A thermal conduction sheet holder include, in the following order, an elongated carrier film, a plurality of thermal conduction sheets, and an elongated cover film covering the plurality of thermal conduction sheets, the shortest distance between adjacent thermal conduction sheets is 2 mm or more, the plurality of thermal conduction sheets are disposed at intervals in a longitudinal direction of the carrier film and the cover film, and the plurality of thermal conduction sheets are peelable from the cover film and the carrier film.

An integrated circuit assembly may be fabricated to include an integrated circuit device having a backside surface and a metal matrix composite layer on the backside surface, wherein the metal matrix composite layer has a filler material disposed therein that has a graded content to reduce the coefficient of thermal expansion at the backside surface of the integrated circuit device. The filler material may have at least two filler material particle constituents having different particle diameters, wherein a first filler material particle constituent that has the smaller average diameter is closest to the backside surface of the integrated circuit device and wherein a second filler material constituent that has the larger average diameter is farthest from the backside surface of the integrated circuit device.

A porous mesh structure for use in the thermal management of integrated circuit devices may be formed as a solid matrix with a plurality of pores dispersed therein, wherein the solid matrix may be a plurality of fused matrix material particles and the plurality of pores may comprise between about 10% and 90% of a volume of the porous mesh structure. The porous mesh structure may be formed on an integrated circuit device and/or on a heat dissipation assembly component, and may be incorporated into an immersion cooling assembly, wherein the porous mesh structure may act as a nucleation site for a working fluid in the immersion cooling assembly.

A graphite-copper composite material that includes a copper layer having an average thickness of 15 m or less and scaly graphite particles laminated with the copper layer interposed therebetween. The graphite-copper composite material has a copper volume fraction of 3 to 20%. The graphite-copper composite material further has: (A) copper crystal grains of the copper layer having an average grain size of 2.8 m or less, a mass fraction of Al of less than 0.02%, and a mass fraction of Si of less than 0.04%, or (B) an interfacial gap of the copper layer and the scaly graphite particles of 150 nm or less.

A phase change thermal interface material including a thermally conductive filler, a phase change wax, a coupling agent, and a polymer matrix material. The thermally conductive filler includes from about 50 wt. % to about 70 wt. % aluminum powder; from about 19 wt. % to about 30 wt. % aluminum oxide; and from about 1 wt. % to about 9 wt. % zinc oxide, based on the total weight of the phase change thermal interface material. The phase change thermal interface material has a thermal impedance from about 0.02 Ccm.sup.2/W to about 0.04 Ccm.sup.2/W, as determined by ASTM D5470.

Method for manufacturing a thermal interface film, the method comprising: providing a template comprising a plurality of openings through the template; arranging graphene fibers through the openings; attaching a support plate on at least one side of the template such that the graphene fibers are attached to the support plate; removing the template to expose the graphene fibers; infiltrating the graphene fibers with a polymer material to form a block of polymer infiltrated graphene fibers; and cutting the block of polymer infiltrated graphene fibers along a direction perpendicular to the extension of the graphene fibers to form a thermal interface film.

A transistor includes a substrate having a first surface and a second surface that are opposite to each other. An active layer is disposed on a side of the first surface, and a metal layer is disposed on a side of the second surface. A hole penetrates the substrate and at least a part of the active layer, where in a direction from the substrate to the active layer, the hole includes a first hole segment and a second hole segment, a joint between the first hole segment and the second hole segment has a connection interface, and a hole diameter of the first hole segment is greater than a hole diameter of the second hole segment. A conducting layer is formed on a wall surface of each of the first hole segment and the second hole segment, and the conducting layer is electrically connected to the metal layer.

A heat radiation structure includes a mesh that abuts on a surface of a die, and a vapor chamber that interposes the mesh between the surface of the die and the vapor chamber. The mesh includes a heat generation element abutting range portion that is provided at a central portion of the mesh, is impregnated with a liquid metal, and abuts on the surface of the die to receive heat, and a pair of heat generation element non-abutting range portions that continuously extends from both sides of the heat generation element abutting range portion and does not abut on the surface of the die. Each of the pair of heat generation element non-abutting range portions is fixed to the vapor chamber via a sheet material. Each of a pair of the heat generation element non-abutting range portions is interposed between a pair of the sheet materials.

A temperature regulation unit (10) includes a plurality of stacked porous metal structures (for example, metal fiber structures (40, 42)) each of which has a plurality of rod-shaped members (32, 34) extending parallel to each other so as to be spaced apart from each other and a connection member (24, 26) connecting the respective rod-shaped members (32, 34) and is formed from metal, the respective rod-shaped members (32, 34) of the respective porous metal structures extend parallel to each other, and a flow passage (50) for a fluid is formed in a gap between the respective rod-shaped members (32, 34).

Provided are silver particles including a silver powder and a silver layer that includes primary particles, the primary particles being smaller than the silver powder.