A laser processing device includes: a laser light source emitting laser light; a converging optical system converging the laser light at an object to be processed; a reflective spatial light modulator modulating the laser light such that the laser light is caused to branch into 0th order light and ±nth order light (n is a natural number) including at least first processing light and second processing light, and the first processing light is converged at a first converging point and the second processing light is converged at a second converging point; and a light blocking part blocking light to be converged at an outside with respect to the first processing light and the second processing light of the 0th order light and the ±nth order light to be converged at the object.

A radiator in a laser welding apparatus radiates a beam to a main region and an auxiliary region on a welding surface. The auxiliary region is positioned to be adjacent to the main region or to be apart from the main region. A welding direction is a direction in which a beam radiation region moves during laser welding. The auxiliary region includes at least an area positioned on a forward side of the main region in the welding direction. The radiator radiates the beam in a setting such that at least one peak occurs in each of the main region and the auxiliary region.

A radiator in a laser welding apparatus radiates a beam to a main region and an auxiliary region on a welding surface. The auxiliary region is positioned to be adjacent to the main region or to be apart from the main region. A welding direction is a direction in which a beam radiation region moves during laser welding. The auxiliary region includes at least an area positioned on a forward side of the main region in the welding direction. The radiator radiates the beam in a setting such that at least one peak occurs in each of the main region and the auxiliary region.

A spatial light modulator (SLM) including a two-dimensional (2D) array of n rows of m pixels, and a stacked drive circuit including at least one, one-dimensional (1D) array of n*m drivers monolithically integrated on the same substrate and methods of fabricating and methods of using the same in materials processing applications are provided. Generally, each pixel includes at least one modulator, and is configured to modulate light incident thereon in response to drive signals received from the stacked drive circuit. The 1D array of the stacked drive circuit includes a single row of n*m drivers arranged adjacent to and laterally separated from the 2D array of pixels. Other embodiments are also described.

There is provided a power control method for a fiber laser processing machine including: a fiber laser oscillator having a plurality of fiber laser modules each of which generates a laser beam; a laser processing head for emitting the laser beam generated from the fiber laser oscillator; and a condenser lens with a prescribed focal length provided between a workpiece and the laser processing head, for irradiating the workpiece with the laser beam having a spot diameter output from the laser processing head, wherein the number of the plurality of fiber laser modules oscillated is adjusted so as to achieve the spot diameter corresponding to the workpiece, and thereby, a beam quality from the laser processing head is adjusted.

A laser processing head is presented. The laser processing head includes a laser entry module for introducing a laser beam; a collimating module for collimating the laser beam; a scanning module for deflecting the laser beam; a focusing module for focusing the laser beam; and at least one diaphragm for increasing a scan field of the laser beam. The diaphragm comprises a diaphragm body and an opening, and is configured to limit a cross-sectional area of the laser beam by the diaphragm body. The at least one diaphragm is positioned optically downstream of the laser entry module and optically upstream of the focusing module. A laser processing system including the laser processing head is also presented. Furthermore, a method for increasing a scan field of the laser beam is also provided.

A manufacturing process of an element chip comprises a preparing step for preparing a substrate having first and second sides opposed to each other, the substrate containing a semiconductor layer, a wiring layer and a resin layer formed on the first side, and the substrate including a plurality of dicing regions and element regions defined by the dicing regions. Also, the manufacturing process comprises a laser grooving step for irradiating a laser beam onto the dicing regions to form grooves so as to expose the semiconductor layer along the dicing regions. Further, the manufacturing process comprises a dicing step for plasma-etching the semiconductor layer along the dicing regions through the second side to divide the substrate into a plurality of the element chips. The laser grooving step includes a melting step for melting a surface of the semiconductor layer exposed along the dicing regions.

An identification patch having a pattern of plasmonic resonance elements may be used to ensure that an article is counterfeit-proof. The identification patch is formed by laser-induced superplasticity to create a distinctive pattern of resonance elements that each contain a plurality of nanostructures. When the identification patch is irradiated, the pattern of resonance elements produces a unique spectral response that is associated only with the counterfeit-proof article. The counterfeit-proof article may be a metal component or an integrated circuit. The resonant absorption of the plasmonic resonance elements may be measured to verify the authenticity of the article before use of the article.

A laser etching apparatus includes a chamber, a laser port, a laser emitter, a particle grabber, and a revolving window module. The chamber is configured to receive a substrate. The laser port is disposed below the chamber in a downward direction. The laser emitter is configured to emit a laser to the substrate disposed within the chamber through the laser port. The particle grabber is disposed within the chamber and includes a body disposed over the laser port. An opening is formed through the body. The opening is configured to pass the laser therethrough. The revolving window module includes a revolving window and a driving part configured to drive the revolving window. The revolving window is disposed between the particle grabber and the laser port.

A laser etching apparatus includes a chamber, a laser port, a laser emitter, a particle grabber, and a revolving window module. The chamber is configured to receive a substrate. The laser port is disposed below the chamber in a downward direction. The laser emitter is configured to emit a laser to the substrate disposed within the chamber through the laser port. The particle grabber is disposed within the chamber and includes a body disposed over the laser port. An opening is formed through the body. The opening is configured to pass the laser therethrough. The revolving window module includes a revolving window and a driving part configured to drive the revolving window. The revolving window is disposed between the particle grabber and the laser port.