Patent classifications
B23K26/0643
Method and device for manufacturing all-laser composite additive
Disclosed is a method for an all-laser hybrid additive manufacturing. After a matrix is obtained by means of selective laser melting forming, a subtractive forming is carried out on the matrix by means of a pulse laser to form a cavity, and the cavity is then packaged to obtain a forming material with an internal cavity structure. A laser precision packaging method is used in the method based on the melting of the laser selective region. Also disclosed is the apparatus, comprising a laser unit (2), a control unit (4) and a forming unit (6). The laser unit is in light path connection with the forming unit, and the control unit is electrically connected with the laser unit and the forming unit respectively. The laser unit comprises a first laser light source to and a second laser light source. The forming unit comprises a welding unit (68), and the welding unit is controlled by the control unit and is matched with the laser unit for the additive manufacturing.
ULTRASHORT PULSE LASER MARKING APPARATUS AND METHOD
Embodiments of an ultrashort pulse laser marking apparatus for forming indelible identifiers on discreet consumable articles, and corresponding methods, are disclosed. An ultrashort pulse laser transmission element of the apparatus is configured to transmit a beam of laser energy toward a marking zone to form an optically-readable indelible identifier on discrete consumable articles. The beam may have a pulse duration less than 10 picosecond, and a wavelength of less than 1.5 microns. The consumable articles may comprise a photoreactive pigment configured to undergo a color change upon exposure to the beam of laser energy, and the indelible identifier may be defined by the color change. Alternatively or in addition, the optical readability may be at least in part by way of a primary pattern reflected light intensity being distinguishable from a baseline reflected light intensity or from a secondary reflected light intensity from a viewpoint outward of the article.
System and method for high power diode based additive manufacturing
The present disclosure relates to a system for performing an Additive Manufacturing (AM) fabrication process on a powdered material (PM) forming a substrate. The system uses a first optical subsystem to generate an optical signal comprised of electromagnetic (EM) radiation sufficient to melt or sinter a PM of the substrate. The first optical subsystem is controlled to generate a plurality of different power density levels, with a specific one being selected based on a specific PM forming a powder bed being used to form a 3D part. At least one processor controls the first optical subsystem and adjusts a power density level of the optical signal, taking into account a composition of the PM. A second optical subsystem receives the optical signal from the first optical subsystem and controls the optical signal to help facilitate melting of the PM in a layer-by-layer sequence of operations.
Optical arrangement and laser system
An optical arrangement converts an input laser beam into a line-like output beam, which propagates along a propagation direction and which has, in a working plane, a line-like beam cross section extending along a line direction. The optical system includes: a reshaping optical unit having an input aperture, through which the input laser beam is radiated, and an elongate output aperture, elongatedly extending along an aperture longitudinal direction, the reshaping optical unit converting the input laser beam radiated through the input aperture into a beam packet exiting through the output aperture; and a homogenization optical unit which converts the beam packet into the line-like output beam, different beam segments of the beam packet being intermixed and superimposed along the line direction. The aperture longitudinal direction extends in a manner rotated about the propagation direction by a non-vanishing angle of rotation with respect to the line direction.
Processing method of workpiece with laser power adjustment based on thickness measurement and processing apparatus thereof
A processing method of a workpiece used when the workpiece is processed is provided. The processing method of a workpiece includes a disposing step of disposing the workpiece in a gas containing a substance that generates an active species that reacts with the workpiece, a measurement step of measuring the distribution of the thickness of the workpiece disposed in the gas, and a laser beam irradiation step of irradiating the workpiece in the gas with a laser beam of which the power is adjusted based on the distribution of the thickness measured in the measurement step. In the laser beam irradiation step, the removal amount by which a region irradiated with the laser beam in the workpiece is removed by the active species is controlled by irradiating the workpiece with the laser beam of which the power is adjusted.
Method and device for detecting a focal position of a laser beam
A method and a device for detecting a focal position of a laser beam, particularly a machining laser beam in a laser machining head, includes an optical element which is arranged in the laser beam converging toward the focal point and which is designed to outcouple a reflection from the laser beam path, and a sensor arrangement which is designed to detect beam characteristics of said laser beam in the region of the focal point in the laser extension direction, and which measures the outcoupled reflection of the laser beam at at least two locations that are offset to one another in the extension direction, in order to determine the current focal position.
METHOD FOR LASER MACHINING A WORKPIECE AND ASSOCIATED LASER MACHINING SYSTEM
A method of laser machining a workpiece includes the steps of: radiating a laser beam onto at least one workpiece, the laser beam having a core beam and a ring beam extending coaxially with one another, wherein the laser beam is moved over the workpiece along a pre-determined machining path, and adjusting a laser power of the core beam and/or a laser power of the ring beam as a function of a position of the laser beam on the workpiece. An associated laser machining system is also disclosed.
HEALING ENERGY BEAM FOR SMOOTHENING SURFACE IRREGULARITIES IN WELD JOINTS
A method for healing surface irregularities in a weld joint includes generating a healing energy beam by a focused energy device, where the healing energy beam includes a predefined energy density. The method also includes scanning the healing energy beam along at least a portion of a periphery of the weld joint, where the weld joint includes at least an upper layer and a lower layer. The method also includes melting less than half a thickness of the upper layer of the weld joint. The predefined energy density of the healing energy beam is based on the thickness of the upper layer of the weld joint.
LASER PROCESSING METHOD AND LASER PROCESSING DEVICE
A laser processing method for scanning over a first member in a first direction while irradiating the first member with a laser beam emitted from an oscillator, and joining the first member and a second member adjacent to the first member by a molten portion, the laser processing method including the steps of: in each of a first measurement region and a second measurement region different from the first measurement region, measuring an intensity of a welding light including any one of a heat radiation light radiated from at least one of the first member and the second member by irradiation with the laser beam, a plasma light, and a reflected light; and evaluating a processing state based on the intensity of the welding light measured in each of the first measurement region and the second measurement region, in which the first measurement region and the second measurement region are aligned in a second direction intersecting the first direction.
LASER PROCESSING APPARATUS
A laser beam applying unit in a laser processing apparatus includes a laser oscillator for emitting a laser beam, a beam condenser for focusing the laser beam emitted from the laser oscillator and applying the focused laser beam to a workpiece held on a holding table, and a scanning unit that is disposed on an optical path of the laser beam between the laser oscillator and the beam condenser and that has scanning mirrors for scanning the laser beam and guiding the scanned laser beam toward the beam condenser. The scanning mirrors are housed in a chamber having a first window for allowing the laser beam emitted from the laser oscillator to pass therethrough to the scanning mirrors and a second window for allowing the laser beam scanned by the scanning mirrors to pass therethrough to the beam condenser.