A gate electrode is formed inside a trench via a gate insulating film. The gate insulating film formed on a semiconductor substrate is removed. An insulating film is formed on the semiconductor substrate. A p-type base region is formed in the semiconductor substrate. An n-type emitter region is formed in the base region. Hydrogen annealing process is performed to the semiconductor substrate. A boundary between the base region and the emitter region is located at a position deeper than the insulating film formed between a side surface of the trench and the gate insulating film.

A semiconductor device includes: a drift region of a first conductivity type between first and second surfaces of a semiconductor body; a first region of a second conductivity type at the second surface; and a field stop region of the first conductivity type between the drift region and first region. The field stop region includes first and second sub-regions with hydrogen related donors. A p-n junction separates the first region and first sub-region. A concentration of hydrogen related donors, along a first vertical extent of the first sub-region, steadily increases from the pn-junction to a maximum value, and steadily decreases from the maximum value to a value at a first transition between the sub-regions. A second vertical extent of the second sub-region ends at a second transition to the drift region where the concentration of hydrogen related donors equals 10% of the value at the first transition.

The invention provides a semiconductor structure, the semiconductor structure includes a substrate, two shallow trench isolation structures are located in the substrate, a first region, a second region and a third region are defined between the two shallow trench isolation structures, the second region is located between the first region and the third region. Two thick oxide layers are respectively located in the first region and the third region and directly contact the two shallow trench isolation structures respectively, and a thin oxide layer is located in the second region, the thickness of the thick oxide layer in the first region is greater than that of the thin oxide layer in the second region.

A method of fabricating semiconductor fins, including, patterning a film stack to produce one or more sacrificial mandrels having sidewalls, exposing the sidewall on one side of the one or more sacrificial mandrels to an ion beam to make the exposed sidewall more susceptible to oxidation, oxidizing the opposite sidewalls of the one or more sacrificial mandrels to form a plurality of oxide pillars, removing the one or more sacrificial mandrels, forming spacers on opposite sides of each of the plurality of oxide pillars to produce a spacer pattern, removing the plurality of oxide pillars, and transferring the spacer pattern to the substrate to produce a plurality of fins.

Embodiments disclosed herein include transistor devices with depopulated channels. In an embodiment, the transistor device comprises a source region, a drain region, and a vertical stack of semiconductor channels between the source region and the drain region. In an embodiment, the vertical stack of semiconductor channels comprises first semiconductor channels, and a second semiconductor channel over the first semiconductor channels. In an embodiment, first concentrations of a dopant in the first semiconductor channels are less than a second concentration of the dopant in the second semiconductor channel.

In some implementations, a method may include forming a multi-layer stack over a substrate. The multi-layer stack has alternating layers of first semiconductor layers and second semiconductor layers. Additionally, the device may include removing the first semiconductor layers in a first region of the substrate. The device may also include forming a disposable material between the second semiconductor layers in the first region. Moreover, the device may include forming source/drain regions adjacent to the second semiconductor layers and the disposable material in the first region. Finally, the device may include replacing the disposable material in the first region with metal gate structures.

The present application discloses a method for making an integrated structure of an MOS transistor having different operation voltages. The resulting integrated structure of an MOS transistor employs a hybrid gate solution. A resulting low voltage MOS transistor adopts a high-K metal gate, so that the gate leakage of the LV (low voltage) MOS transistor can be reduced and speed performance is maintained; and a resulting medium voltage MOS transistor and a high voltage MOS transistor adopt a poly gate, the gate oxide is a single oxide, and a high-K film (HK film) is not present, so that the resulting medium voltage MOS transistor and high voltage MOS transistor are highly reliable without any other reliability problems due to the introduction of a high-K film (HK film) and a gate metal film.

In a method of manufacturing a semiconductor device, a first-conductivity type implantation region is formed in a semiconductor substrate, and a carbon implantation region is formed at a side boundary region of the first-conductivity type implantation region.

An integrated circuit includes a dielectric isolation structure formed at a surface of a semiconductor substrate and a polysilicon resistor body formed on the dielectric isolation structure. The polysilicon resistor body includes an N-type dopant having an N-type dopant concentration, nitrogen having a nitrogen concentration, and carbon having a carbon concentration. The sheet resistance of the resistor body is greater than 5k/square.

The disclosure relates to a type trench gate silicon carbide MOSFET device and a fabrication method thereof. To protect a trench gate oxide layer without increasing a channel resistance and process complexity, a second conductivity type of heavily doped deep well inserted with double gate trenches along the sidewalls of deep well is designed. The deep well is connected to the source metal directly. The electric potential is clamped to the source during the voltage blocking and turn-off state, which reduces the electric field in the gate oxide and reduces the miller capacitance. An interlayer dielectric layer is deposited above the conductive dielectric polysilicon layers and extends outward separately to cover a part of the source region. A smaller cell pitch can be achieved by controlling the spacing between the first and the second trench gate, thereby increasing the channel density and reducing the channel resistance.