Embodiments of a method of forming one or more holes in a substrate for use as a process chamber component are provided herein. In some embodiments, a method of forming one or more holes in a substrate for use as a process chamber component include forming the one or more holes in the substrate with one or more laser drills using at least one of a percussion drilling, a trepanning, or an ablation process, wherein each of the one or more holes have an aspect ratio of about 1:1 to about 50:1, and wherein the substrate is a component for gas delivery or fluid delivery.

Embodiments of a method of forming one or more holes in a substrate for use as a process chamber component are provided herein. In some embodiments, a method of forming one or more holes in a substrate for use as a process chamber component include forming the one or more holes in the substrate with one or more laser drills using at least one of a percussion drilling, a trepanning, or an ablation process, wherein each of the one or more holes have an aspect ratio of about 1:1 to about 50:1, and wherein the substrate is a component for gas delivery or fluid delivery.

The invention, according to an aspect thereof, relates to a device (60) for laser micromachining a sample made of a given material, which includes a focusing module enabling a nondiffracting beam to be generated from a given incident beam, said nondiffracting beam being focused along a focusing cylinder that is oriented generally along the optical axis of the focusing module, means (601) for transmitting at least one first light pulse (11) suitable for generating, after said focusing module focuses in the sample, a plasma of free charges by multiphotonic absorption in a volume of the sample located on the side surface of said focusing cylinder.

The invention, according to an aspect thereof, relates to a device (60) for laser micromachining a sample made of a given material, which includes a focusing module enabling a nondiffracting beam to be generated from a given incident beam, said nondiffracting beam being focused along a focusing cylinder that is oriented generally along the optical axis of the focusing module, means (601) for transmitting at least one first light pulse (11) suitable for generating, after said focusing module focuses in the sample, a plasma of free charges by multiphotonic absorption in a volume of the sample located on the side surface of said focusing cylinder.

A method for manufacturing an electronic apparatus, includes: providing a preliminary electronic module including an active area having a hole-forming area, and a peripheral area adjacent to the active area; emitting a laser beam while rotating a laser source along a moving path defined along a boundary between the hole-forming area and the active area, the moving path being divided into a first section and a second section; and removing the hole-forming area from the preliminary electronic module to form an electronic module having a module hole. During a first rotation of the laser source along the moving path, the laser beam is not emitted on the first section, and the laser beam is emitted on the second section.

A method for manufacturing a member having a through hole includes a primary formation step, an intensity determination step, a laser modulation step, and a secondary formation step. The primary formation step includes radiating a laser beam to a workpiece member to form a pilot hole having a smaller inner diameter than the through hole while receiving light from the workpiece member at a light detection unit. The intensity determination step includes determining whether a light intensity is equal to or less than a predetermined threshold value. The laser modulation step includes modulating a spatial light phase of the laser beam the intensity of the light is equal to or less than the predetermined threshold value. The secondary formation step includes radiating the laser beam having the modulated spatial light phase to a peripheral part of the pilot hole to form the through hole.

A method for manufacturing a member having a through hole includes a primary formation step, an intensity determination step, a laser modulation step, and a secondary formation step. The primary formation step includes radiating a laser beam to a workpiece member to form a pilot hole having a smaller inner diameter than the through hole while receiving light from the workpiece member at a light detection unit. The intensity determination step includes determining whether a light intensity is equal to or less than a predetermined threshold value. The laser modulation step includes modulating a spatial light phase of the laser beam the intensity of the light is equal to or less than the predetermined threshold value. The secondary formation step includes radiating the laser beam having the modulated spatial light phase to a peripheral part of the pilot hole to form the through hole.

The invention relates to a drilling device comprising a light source configured to provide a light beam and a diffractive beam propagation device having a substantially planar surface, wherein the light source is configured such that the light beam is incident on the planar surface of the diffractive beam propagation device, and wherein the diffractive beam propagation device is configured to propagate the light beam as one or more propagated beams such that the one or more propagated beams, at least when being integrated over time, surround an area with a substantially circular shape. A use of the drilling device for drilling a hole in a work piece and a method suitable for drilling a hole in a work piece are also provided.

The invention relates to a drilling device comprising a light source configured to provide a light beam and a diffractive beam propagation device having a substantially planar surface, wherein the light source is configured such that the light beam is incident on the planar surface of the diffractive beam propagation device, and wherein the diffractive beam propagation device is configured to propagate the light beam as one or more propagated beams such that the one or more propagated beams, at least when being integrated over time, surround an area with a substantially circular shape. A use of the drilling device for drilling a hole in a work piece and a method suitable for drilling a hole in a work piece are also provided.

A laser is used to form openings within a graft material to selectively enhance permeability of a prosthesis for tissue integration therein. A feature of utilizing a laser to create the openings for tissue integration builds from its tunability. More particularly, the laser precisely places openings in any pattern and location, and on any textile that forms the graft material. Further, the power and focus of the laser is precisely adjusted to control the diameter and shape of the openings. All parameters of the openings can be controlled at will, allowing for the opportunity to selectively enhance and optimize the permeability of the graft material in a vessel.