Provided are a transdermal absorption sheet capable of achieving control of the dissolution rate and suppression of diffusion of a drug, and a method of producing the same. A transdermal absorption sheet includes a sheet portion, and a plurality of needle-like protruding portions formed by a plurality of frustum portions arranged on the sheet portion and needle portions arranged on the frustum portions, in which at least one of the needle-like protruding portions has a cavity portion extending from the sheet portion to the frustum portion.

A method for fabricating a fluidic device includes depositing a sacrificial material on a pillar array arranged on a substrate. The method also includes removing a portion of the sacrificial material. The method further includes depositing a sealing layer on the pillar array to form a sealed fluidic cavity.

Microfluidic devices having superhydrophilic bi-porous interfaces are provided, along with their methods of formation. The device can include a substrate defining a microchannel formed between a pair of side walls and a bottom surface and a plurality of nanowires extending from each of the side walls and the bottom surface. For example, the nanowires can be silicon nanowires (e.g., pure silicon, silicon oxide, silicon carbide, etc., or mixtures thereof).

Flexible, insertable, transparent microelectrode arrays that allow integration of electrophysiological recordings with any optical imaging or stimulation technology are disclosed. In some embodiments of the disclosed technology, a microelectrode array includes a flexible substrate layer including a shank member extending in a first direction and a tapered tip at an end of the shank member, and a plurality of electrode wires arranged in the first direction on the flexible substrate layer, wherein the plurality of electrode wires includes adjacent electrode wires having different lengths from each other such that an electrode wire arranged closer to a centerline of the flexible substrate layer is longer than an adjacent electrode arranged further away from the centerline of the flexible substrate.

A system and method for manufacturing a micropillar array (20). A carrier (11) is provided with a layer of metal ink (20i). A high energy light source (14) irradiates the metal ink (20i) via a mask (13) between the carrier (11) and the light source. The mask is configured to pass a cross-section illuminated image of the micropillar array onto the metal ink (20i), thereby causing a patterned sintering of the metal ink (20i) to form a first subsection layer (21) of the micropillar array (20) in the layer of metal ink (20i). A further layer of the metal ink (20i) is applied on top of the first subsection layer (21) of the micropillar array (20) and irradiated via the mask (13) to form a second subsection layer (21) of the micropillar array on top. The process is repeated to achieve high aspect ratio micropillars 20p.

A method of manufacturing a plurality of neural probes from a silicon wafer in which after neural probes are formed on one side of a silicon wafer, the other side of the silicon wafter is subject to a dicing process that separates and adjusts the thickness of the neural probes.

A preparation method of a bionic adhesive material with a tip-expanded microstructural array includes the following steps: machining through-holes on a metal sheet; modifying morphology of a through-hole by electroplating, using the metal sheet in step 1 as an electroplating cathode, and arranging the electroplating cathode and an electroplating anode in parallel to prepare a hyperboloid-like through-hole array assembly, fitting a lower surface of the hyperboloid-like through-hole array assembly tightly to an upper surface of a substrate assembly to prepare a through-hole assembly of a mold; and filling the mold assembly with a polymer, curing, and demolding to obtain the adhesive material with the tip-expanded microstructural array.

Methods are disclosed to prepare permanent materials that can be coated onto microelectronic substrates or used for other structural or optical applications. The permanent materials are thermally stable to at least 300° C., cure using a photo or thermal process, exhibit good chemical resistance (including during metal passivation), and have a lifespan of at least 5 years, preferably at least 10 years, in the final device. Advantageously, these materials can also be bonded at room temperature. The materials exhibit no movement or squeeze-out after bonding and adhere to a variety of substrate types. A chip-to-chip, chip-to-wafer, and/or wafer-to-wafer bonding method utilizing this material is also described.

Methods for mass production of new microfluidic devices are described. The microfluidic devices may include an array of micro-needles with open channels in fluid communication with multiple reservoirs located within a substrate that supports the micro-needles. The micro-needles are configured so as to sufficiently penetrate the skin in order to collect or sample bodily fluids and transfer the fluids to the reservoirs. The micro-needles may also deliver medicaments into or below the skin.

A product includes an elongated carbon-containing pillar having a bottom and a tip opposite the bottom. The width of the pillar measured 1 nm below the tip is less than 700 nm. A method includes masking a carbon-containing single crystal for defining masked regions and unmasked regions on the single crystal. The method also includes performing a plasma etch for removing portions of the unmasked regions of the single crystal, thereby defining a pillar in each unmasked region, and performing a chemical etch on the pillars at a temperature between 1200° C. and 1600° C. for selectively reducing a width of each pillar.