An ultrasound transducer array architecture and manufacturing method is provided. The method includes providing an ultrasonic transducer including a plurality of modules, each module including an ultrasonic transducer array and an application specific integrated circuit (ASIC), the ultrasonic transducer array and the ASIC electrically coupled to a flexible interconnect, the flexible interconnect coupled to a connector. The ASIC and flexible interconnect may be arranged such that each ultrasonic transducer array is directly adjacent to another ultrasonic transducer array. The ASIC may be electrically coupled to the flexible interconnect and the ASIC to the transducer array via a redistribution layer. Each of the plurality of modules may be a stack with the ultrasonic transducer array on the RDL and RDL on the ASIC, wherein the flexible interconnect extends laterally from a top surface of the ASIC and curves down to a bottom surface of the ASIC.

Disclosed is an ultrasound probe wherein a backing having built-in lead arrays is disposed on the rear surface side of a transducer array, and backing terminal arrays connected to the lead arrays are provided on the lower surface of the backing. A relay substrate is provided between the backing and an electronic substrate. The relay substrate is provided with electrode section arrays corresponding to the backing terminal arrays. An electrode section includes: a substrate terminal connected to a backing terminal; a via for substrate internal wiring, said via being formed at a position shifted from the substrate terminal; and a conducting path that connects the substrate terminal and the via to each other. The electrode section arrays include a transmission electrode section array, and a reception electrode section array. The shift direction of the transmission electrode section array and that of the reception electrode section array are different from each other.

An electroacoustic transducer includes: a housing; an oscillating structure including at least one disk-shaped piezoelectric element having first and second surfaces; an acoustic transmitter; and electrical connecting element contacting electrodes of the piezoelectric element. The acoustic transmitter has parallel first and second surfaces, which first surface is joined to the first surface of the piezoelectric element, and which second surface is suitable for emitting and/or receiving sound waves. The distance between the second surface of the acoustic transmitter and the second surface of the piezoelectric element corresponds to of the resonance oscillation wavelength of the oscillating structure. The piezoelectric element is connected to the housing with the aid of a bearing structure which allows transverse strains of the piezoelectric element.

Disclosed is a piezoelectric transducer which is mounted to a target in use, comprising: a piezoelectric element having a front face which faces the target, and an opposing rear face which faces away from the target, wherein the piezoelectric element has a first acoustic impedance; an compression element located on the rear surface side of the piezoelectric element, the compression element having a second acoustic impedance which is less than the first acoustic impedance; and, a compression mechanism which urges the compression element towards the piezoelectric element such that the compression element is compressed between the compression mechanism and piezoelectric element.

The present disclosure relates to a housing and a connector for a door using the same. The housing forming a skeleton of a connector for a door coupled with a counter connector which is mounted in a panel includes: a terminal seating space configured to be formed by penetrating through the housing back and forth and an electric wire seating space configured to communicate with the terminal seating space to be opened to a rear of the housing, and an electric wire guide cover configured to prevent the electric wire seating space from protruding backward so as to prevent a load from being applied to a grommet in which an electric wire is coupled with the housing.

An ultrasound transducer used in an ultrasound system and a manufacturing method thereof includes: a backing block; a piezoelectric layer placed on the backing block; a matching layer placed on the piezoelectric layer; and a ground layer placed between the piezoelectric layer and the matching layer. The backing layer includes a connector that connects a transmitting unit and a receiving unit of an ultrasound system, and a wiring area that connects the piezoelectric layer and the connector. The wiring area is formed by etching and filling with metal material.

A system and downhole tool comprising an ultrasonic transducer with a piezoelectric material embedded in a backing and a method of determining a parameter using the ultrasonic transducer. A self-noise of the transducer can be reduced by the piezoelectric material being at least partially embedded in the backing. The ultrasonic transducer can include an encapsulating material that encapsulates the backing.

A piezoelectric transducer comprises a piezoelectric element operable to transduce mechanical movement of the piezoelectric element to an electrical signal and to transduce an electrical signal in the piezoelectric element to a mechanical movement thereof, wherein the piezoelectric transducer is operable to transduce above a temperature of 200 C.

An acoustic device and method of manufacturing same. The device may be used to inspect tubulars and parts with high resolution. The acoustic device may include a 2D ultrasonic transducer layer and an ASIC connected to each other by an array of conductive wires. A non-conductive, acoustic damping material is flowed and set around the wires. to form a thick acoustic backing layer. Manufacturing the ultrasonic transducer may involve wire bonding. Electrical Discharge Machining or supporting rigid posts on a substrate. A surface of the backing layer may be machined. plated and diced to create conductive pads to connect the transducer layer to the wires then to the ASIC.

The present invention provides a flexible ultrasound transducer for an ultrasound monitoring system for examining a curved object. The ultrasound transducer comprises an integrated circuit structure and a multi-layered structure, said multi-layered structure comprising an array of ultrasound transducing elements arranged in a first layer structure and configured for generating ultrasonic energy propagating along a main transducer axis Z and an array of control circuits arranged in a second layer structure, and wherein the array of control circuits and the integrated circuit structure are configured for operating the array of ultrasound transducing elements in said first layer structure, Further, the multi-layered structure comprises at least one flexible layer arranged so that the bending flexibility of the multi-layered structure permits the ultrasound transducer to form a continuous contact with said curved object during operation.