A MEMS vibration sensor includes a piezoelectric membrane including a segmented electrode affixed to a holder; and an inertial mass affixed to the piezoelectric membrane, wherein the segmented electrode includes four segmentation zones, wherein, in an X-direction, a signal from a first segmentation zone is equal to a signal from a third segmentation zone, a signal from a second segmentation zone is equal to a signal from a fourth segmentation zone, and the signal from the first segmentation zone and the signal from the second segmentation zone have opposite signs, and wherein, in a Y-direction, a signal from the first segmentation zone is equal to the signal from the second segmentation zone, the signal from the third segmentation zone is equal to the signal from the fourth segmentation zone, and the signal from first segmentation zone and the signal from the third segmentation zone have opposite signs.

In an inertial sensor, a first movable body configured to swing around a first rotation axisrotation axis along a first direction has an opening; the opening includes a second movable body configured to swing around a second rotation axisrotation axis along a second direction, a second support beam supporting the second movable body as the second rotation axisrotation axis, a third movable body configured to swing around a third rotation axisrotation axis along the second direction, and a third support beam supporting the third movable body as the third rotation axisrotation axis; and a protrusion is provided at a surface facing the second movable body and the third movable body, or at the second movable body and the third movable body, the protrusion protruding toward the second movable body and the third movable body or the surface.

An electronic apparatus includes a semiconductor package including a sensor unit that outputs a signal responding to an applied physical quantity, mounted on a mounting member. An island projected region is defined as a region in the mounting member obtained by projecting an outline of an island on which the sensor unit is mounted, and a part of or entire of the island projected region is configured as a through hole or a concave portion.

The present disclosure relates to a microelectromechanical systems (MEMS) apparatus. The MEMS apparatus includes a base substrate and a conductive routing layer disposed over the base substrate. A bump feature is disposed directly over the conductive routing layer. Opposing outermost sidewalls of the bump feature are laterally between outermost sidewalls of the conductive routing layer. A MEMS substrate is bonded to the base substrate and includes a MEMS device directly over the bump feature. An anti-stiction layer is arranged on one or more of the bump feature and the MEMS device.

An inertial structure is elastically coupled through a first elastic structure to a supporting structure so as to move along a sensing axis as a function of a quantity to be detected. The inertial structure includes first and second inertial masses which are elastically coupled together by a second elastic structure to enable movement of the second inertial mass along the sensing axis. The first elastic structure has a lower elastic constant than the second elastic structure so that, in presence of the quantity to be detected, the inertial structure moves in a sensing direction until the first inertial mass stops against a stop structure and the second elastic mass can move further in the sensing direction. Once the quantity to be detected ends, the second inertial mass moves in a direction opposite to the sensing direction and detaches the first inertial mass from the stop structure.

A method of operating a mechanical switching device is disclosed. The switching device includes a housing, an assembly disposed in the housing, and a body. The assembly is thermally deformable and comprises a beam held in two different places by two arms secured to edges of the housing. The beam is remote from the body in a first configuration and in contact with and immobilized by the body in a second configuration. The assembly has the first configuration at a first temperature and the second configuration when one of the arms has a second temperature different from the first temperature. The method includes exposing an arm of the assembly to the second temperature, and releasing the beam using a release mechanism. The release mechanism includes a pointed element comprising a pointed region directed towards the body. The pointed element limits an open crater in a concave part of a projection.

A method of manufacturing a physical quantity detection sensor includes forming a stacked structure having a plurality of sensor devices by bonding together a sensor substrate and a different type substrate of a different material from a material of the sensor substrate, the sensor substrate having a plurality of sensor movable portions therein, and dicing the stacked structure using a dicing blade, wherein a groove is provided in one of the sensor substrate and the different type substrate to penetrate the one of the sensor substrate and the different type substrate, the groove having a width larger than a width of the dicing blade, and in at least part of the dicing, the dicing blade is accommodated in the groove and advances without contacting surfaces on left and right sides of the groove.

A sensor system including a plurality of individual and separate sensor elements. Each of the individual sensor elements is independently functional. The individual sensor elements of the sensor system being formed in one piece from parts of a wafer or a vertically integrated wafer stack. The sensor system including at least one separation structure, in particular a scribe line, between the individual and separate sensor elements.

According to one embodiment, a sensor includes a base body, a first supporter fixed to the base body, and a first movable part separated from the base body. The first movable part includes a first movable base part supported by the first supporter, a second movable base part connected with the first movable base part, and a first movable beam. The first movable beam includes a first beam, a first movable conductive part, and a first connection region. The first beam includes a first beam portion, a second beam portion, and a third beam portion between the first beam portion and the second beam portion. The first beam portion is connected with the first movable base part. The second beam portion is connected with the second movable base part. The first connection region connects the third beam portion and the first movable conductive part.

A microelectromechanical system (MEMS) sensor package includes a laminate that provides physical support and electrical connection to a MEMS sensor. A resin layer is embedded within an opening of the laminate and a MEMS support layer is embedded within the opening by the resin layer. A MEMS structure of the MEMS sensor is located on the upper surface of the MEMS support layer.