Patent classifications
B81B2201/025
Microscale metallic CNT templated devices and related methods
A method for forming a microscale device may include growing, by a chemical vapor deposition, a patterned forest of vertically aligned carbon nanotubes, wherein the patterned forest defines a component of the microscale device, and applying a conformal non-metal coating to the vertically aligned carbon nanotubes throughout the patterned forest, wherein the conformal non-metal coating comprises a substantially uniform thickness along a length of the vertically aligned carbon nanotubes. The method may also include connecting adjacent vertically aligned carbon nanotubes together with the conformal non-metal coating without filling interstices between the adjacent vertically aligned carbon nanotubes, wherein the connecting of the vertically aligned carbon nanotubes is configured to increase a strength of the vertically aligned carbon nanotubes of the patterned forest above a threshold level to withstand forces applied during a wet etching process, and infiltrating the interstices between the adjacent vertically aligned carbon nanotubes with a metallic material.
Temperature-compensated micro-electromechanical device, and method of temperature compensation in a micro-electromechanical device
A micro-electromechanical device includes a semiconductor substrate, in which a first microstructure and a second microstructure of reference are integrated. The first microstructure and the second microstructure are arranged in the substrate so as to undergo equal strains as a result of thermal expansions of the substrate. Furthermore, the first microstructure is provided with movable parts and fixed parts with respect to the substrate, while the second microstructure has a shape that is substantially symmetrical to the first microstructure but is fixed with respect to the substrate. By subtracting the changes in electrical characteristics of the second microstructure from those of the first, variations in electrical characteristics of the first microstructure caused by changes in thermal expansion or contraction can be compensated for.
Vertical stopper for capping MEMS devices
Capped microelectromechanical systems (MEMS) devices are described. In at least some situations, the MEMS device includes one or more masses which move. The cap may include a stopper which damps motion of the one or more movable masses. In at least some situations, the stopper damps motion of one of the masses but not another mass.
SENSOR UNIT, ELECTRONIC APPARATUS, AND VEHICLE
A sensor unit includes: a sensor module having an inertial sensor installed therein and having a bottom wall and a sidewall; abase where the sensor module is provided; a first bonding member bonding the base and the sidewall together; and a second bonding member bonding the base and the bottom wall together. The sensor module is a polygon as viewed in a plan view of the bottom wall. The base and the sidewall are bonded together via the first bonding member at a part of at least one side of the polygon except corners.
MEMS DEVICE
A micro-electro-mechanical system (MEMS) device includes a substrate, a proof mass, and a piezoelectric bump. The substrate has a surface. The proof mass is suspended over the surface of the substrate, wherein the proof mass is movable with respect to the substrate. The piezoelectric bump is disposed on the surface of the substrate and extends a distance from the surface of the substrate toward the proof mass.
Method for manufacturing a MEMS element
A method for manufacturing a MEMS element, including the following: forming a least one stationary weight element and at least one moving weight element in the MEMS element, and positioning at least one fixing element at the stationary weight element and at the moving weight element, the fixing element being formed so as to be able to be severed.
Microscale metallic CNT templated devices and related methods
A microscale device may include a patterned forest of vertically grown and aligned carbon nanotubes defining a carbon nanotube forest with the nanotubes having a height defining a thickness of the forest. The patterned forest may define a patterned frame that defines one or more components of the microscale device. The microscale device may also include a conformal coating of substantially uniform thickness extending throughout the carbon nanotube forest. The carbon nanotube forest may have a thickness of at least three microns. The conformal coating may substantially coat the nanotubes, define coated nanotubes and connect adjacent nanotubes together such that the carbon nanotube forest is sufficiently robust for liquid processing, without substantially filling interstices between individual coated nanotubes. The microscale device may also include a metallic interstitial material infiltrating the carbon nanotube forest and at least partially filling interstices between individual coated nanotubes.
Method for manufacturing a micromechanical inertial sensor
A method for manufacturing a micromechanical inertial sensor, including: forming a movable MEMS structure in a MEMS wafer; connecting a cap wafer to the MEMS wafer; forming an access opening into the cavity, the access opening to the cavity being formed from two opposing sides; a defined narrow first access opening being formed from one side of the movable MEMS structure and a defined wide second access opening being formed from a surface of the MEMS wafer, the second access opening being formed to be wider in a defined manner than the first access opening; and closing the first access opening while enclosing a defined internal pressure in the cavity.
MEMS STRUCTURE FOR OFFSET MINIMIZATION OF OUT-OF-PLANE SENSING ACCELEROMETERS
Exemplary embodiment of a tilting z-axis, out-of-plane sensing MEMS accelerometers and associated structures and configurations are described. Disclosed embodiments facilitate improved offset stabilization. Non-limiting embodiments provide exemplary MEMS structures and apparatuses characterized by one or more of having a sensing MEMS structure that is symmetric about the axis orthogonal to the springs or flexible coupling axis, a spring or flexible coupling axis that is aligned to one of the symmetry axes of the electrodes pattern, a different number of reference electrodes and sense electrodes, a reference MEMS structure having at least two symmetry axes, one which is along the axis of the springs or flexible coupling, and/or a reference structure below the spring or flexible coupling axis.
MEMS rotation rate sensor including combined driving and detection
A rotation rate sensor including a substrate having a principal plane of extension, and a structure movable with respect to the substrate; the structure being excitable from a neutral position into an oscillation having a movement component substantially parallel to a driving direction, which is substantially parallel to the principal plane of extension. To induce the oscillation, the rotation rate sensor includes a comb electrode moved along with the structure and a comb electrode fixed in position relative to the substrate. The excitation is produced by applying a voltage to the moving comb electrode and/or to the stationary comb electrode. Due to a rotation rate of the rotation rate sensor about an axis running substantially perpendicularly to the driving direction and substantially perpendicularly to the detection direction, a force applied to the structure with a force component along a detection direction substantially perpendicular to the driving direction is detectable.