Provided is a laminate that includes a thin-film structure having a fine concave-convex structure at its surface, can be distributed on the market so that the thin-film structure is usable by a customer without staining or fracturing, and can be prevented from degradation even after storage. A laminate comprises a thin-film structure and holding films, wherein a first holding film is laminated on one surface of the thin-film structure and a second holding film is laminated on the other surface of the thin-film structure, the thin-film structure has fine concave-convex structures at both surfaces, and 0<P1, 0<P2, and P1P2, where P1 is a peel force at an interface between the first holding film and the thin-film structure and P2 is a peel force at an interface between the second holding film and the thin-film structure.

A process for forming a construction composite, the process comprising (i) providing a construction article having an adhesive coating layer of a curable pressure-sensitive adhesive; and (ii) subjecting the curable pressure-sensitive adhesive to UV radiation, where the amount of UV radiation imparted to the upper surface of the adhesive coating layer is from about 75 to about 125 millijoule/cm2, and where at least 60% of the radiation rays contributing to this power have an intensity of at least 200 milliWatts/cm2.

The invention relates to methods of bonding and a conductively bonded joint, provided by high loadings of conductively coated nano scale particulate fillers in a conductive adhesive in combination with a conductive intermediary structure, more particularly to a lightning strike resilient bonded joint between fibre reinforced polymer composites. A method of joining a first fibre reinforced polymer composite surface and a second fibre reinforced polymer composite surface, comprising the steps of providing a conductive intermediary structure between said first and second surfaces, filling the void between said surfaces and enveloping said intermediary structure with a conductive adhesive, curing the conductive adhesive to form a bonded first and second surface. A conductive adhesive comprising a curable binder and a high aspect ratio nanoscale carbon particulate filler present in the range of from 0.1 to 40% wt, wherein said particulate filler comprises a metal coating.

Methods for applying high shrink wrap labels to a shaped article are disclosed. The leading edge of the label is bonded to the article. A seaming agent is applied, and the label is wrapped around the article. The seaming agent is then exposed to radiation to cure the seaming agent, and the label is then exposed to heat to cause heat-shrinking. The label is made of a film with at least one external layer that has a Hildebrand solubility parameter. The seaming agent includes a component having a Hildebrand solubility parameter that is within 2.2 MPa.sup.1/2 or within 4.4 calories.sup.1/2.Math.cm.sup.3/2 of the Hildebrand solubility parameter of the external layer of the film. The seaming agent also has a viscosity of at least 1 centipoise and less than 1000 centipoise when measured at any temperature between ambient temperature and 60 C. Articles including such affixed high shrink wrap labels are also disclosed.

A method for creating a termination by attaching some kind of fitting to the end of a tensile member such as a cable. The end fitting is provided with one or more internal cavities. Each cavity has a proximal portion that is adjacent to the area where the tensile member exits the fitting and a distal portion on its opposite end. A length of the tensile member's filaments is placed within this expanding cavity and infused with liquid potting compound. The method exploits the characteristic of a liquid potting compound as it transitions to a solid. Once the potting compound in at least a portion of the cavity has transitioned sufficiently to hold the filaments at a desired level, tension is placed on the tensile member and a small linear displacement may be imposed on the tensile member. This linear displacement tends to pull the filaments residing in the potting compound into better alignment and improve load sharing. The invention can be applied to single fittings having multiple cavities and to multiple fittings having only one cavity per fitting.

Imprinted substrates are often used to produce miniaturized devices for use in electrical, optic and biochemical applications. Imprinting techniques, such as nanoimprinting lithography, may leave residues in the surface of substrates that affect bonding and decrease the quality of the produced devices. An imprinted substrate with residue-free region, or regions with a reduced amount of residue for improved bonding quality is introduced. Methods to produce imprinted substrates without residues from the imprinting process are also introduced. Methods include physical exclusion methods, selective etching methods and energy application methods. These methods may produce residue-free regions in the surface of the substrate that can be used to produce higher strength bonding.

A unit (10) for the regulation or control of a fluid pressure, having at least one housing section (13, 14) and a switching film (22) connected to the at least one housing section (13, 14) for switching at pressure differentials relative to an ambient pressure acting on the switching film (22), and for the regulation, release or blocking of a flow of the fluid between an inlet (28) and a discharge (30) for the fluid. The switching film (22) is made out of a polymer material having fluorine and carbon, in particular a thermoplastic having fluorine and carbon. In this arrangement, a hole cross-section (40) of the at least one housing section (13, 14) is closed off by the switching film (22).

The invention relates to a process (100) for manufacturing an object (1) made of thermoplastic polymer composite from at least two parts (10) made of thermoplastic polymer composite, said thermoplastic polymer composite comprising a fibrous reinforcement and a thermoplastic polymer matrix, said process comprising the steps of:

arranging (120) the two parts (10) made of thermoplastic polymer composite adjacently or overlapping at an assembly interface zone (11), and

heating (130) to melt the thermoplastic polymer matrix at said assembly interface zone (11), so as to form an object (1) made of thermoplastic polymer composite comprising a welded interface (12).

In a process for the manufacture of an impermeable connection between at least two fluid carrying silicone hose components, the silicone hose components and a silicone connector component are first prepared. Afterwards a fluid silicone mass is applied to at least one connecting area where the silicone hose components abut on the silicone connector components. The at least one connecting area is post cured to harden the silicone mass. In a fluid carrying assembly with at least two fluid carrying silicone hose components and at least one silicone connector component, a fluid carrying connection is manufactured between these components by means of this process. This design results in a connecting technique that is, on the one hand, secure and, on the other hand, enables automation of the manufacture of an impermeable connection and thus of the fluid carrying assembly.

A method for producing a component from two or more sub-components includes the steps of: producing each of the sub-components using an additive manufacturing process in which a resin, which is radiant-energy-curable, is partially cured using a selective application of radiant energy, wherein each sub-component includes a joint surface in which the resin is partially cured which is cured to a lesser degree than the remainder of the respective sub-component, so as to leave the joint surfaces in a condition suitable for bonding; assembling the sub-components with their respective joint surfaces in mutual contact; and performing a secondary cure of the partially-cured resin at the joint surfaces using an application of radiant energy, so as to further cure the partially-cured resin and bond the sub-components to each other, thereby forming the component.