed in unison. Also, polyester films produced by such method.

A dental appliance includes a polymeric shell with a plurality of cavities for receiving one or more teeth, including an interior region with a core layer of a first thermoplastic polymer A with a thermal transition temperature of about 70° C. to about 140° C. in and a flexural modulus greater than about 1.3 GPa, and first and second interior layers of a second thermoplastic polymer B with a glass transition temperature of less than about 0° C. and a flexural modulus less than about 1 GPa; and first and second exterior layers of a third thermoplastic polymer C with a thermal transition temperature of about 70° C. to about 140° C. and a flexural modulus greater than about 1.3 GPa. Interfacial adhesion between any of the adjacent layers in the polymeric shell is greater than about 150 grams per inch.