A method of forming a layer includes introducing a Group III precursor in a reactor, introducing a hydride Group V precursor in the reactor, and introducing a metal-organic Group V precursor in the reactor to form the layer. The method can further include mixing the hydride Group V precursor and the metal-organic Group V precursor. Advantageously, the layer and method of forming the layer utilize mixed Group V precursors, improve uniformity, decrease thermal sensitivity of the end material, normalize concentration profiles of precursors, improve yield, increase manufacturing efficiency, improve control of III-V ratios (e.g., pressure, growth rate, flux), and reduce manufacturing costs.

A method for depositing an oxide film on a substrate by a cyclical deposition is disclosed. The method may include: depositing a metal oxide film over the substrate utilizing at least one deposition cycle of a first sub-cycle of the cyclical deposition process; and depositing a silicon oxide film directly on the metal oxide film utilizing at least one deposition cycle of a second sub-cycle of the cyclical deposition process. Semiconductor device structures including an oxide film deposited by the methods of the disclosure are also disclosed.

Exemplary methods of forming a silicon-and-carbon-containing material may include flowing a silicon-oxygen-and-carbon-containing precursor into a processing region of a semiconductor processing chamber. A substrate may be housed within the processing region of the semiconductor processing chamber. The methods may include forming a plasma within the processing region of the silicon-and-carbon-containing precursor. The plasma may be formed at a frequency less than 15 MHz (e.g., 13.56 MHz). The methods may include depositing a silicon-and-carbon-containing material on the substrate. The silicon-and-carbon-containing material as-deposited may be characterized by a dielectric constant below or about 3.5 and a hardness greater than about 3 Gpa.

A method of filling a gap on a surface of a substrate is provided. The method may comprise (a) placing a substrate on a susceptor within a reaction chamber, the substrate comprising a gap; (b) a deposition step comprising: flowing a carbon precursor into the reaction chamber; and exposing the carbon precursor to a plasma, wherein the carbon precursor reacts to form a first deposited material; and (c) a treatment step comprising: annealing the substrate in an atomic oxygen-containing gas to cause the first deposited material to flow within the gap for forming a carbon film.

A method of manufacturing a semiconductor device including providing a first precursor on a substrate to adsorb a first element of the first precursor onto a first region of the substrate, providing a second precursor on the substrate to adsorb a second element of the second precursor onto a second region of the substrate, the second region being different from the first region, and providing a reactant including oxygen on the substrate to form an oxide semiconductor layer including the first element of the first precursor, the second element of the second precursor, and the oxygen of the reactant may be provided.

A processing method includes forming an interfacial layer on a surface of a channel comprising silicon (Si) located between a source and a drain on a semiconductor substrate including a low- dielectric layer, and selectively depositing a high- dielectric layer directly on the interfacial layer relative to the low- dielectric layer by exposing the semiconductor substrate to a metal-containing precursor, a purge gas, an alcohol, and the purge gas.

Methods for selective deposition are provided. Material is selectively deposited on a first surface of a substrate relative to a second surface of a different material composition. An inhibitor, such as a polyimide layer, is selectively formed from vapor phase reactants on the first surface relative to the second surface. A layer of interest is selectively deposited from vapor phase reactants on the second surface relative to the first surface. The first surface can be metallic while the second surface is dielectric. Accordingly, material, such as a dielectric transition metal oxides and nitrides, can be selectively deposited on metallic surfaces relative dielectric surfaces using techniques described herein.

A method includes removing a dummy gate stack to form a trench between gate spacers, and removing a sacrificial layer contacting a semiconductor region. The sacrificial layer and the semiconductor region are in the trench. The method further includes depositing a gate dielectric into the trench and on the semiconductor region, depositing a liner on the gate dielectric, depositing a fluorine-containing layer over the liner, performing a drive-in process to drive fluorine in the fluorine-containing layer into the gate dielectric, and depositing a conductive layer over the gate dielectric.

Embodiments of the present disclosure generally relate to a method of processing a substrate. The method includes exposing the substrate positioned in a processing volume of a processing chamber to a hydrocarbon-containing gas mixture, exposing the substrate to a boron-containing gas mixture, and generating a radio frequency (RF) plasma in the processing volume to deposit a boron-carbon film on the substrate. The hydrocarbon-containing gas mixture and the boron-containing gas mixture are flowed into the processing volume at a precursor ratio of (boron-containing gas mixture/((boron-containing gas mixture)+hydrocarbon-containing gas mixture) of about 0.38 to about 0.85. The boron-carbon hardmask film provides high modulus, etch selectivity, and stress for high aspect-ratio features (e.g., 10:1 or above) and smaller dimension devices (e.g., 7 nm node or below).

Methods for depositing a boron nitride film on a substrate are disclosed. More particularly, the disclosure relates to methods that can be used for depositing a boron nitride film by a PECVD process. The method comprises providing a substrate into a reaction chamber, and executing a cyclical deposition process comprising a plurality of deposition cycles, ones from the plurality of deposition cycles including providing a boron precursor into the reaction chamber and providing a deposition plasma gas into the reaction chamber.