Patent classifications
B23K26/0676
LASER WELDED JOINT AND LASER WELDING METHOD
The present invention has as its object to provide a laser welded joint excellent in joint strength preventing a bead from cracking and comprised of exactly the number of weld beads required for joint strength and a laser welding method for the same in overlay laser welding of steel sheets forming multiple ring-shaped weld beads. The present invention is a laser welded joint excellent in joint strength preventing a bead from cracking and comprised of exactly the number of weld beads required for joint strength in overlay laser welding of steel sheets forming multiple ring-shaped weld beads, produced by a step of overlaying a plurality of metal sheets and forming a first weld bead and a step of firing a laser beam to successively form a further two or more weld beads at the outside of the first weld bead by laser irradiation, the surface hardness of the weld bead increasing from the inside bead to the outside bead.
LASER IRRADIATION DEVICE
A laser irradiation device may include: a laser device configured to emit a pulse laser beam; beam scan optics configured to allocate the pulse laser beam emitted from the laser device to optical paths; beam homogenizers provided in the respective optical paths, each of the beam homogenizers being configured to homogenize distribution of light intensity of the pulse laser beam allocated to a corresponding optical path of the optical paths; and a controller configured to control the beam scan optics to allocate, for each pulse, the pulse laser beam emitted from the laser device to the corresponding optical path of the optical paths.
LASER PROCESSING METHOD AND LASER PROCESSING DEVICE AND SEALED TYPE BATTERY
Provided is a laser processing method including overlapping a plurality of plate-shaped members that include a first plate-shaped member disposed on one end side of an overlapping direction and a second plate-shaped member disposed on the other end side of the overlapping direction; branching a laser beam into a first branched laser beam and a second branched laser beam; irradiating the first plate-shaped member with the first branched laser beam and the second branched laser beam in a state where the first branched laser beam and the second branched laser beam are emitted in parallel; forming line-shaped melting portions on the first plate-shaped member by moving the branched laser beams in a direction intersecting a direction in which the branched laser beams are aligned; and joining overlapped plate-shaped members in a state where the melting portion formed by using the first branched laser beam and the melting portion formed by using the second branched laser beam are connected to each other in the second plate-shaped member and the melting portions do not penetrate the second plate-shaped member.
PROCESSING OPTICAL UNIT, LASER PROCESSING APPARATUS AND METHOD FOR LASER PROCESSING
A processing optical unit for workpiece processing includes a birefringent polarizer configured to split at least one input laser beam into a pair of partial beams polarized perpendicularly to one another. The processing optical unit further includes a focusing optical unit arranged downstream of the birefringent polarizer in the beam path and configured to focus the pair of partial beams onto focus zones in a focal plane. The processing optical unit is configured to produce at least partly overlapping focus zones of the pair of partial beams.
MICROLENS ARRAYS FOR PARALLEL MICROPATTERNING
Disclosed herein are systems and methods for using microlens arrays for parallel micropatterning of features. In some embodiments, a system includes a laser that emits a laser beam, a beam homogenizer configured to shape the laser beam into a shaped laser beam having a beam profile, and a lenslet array. The beam homogenizer shapes the laser beam such that at least a portion of the beam profile is substantially uniform in power. The lenslets of the lenslet array have the same shape and each receive a respective portion of the shaped laser beam to output a plurality of laser sub-beams. The plurality of laser sub-beams can be directed toward one or more layers of material to generate or modify a plurality of features on the one or more layers in parallel.
Laser cladding method and device for implementing same
A method and device for laser cladding by independently heating the cladding material and the surface of the workpiece consist in formation of the series of parallel annular laser beams, possibly different wavelengths, with an adjustable distribution of laser radiation power across the annular beams. The annular beams are transformed into a series of conical beams which are separately focused along a single optical axis, along which the cladding material is fed. The device can be supplemented with a cylindrical mirror for the multipass laser radiation through the stream of cladding material with the possibility of the laser radiation return to the laser resonator.
LASER PROCESSING METHOD AND METHOD OF MANUFACTURING DISPLAY APPARATUS
Provided are a laser processing method capable of performing various types of processing while reducing a need to change components and method of manufacturing a display apparatus by using the laser processing method. The laser processing method includes: splitting a laser beam emitted from a laser beam source into a plurality of laser beams by using a laser beam splitter; and transmitting at least two of the plurality of laser beams through a position adjustment equipment that is on paths of the at least two laser beams in order to adjust a distance between the at least two laser beams by using a difference between a refractive index of an element of the position adjustment equipment and a refractive index of a peripheral environment.
WELDING EQUIPMENT
A welding equipment used to form two welding structures in two target locations of an electronic device is disclosed to include a laser generating device for generating a laser pulse beam, a radiation device scanning the two target locations, and an adjusting device equipped with a beam splitting system for receiving and processing the laser pulse beam. The beam splitting system separates the laser pulse beam into a reflected beam and a penetrating beam to control a radiation angle of the reflected beam and the penetrating beam, and project the reflected beam and the penetrating beam to the radiation device coaxially, so that the radiation device radiates the reflected beam and the penetrating beam coaxially to the two target locations to form the two welding structures. The radiation angle is related to relative positions of the two target locations.
LASER DRILLING OF METAL FOILS FOR ASSEMBLY IN AN ELECTROLYTIC CAPACITOR
A capacitor and methods of processing an anode metal foil are presented. The capacitor includes a housing, one or more anodes disposed within the housing, one or more cathodes disposed within the housing, one or more separators disposed between an adjacent anode and cathode, and an electrolyte disposed around the one or more anodes, one or more cathodes, and one or more separators within the housing. The one or more anodes each include a metal foil that includes a first plurality of tunnels through a thickness of the metal foil in a first ordered arrangement, the first ordered arrangement being a close packed hexagonal array arrangement, and having a first diameter, and a second plurality of tunnels through the thickness of the metal foil having a second ordered arrangement and a second diameter greater than the first diameter.
Apparatus and method for producing microperforated patches and labels applicable to modified atmosphere packaging
An apparatus and method for producing microperforated patches for MAP includes drilling or punching microperforations through continuously advancing label stock. Holes can be drilled by at least one microperforating laser traversed across the label stock as it advances, a laser beam deflected or split using a servo-driven galvanometer, beam splitters, or a plurality of mirrors, or by drills mounted into a rotating die cylinder across which the stock passes as it is advanced. Numbers and sizes of microperforations can be adjusted by manipulation of laser control parameters, or by exchange of die cylinders. The laser can be a CO2 laser with between 10 W and 100 W output. The drills can be carbide drills. The label stock is typically 6-18 inches wide, and can include an adhesive covered by a release sheet. The stock to be microperforated can include separate rows of labels or can be suitable for die-cutting after microperforation.