Patent classifications
B06B1/0622
VIBRATION APPARATUS AND APPARATUS INCLUDING THE SAME
A vibration apparatus can include a first cover member; a second cover member; a vibration portion between the first cover member and the second cover member; a contact portion between the first cover member and the vibration portion; and a signal cable. The signal cable can include a first signal line connected to a first surface of the vibration portion via the contact portion, and a second signal line connected to a second surface of the vibration portion opposite to the first surface of the vibration portion.
APPARATUS
An apparatus may include a vibration member and a vibration apparatus provided at a rear surface of the vibration member to vibrate the vibration member. The vibration apparatus may include at least one or more first vibration portions and a plurality of second vibration portions different from the at least one or more first vibration portions. The at least one or more first vibration portions may be at a periphery of, or may be adjacent to, the plurality of second vibration portions.
Skin treatment applicator
Some embodiments of the invention relate to an applicator for applying ultrasound energy to a tissue volume, comprising: an array comprising a plurality of ultrasound transducers, the transducers arranged side by side, the transducers configured to emit unfocused ultrasound energy suitable to thermally damage at least a portion of the tissue volume, each of the transducers comprising a coating thin enough so as not to substantially affect heat transfer via the coating to the tissue; and a cooling module configured to apply cooling via the transducers to prevent overheating of a surface of the tissue volume being contacted by the transducers.
Device and a method for reducing and homogenizing residual stress of a workpiece generated during machining
The present disclosure provides a device and a method for reducing and homogenizing residual stress during machining in which a workpiece is fixed, such as milling, boring, drilling and planning, with which high-energy acoustic waves are emitted to the workpiece via a tight contact between a plurality of high-energy wave exciters on a bench and a workpiece coated with a coupling medium, and residual stress inside the machined workpiece is reduced and homogenized through elastic wave energy generated in the workpiece by the high-energy acoustic waves. In this way, the purpose of reducing and homogenizing the residual stress while machining is achieved, realizing a stress-free machining, and the deformation of the workpiece during and after machining is minimized.
Ultrasound transducer with curved transducer stack
A high frequency ultrasound array having a number of transducer elements that are formed in sheet of piezoelectric material. A frame having a coefficient of thermal expansion similar to that of the piezoelectric material surrounds the piezoelectric material and is separated from the piezoelectric material by an epoxy material. Kerf cuts that define the individual elements in the sheet of piezoelectric material extend across a full width of the sheet. In some embodiments, sub-dice kerf cuts that divide a single transducer element into two or more sub-elements also extend all the way across the width of the sheet. A lens positioned in front of the transducer elements can have a radius machined therein to focus ultrasound signals. The frame, transducer elements and lens are bent or curved with the desired radius to focus ultrasound signals.
Pseudo-piezoelectric D33 device and electronic device using the same
A pseudo-piezoelectric d33 device includes a nano-gap, and a pair of integral and substantially parallel electrodes having a first sensing electrode and a second sensing electrode. The first sensing electrode and the second sensing electrode constitute a receiver. The nano-gap is disposed between the first sensing electrode and the second sensing electrode. An initial height of the nano-gap is smaller than or equal to 100 nanometers. The nano-gap is formed after a thermal reaction between a semiconductor material and a metal material to form a semiconductor-metal compound. The first sensing electrode of the receiver includes the semiconductor-metal compound to provide an integral capacitive sensing electrode to sense a capacitance change with the second sensing electrode and generate a sensing signal.
ULTRASONIC MATRIX IMAGING DEVICE
An ultrasound imaging device includes a plurality of ultrasound transducers arranged in an array of rows and columns. Each of the transducers has a first electrode and a second electrode. The first electrodes of the transducers of a same row are interconnected and the second electrodes of the transducers of a same column are interconnected.
SYSTEMS AND METHODS FOR TESTING MEMS ARRAYS AND ASSOCIATED ASICS
Described herein are methods and systems for testing transducers and associated integrated circuits. In some cases, a method or system described herein can comprise modulating a bias voltage using a test signal in order to produce a modulated bias voltage signal useful in testing a plurality of transducers of a transducer array in parallel.
Ultrasonic imaging probe including composite aperture receiving array
A system and method from improving the image quality achievable with an ultrasound transducer by using a composite aperture for receiving ultrasound echoes. By using two receive cycles per vector, twice as many transducers may be used for receiving ultrasound imaging data than there are physical channels available in the ultrasound probe. An ultrasound probe utilizing a composite aperture can achieve high image quality from a system have reduced power, size, cost and complexity.
Ultrasonic phased array transducer device with two-dimensional hinge array structure
An ultrasonic phased array transducer device with a two-dimensional hinge array structure belongs to equipment in the technical field of ultrasonic detection. A connecting rod is fixedly connected to a fixed support and a two-dimensional hinge array respectively. Voice coil motors are symmetrically arranged in a shape of the British “Union Jack” with the connecting rod as a center, and are fixedly connected to the fixed support. Force output rods are respectively connected to voice coil motor coils and the upper surfaces of array units. Piezoelectric array elements are fixedly connected to the lower surfaces of all the array units. The numbers of the voice coil motors and the force output rods are 2N (N=4, 8, 12, 16, 20), the number of the piezoelectric array elements is 2N+1, and different N values are selected according to the sizes of workpieces to be detected. In the disclosure, by adjusting the current of each voice coil motor coil, the corresponding force output rod generates displacement to drive the two-dimensional hinge array unit to generate displacement, so as to push out and retract the hinge array unit and the piezoelectric array element fixedly connected below and drive the two-dimensional hinge array to generate deformation, so that the piezoelectric array elements fully fit with the surface of the workpiece to be detected. The disclosure can be applied to detection of the workpieces to be detected with flat surfaces, curved surfaces or spherical surfaces.