A storage station, a process for storing, and a bottle tray (5) configured for receiving a bottle layer (7) are provided. The bottle tray has an upright side wall (12), with an upper tray opening (13) and a tray bottom (15) connected to the side wall (12). The bottle tray (5) has a movable lifting bottom (18) that lies in the loaded state (5) on the tray bottom (15) and which has a plurality of passage openings (16) for a lifting device (34) for a relative lift between the side wall (12) and the lifting bottom (18). The tray bottom (15) has a perforated plate or a plurality of struts (17) located spaced apart and enclosing the passage openings (16). The struts are fastened to the side wall (12). The bottle tray (5) has a bottom centering (19) acting between the tray bottom (15) and the lifting bottom (18).

A storage station, a process for storing, and a bottle tray (5) configured for receiving a bottle layer (7) are provided. The bottle tray has an upright side wall (12), with an upper tray opening (13) and a tray bottom (15) connected to the side wall (12). The bottle tray (5) has a movable lifting bottom (18) that lies in the loaded state (5) on the tray bottom (15) and which has a plurality of passage openings (16) for a lifting device (34) for a relative lift between the side wall (12) and the lifting bottom (18). The tray bottom (15) has a perforated plate or a plurality of struts (17) located spaced apart and enclosing the passage openings (16). The struts are fastened to the side wall (12). The bottle tray (5) has a bottom centering (19) acting between the tray bottom (15) and the lifting bottom (18).

A pedestal assembly for a processing region and comprising first pins coupled to a substrate support, configured to mate with first terminals of an electrostatic chuck, and are configured to be coupled to a first power source. Each of the first pins comprises an interface element, and a compliance element supporting the interface element. Second pins are coupled to the substrate support, configured to mate with second terminals of the electrostatic chuck, and configured to couple to a second power source. Alignment elements are coupled to the substrate support and are configured to interface with centering elements of the electrostatic chuck. The flexible element is coupled to the substrate support, configured to interface with a passageway of the electrostatic chuck, and configured to be coupled to a gas source.

A pedestal assembly for a processing region and comprising first pins coupled to a substrate support, configured to mate with first terminals of an electrostatic chuck, and are configured to be coupled to a first power source. Each of the first pins comprises an interface element, and a compliance element supporting the interface element. Second pins are coupled to the substrate support, configured to mate with second terminals of the electrostatic chuck, and configured to couple to a second power source. Alignment elements are coupled to the substrate support and are configured to interface with centering elements of the electrostatic chuck. The flexible element is coupled to the substrate support, configured to interface with a passageway of the electrostatic chuck, and configured to be coupled to a gas source.

A row-forming device (10) together with processes form a bottle row (8) from a bottle layer (7). The row-forming device (10) is configured to pick up and transport away, in rows, the respectively frontmost layer row (61) of the bottle layer (7) moved in a conveying direction (60), in a transverse transport direction (72). One or more layer conveyors (59) moves the bottle row (7) in a conveying direction (60) and adjoins the transport device (62), which has a plurality of parallel conveyor belts (63, 66) that extend in the transport direction (72) and are driven independently and also exhibit mutually different transport speeds. The transport device (62) has a guide strip (68) oriented obliquely to the transport direction (72). The guide strip (68) extends over a part of the conveyor belts (63, 66) and is arranged downstream of the layer conveyor (59) in the transport direction (72).

Method, gripping system and plant for the production of stacked grain oriented sheet cores for transformers by means of stacks of sheets; the method providing for providing a stack of sheets comprising one or more sheets made of grain oriented electrical steel; grabbing said stack of sheets by means of a gripping system; placing the stack of sheets on an assembly table; during the step of placing, the stack of sheets falling in free fall along a path.

Method, gripping system and plant for the production of stacked grain oriented sheet cores for transformers by means of stacks of sheets; the method providing for providing a stack of sheets comprising one or more sheets made of grain oriented electrical steel; grabbing said stack of sheets by means of a gripping system; placing the stack of sheets on an assembly table; during the step of placing, the stack of sheets falling in free fall along a path.

A substrate transferring apparatus including a non-contact type driving unit is provided. The substrate transferring apparatus comprises a stator assembly including a driving surface and an electromagnetic generating module, a first mover including a first magnet module facing the electromagnetic generating module and floating and moving on the driving surface, and including a first inclined surface, a second mover including a second magnet module facing the electromagnetic generating module and floating and moving on the driving surface, and including a second inclined surface, and a transfer member disposed between the first mover and the second mover and moving along the first inclined surface and the second inclined surface according to a distance between the first mover and the second mover.

A substrate transferring apparatus including a non-contact type driving unit is provided. The substrate transferring apparatus comprises a stator assembly including a driving surface and an electromagnetic generating module, a first mover including a first magnet module facing the electromagnetic generating module and floating and moving on the driving surface, and including a first inclined surface, a second mover including a second magnet module facing the electromagnetic generating module and floating and moving on the driving surface, and including a second inclined surface, and a transfer member disposed between the first mover and the second mover and moving along the first inclined surface and the second inclined surface according to a distance between the first mover and the second mover.

A method of picking up and depositing optoelectronic semiconductor chips comprises generating electron-hole pairs in optoelectronic semiconductor chips, thereby generating a dipole electric field in the vicinity of the respective optoelectronic semiconductor chip, generating an electric field by a pick-up tool, and picking up the optoelectronic semiconductor chips during or after generation of the electron-hole pairs by the pick-up tool and depositing them at predetermined locations.