A gas floated workpiece supporting apparatus includes a gas upward ejector ejecting gas upward, and a gas downward ejector located at an upper side from the gas upward ejector and ejecting gas downward. The gas downward ejector is installed at a position where the gas downward ejector ejects the gas downward from above a plate-shaped workpiece to apply pressure to the plate-shaped workpiece that is floated and supported by the gas ejected from the gas upward ejector, whereby a uniform floating amount supports the plate-shaped workpiece with high flatness at a time of floating and supporting the plate-shaped workpiece.

An air-floating transfer apparatus for manufacturing insulated glazing units (IGUs). The apparatus includes a frame arranged at a certain angle on one side of a conveyor belt, a support for the frame, and an air pump supplying air to the frame. The frame comprises multiple rows of air blowers that expel air towards one surface of the glass being transported by the operation of the air pump, and between these multiple rows of air blowers, there are arranged multiple rows of exhaust support plates with exhaust holes formed at regular intervals to selectively exhaust air discharged from the air blowers. Additionally, the device includes an opening and closing unit that opens or closes the exhaust holes of the exhaust support plates depending on the thickness of the glass being transported.

A flotation conveyance apparatus according to an embodiment conveys a substrate while floating the substrate by ejecting a gas to a lower surface of the substrate. The flotation conveyance apparatus includes an upper plate disposed on the substrate side including a plurality of ejecting ports for ejecting the gas and a lower plate disposed under the upper plate. Flow-paths for supplying the gas to the plurality of ejecting ports are provided on at least one of the upper plate and the lower plate.

Apparatus and method for transferring a substrate are disclosed. The substrate transfer apparatus includes: a substrate conveyance assembly disposed between a mechanical arm and a wafer stage, the substrate conveyance assembly including a substrate loading conveyor and a substrate unloading conveyor parallelly arranged in a first direction, each of the substrate loading conveyor and the substrate unloading conveyor configured for transferring a substrate between the wafer stage and the mechanical arm along a second direction perpendicular to the first direction; an integral frame; and a transition air suspension assembly fixed to the integral frame at the end thereof proximal to the wafer stage, the transition air suspension assembly being able to engage with either of the substrate loading conveyor and the substrate unloading conveyor for producing an air film to levitate the substrate during the conveyance of the substrate by the substrate loading conveyor or the substrate unloading conveyor.

A glass substrate support system includes a first and second vacuum members extending lengthwise in a glass substrate feed direction along opposing edges of a flexible glass substrate. Each vacuum member has a vacuum body including a pressure chamber located therein and a support surface having a vacuum opening extending therethrough and in communication with the pressure chamber. A support rod assembly is provided that includes a plurality of support rods located between the first second vacuum members in the glass substrate feed direction. The support rod assembly has an out-of-plane configuration that supports the flexible glass substrate in a downward arc orientation.

According to one embodiment, a floating conveyor is configured to convey a substrate while floating the substrate. The floating conveyor includes a lower floating section and an upper floating section with a conveying path of the substrate therebetween. A plurality of floating blocks that constitute at least one of the lower floating section and the upper floating section are arranged to be separated by a space, and a floating block that constitutes the other is arranged to face the space.

A method for forming a hole in a glass or glass-ceramic sheets includes scoring a major surface of a glass or glass-ceramic sheet to define the hole, placing the sheet on receiving surface of a mount where a cavity is formed in the receiving surface such that a peripheral edge of the cavity is positioned external to the area bounded by the first score, and fracturing the sheet along the first score to break away the portion of the sheet defined by the first score, wherein the broken away portion of the sheet is contained within the cavity.

In a laser irradiation apparatus 1 according to one embodiment, each of first and second flotation units 30a, 30b includes a base 31, and a porous plate 32 bonded to an upper surface of the base 31 by an adhesive layer 34, the base 31 includes a rising portion 312 protruding upward at an outer periphery facing at least the gap, and the porous plate 32 includes a cutout portion 321 configured to fit to the rising portion 312, and the adhesive layer 34 is formed along an inner wall of the rising portion 312 having fitted to the cutout portion 321.

A carrying method of carrying a substrate with a substrate holder, including: holding a part of the substrate located above the substrate holder using holding pads; controlling and driving downward the holding pads holding the substrate so that the substrate is supported on the support surface of the substrate holder, when releasing the hold of an other part of the substrate by a substrate carry-in hand that holds the other part of the substrate located above the substrate holder. Accordingly, the substrate carriage to the substrate holder can be swiftly performed.

The disclosure provides a method for forming a hole in a glass or glass-ceramic sheets. The method includes scoring a major surface of a glass or glass-ceramic sheet to define the hole, placing the sheet on a cavity-containing receiving surface such that a peripheral edge of the cavity is positioned external to the area bounded by the first score, and fracturing the sheet along the score to break away the portion of the sheet defined by the first score. The method allows for the formation of large openings in thin glass sheets where the mother sheet is not broken or damaged by the formation of the opening.