Patent classifications
B65G47/92
METHOD AND DEVICE FOR PICKING UP AND DEPOSITING OPTOELECTRONIC SEMICONDUCTOR CHIPS
A method of picking up and depositing optoelectronic semiconductor chips comprises generating electron-hole pairs in optoelectronic semiconductor chips, thereby generating a dipole electric field in the vicinity of the respective optoelectronic semiconductor chip, generating an electric field by a pick-up tool, and picking up the optoelectronic semiconductor chips during or after generation of the electron-hole pairs by the pick-up tool and depositing them at predetermined locations.
Adsorption device, transferring system having same, and transferring method using same
A transferring method includes providing an adsorption device, using the adsorption device to attract and hold a plurality of light emitting diodes (LEDs), providing a target substrate with a plurality of spots of anisotropic conductive adhesive on a surface of the target substrate; moving the adsorption device or the target substrate wherein each of the plurality of LEDs adsorbed by the adsorption device becomes in contact with one of the plurality of spots of anisotropic conductive adhesive; and curing the plurality of spots of anisotropic conductive adhesive on the target substrate and moving away the adsorption device.
Adsorption device, transferring system having same, and transferring method using same
A transferring method includes providing an adsorption device, using the adsorption device to attract and hold a plurality of light emitting diodes (LEDs), providing a target substrate with a plurality of spots of anisotropic conductive adhesive on a surface of the target substrate; moving the adsorption device or the target substrate wherein each of the plurality of LEDs adsorbed by the adsorption device becomes in contact with one of the plurality of spots of anisotropic conductive adhesive; and curing the plurality of spots of anisotropic conductive adhesive on the target substrate and moving away the adsorption device.
Method for making adsorption device
A method for making an adsorption device includes: providing and etching a substrate to form a plurality of receiving grooves spaced apart from each other; forming a magnetic film in each of the plurality of receiving grooves; and forming a magnet in each of the plurality of receiving grooves. Each receiving groove includes a bottom wall and a side wall coupling the bottom wall. The magnetic film covers the bottom wall and the side wall of each of receiving groove.
Method for making adsorption device
A method for making an adsorption device includes: providing and etching a substrate to form a plurality of receiving grooves spaced apart from each other; forming a magnetic film in each of the plurality of receiving grooves; and forming a magnet in each of the plurality of receiving grooves. Each receiving groove includes a bottom wall and a side wall coupling the bottom wall. The magnetic film covers the bottom wall and the side wall of each of receiving groove.
Coupling and decoupling a detachable tool from a motion device on a robotic system
Magnetic coupling mechanisms for robotic arm end effectors are disclosed. In particular, a magnetic coupling mechanism couples a detachable tool, such as a suction gripper, to a tool changer base of a robotic arm tool of an end effector. Magnetic coupling between the robotic arm tool and the detachable tool allows for breakaway when a sufficient force is applied to the robotic arm tool and/or the detachable tool to separate the two. The decoupling may be achieved via a tool rack. An exemplary system for coupling a detachable tool to a motion device includes a first magnetic ring affixed to a distal end of the motion device, where an inside of the first magnetic ring forms a first hollow chamber; and a second magnetic ring affixed to a proximal end of the detachable tool, where an inside of the detachable tool forms a second hollow chamber.
Coupling and decoupling a detachable tool from a motion device on a robotic system
Magnetic coupling mechanisms for robotic arm end effectors are disclosed. In particular, a magnetic coupling mechanism couples a detachable tool, such as a suction gripper, to a tool changer base of a robotic arm tool of an end effector. Magnetic coupling between the robotic arm tool and the detachable tool allows for breakaway when a sufficient force is applied to the robotic arm tool and/or the detachable tool to separate the two. The decoupling may be achieved via a tool rack. An exemplary system for coupling a detachable tool to a motion device includes a first magnetic ring affixed to a distal end of the motion device, where an inside of the first magnetic ring forms a first hollow chamber; and a second magnetic ring affixed to a proximal end of the detachable tool, where an inside of the detachable tool forms a second hollow chamber.
Tie plate separator and method thereof
Embodiments of a tie plate sorter are disclosed wherein the tie plates are sorted and fed to an output device for further feeding to a tie plate distribution system. The tie plates may be oriented as needed. Exemplary methods are also provided.
Tie plate separator and method thereof
Embodiments of a tie plate sorter are disclosed wherein the tie plates are sorted and fed to an output device for further feeding to a tie plate distribution system. The tie plates may be oriented as needed. Exemplary methods are also provided.
Tie plate dispenser and method therefore
Present embodiments relate to a tie plate dispenser which aligns tie plates for dispensing based on rail base rather than outer edges of tie plate. Thus tie plates are aligned and located in a differing manner than prior art systems. Further, the tie plate dispenser includes an opening over which a magnet is disposed to retain a tie plate over the opening. The tie plate over the opening may be selectively released by disengaging the tie plate from the magnet.