The present disclosure discloses a laser cutting base and a laser cutting device. The laser cutting base includes a base body, a recess and a filling structure. The base body includes a first surface configured to fixedly mount an element to be cut. The recess is formed by recessed inwardly from the first surface and corresponds to a position of a cutting line. The filling structure is filled in the recess and is able to prevent debris in the recess during cutting process from rebounding to the element to be cut.

A laser processing apparatus includes a laser beam applying unit. The laser beam applying unit includes a laser oscillator for oscillating a laser beam, a focusing lens for focusing the laser beam to apply the laser beam to a wafer, a first optical path changing part, a second optical path changing part, and a controller. The first optical path changing part has a pair of first-axis resonant scanners which are disposed on the downstream side with respect to the propagating direction of the laser beam oscillated from the laser oscillator and which change the optical path of the laser beam into a Y-axis direction. The second optical path changing part has a pair of second-axis resonant scanners which are disposed between the first optical path changing part and the focusing lens and which change the optical path of the laser beam into an X-axis direction.

A method of forming a film cooling hole in a component having an internal surface and an external surface is disclosed herein that includes forming the component with a first feature on the external surface, measuring a geometry of the external surface to determine a first placement of the first feature, and drilling the film cooling hole through the component at the first placement.

A method and associated system are provided for producing a perforation line between adjacent lottery tickets in an automated production line wherein a substrate having lottery tickets printed thereon is conveyed through a perforation station in the production line. A perforation machine in the line is controlled to define a perforation line between the adjacent lottery tickets. The controlling process includes inputting control variables into a controller associated with the perforation machine, the control variables relating to conditions that determine a desired perforation profile of the perforation line. The controller programs the perforation machine with a specific perforation profile for the perforation line that is generated based on the entered control variables, and changes the perforation profile upon inputting of different values for the control variables. The perforation profile is specifically tailored to the control variables between different ticket production runs, or between tickets in the same ticket production run.

A method and associated system are provided for producing a perforation line between adjacent lottery tickets in an automated production line wherein a substrate having lottery tickets printed thereon is conveyed through a perforation station in the production line. A perforation machine in the line is controlled to define a perforation line between the adjacent lottery tickets. The controlling process includes inputting control variables into a controller associated with the perforation machine, the control variables relating to conditions that determine a desired perforation profile of the perforation line. The controller programs the perforation machine with a specific perforation profile for the perforation line that is generated based on the entered control variables, and changes the perforation profile upon inputting of different values for the control variables. The perforation profile is specifically tailored to the control variables between different ticket production runs, or between tickets in the same ticket production run.

A laser processing apparatus and a laser processing method that can effectively prevent a processing time for one semiconductor film from increasing are provided. A laser processing apparatus (1) according to an embodiment includes a laser light source (2) configured to irradiate a semiconductor film (M1) with a laser beam, a film state measuring instrument (5) configured to measure a state of the semiconductor film after the semiconductor film (M1) is irradiated with the laser beam, and a laser light adjusting mechanism configured to adjust a timing at which the semiconductor film (M1) is irradiated with a next laser beam and intensity of the laser beam according to the state of the semiconductor film (M1) measured by the film state measuring instrument (5).

A laser processing apparatus and a laser processing method that can effectively prevent a processing time for one semiconductor film from increasing are provided. A laser processing apparatus (1) according to an embodiment includes a laser light source (2) configured to irradiate a semiconductor film (M1) with a laser beam, a film state measuring instrument (5) configured to measure a state of the semiconductor film after the semiconductor film (M1) is irradiated with the laser beam, and a laser light adjusting mechanism configured to adjust a timing at which the semiconductor film (M1) is irradiated with a next laser beam and intensity of the laser beam according to the state of the semiconductor film (M1) measured by the film state measuring instrument (5).

The present invention presents a method of fabrication for a physiological sensor with electronic, electrochemical, and chemical components. The fabrication method comprises steps for manufacturing an apparatus comprising at least one electrochemical sensor, a microcontroller, and a transceiver. The fabrication process includes the steps of substrate fabrication, circuit fabrication, pick and place, reflow soldering, electrode fabrication, membrane fabrication, sealing and curing, layer bonding, and dressing. The physiological sensor is operable to analyze biological fluids such as sweat.

The present invention presents a method of fabrication for a physiological sensor with electronic, electrochemical, and chemical components. The fabrication method comprises steps for manufacturing an apparatus comprising at least one electrochemical sensor, a microcontroller, and a transceiver. The fabrication process includes the steps of substrate fabrication, circuit fabrication, pick and place, reflow soldering, electrode fabrication, membrane fabrication, sealing and curing, layer bonding, and dressing. The physiological sensor is operable to analyze biological fluids such as sweat.

An interposer for electrical connection between a CPU chip and a circuit board is provided. The interposer includes a board-shaped base substrate made of glass having a coefficient of thermal expansion ranging from 3.110.sup.6/K to 3.410.sup.6/K. The interposer further includes a number of holes having diameters ranging from 20 m to 200 m. The number of holes ranging from 10 to 10,000 per square centimeter. Conductive paths running on one surface of the board extend right into respective holes and therethrough to the other surface of the board in order to form connection points for the chip.