A method for producing a primary material for a cutting tool, for example a primary material for a saw blade or a saw band, in which a band-shaped carrier of a metal carrier material and a wire of high-speed steel are continuously brought together along a lateral edge of the band-shaped carrier and transported into a welding device and the band-shaped carrier is welded to the wire along the lateral edge of the carrier to produce a bimetal band. The band-shaped carrier and the edge wire are welded to one another by at least a first welding device, which is arranged on one side of the band-shaped carrier, and at least a second welding device, which is arranged on the opposite side of the band-shaped carrier.

This invention provides an effective and a method of laser processing for separating semiconductor devices formed on a single substrate (6) or separating high thickness, hard and solid substrates (6), which is rapid. During preparation of the device or substrate (6) for the cleaving/breaking/dicing procedure an area of damage (8, 11) is achieved by obtaining deep and narrow damage area along the intended line of cleaving. The laser processing method comprises a step of modifying a pulsed laser beam (1) by an focusing unit (1), such as that an “spike”-shaped beam convergence zone, more particularly an above workpiece material optical damage threshold fluence (power distribution) in the bulk of the workpiece (6) is produced. During the aforementioned step a modified area (having a “spike”-type shape) is created. The laser processing method further comprises a step of creating a number of such damage structures (8, 11) in a predetermined breaking line by relative translation of the workpiece (6) relative the laser beam (1) condensation point.

The present application describes a method for laser scribing first and second transparent electrically conductive layers (14, 14′) deposited on respective opposing first and second surfaces (12, 13) of a transparent substrate (11), the method comprising: directing a first laser beam (21) through one or more lenses (22) to a focal spot on or closely adjacent to the first surface (12) of the substrate (11), such that the focusing laser beam (21) passes through the second electrically conductive layer (14′) and the second surface (13) of the substrate (11); initiating relative movement between the first laser beam (21) and the substrate (11) in two axes in a plane orthogonal to the axis of the first laser beam (21) to scribe a first pattern in the first electrically conductive layer (14); directing a second laser beam (21′) through one or more lenses (22′) to a focal spot on or closely adjacent to the second surface (13) of the substrate (11), such that the focusing laser beam (21′) passes through the first electrically conductive layer (14) and the first surface (12) of the substrate (11), initiating relative movement between the second laser beam (21′) and the substrate (11) in two axes in a plane orthogonal to the axis of the second laser beam (21′) to scribe a second pattern in the second electrically conductive layer (14′).

A method of manufacturing a display apparatus includes: providing a substrate having a first surface and a second surface and arranging the substrate on a carrier such that the second surface of the substrate contacts the carrier; forming a display device on the first surface of the substrate; arranging a first protective film on the display device; cutting a substrate by irradiating a first short pulse laser beam onto the second surface of the substrate through the carrier; and cutting the first protective film by irradiating a laser beam of an infrared wavelength range onto an area of the first protective film that overlaps a cut area of the substrate.

Methods of separating and positioning discrete articles formed from a continuous length of articles are provided. The methods may comprise the steps of receiving a first portion of the continuous length on a first head in a receiving position of an orbit about a first rotational axis and receiving a second portion of the continuous length on a second head in the receiving position of the orbit about the first rotational axis. The methods may comprise providing a laser system configured to produce and direct a laser beam, and ablating a portion of the continuous length of articles intermediate the first head and the second head with the laser beam to separate the first portion of the continuous length of articles from the second portion of the continuous length of articles, thereby forming a discrete article on the first head.

A method and device for separating a substrate with a laser beam. The duration of the laser beam's effect is extremely short, so the substrate is only modified concentrically about the laser beam axis (Z) without it degrading the substrate material. While the laser beam acts upon the substrate, the substrate moves relative to a laser machining head, producing plural filament-type modifications along a separating surface to be incorporated. The laser beam is initially diverted by a transmission medium having a higher intensity dependent refractive index than air, then reaches the substrate. The non-constant pulsed laser intensity increases to a maximum over the temporal course of the single pulse, then reduces, and the refractive index changes. The laser beam focus point moves between the substrate's outer surfaces along the beam axis (Z), reaching the desired modification along the beam axis (Z) without correcting the laser machining head in the z-axis.

A laser machining method performing cutting machining to cut a composite material over a thickness direction thereof by applying a laser beam to the composite material. The method includes applying the laser beam from one side in the thickness direction of the composite material so as to form a first cutout in the composite material; and applying the laser beam from the other side in the thickness direction of the composite material, forming a second cutout in the composite material at a position opposing the first cutout, connecting the second cutout to the first cutout, and cutting the composite material. The first cutout is formed by applying the laser beam through a plurality of machining paths arranged in the width direction of the first cutout. The second cutout is formed by applying the laser beam through a plurality of machining paths arranged in the width direction of the second cutout.

Methods for singulating an optical waveguide material at a contour include directing a first laser beam onto a first side of the optical waveguide material to generate a first group of perforations in the optical waveguide material. A second laser beam is directed onto a second side of the optical waveguide material to generate a second group of perforations in the optical waveguide material. The second side is opposite the first side. The first group of perforations and the second group of perforations define a perforation zone at the contour. A third laser beam is directed at the perforation zone to singulate the optical waveguide material at the perforation zone.

A reflow melting system for reflow melting a metal coating on an electrical contact area of a terminal includes a laser head for emitting a laser light onto the metal coating on the terminal to heat and melt the metal coating. A remote control terminal is provided in communication with the laser head for adjusting at least one working parameter of the laser head for optimizing the melting effect of the metal coating.

A glass tube is treated with laser cutting for separating a hollow glass body from the glass tube. A laser beam used for laser cutting is focused on a wall of the glass tube.