The present disclosure provides a method for coating a composite structure comprising the steps of applying a first slurry of a first phosphate glass composition on an outer surface of the composite structure. The first slurry comprises a first additive including at least one of molybdenum disulfide or tungsten disulfide. The method may further include heating the composite structure to a temperature sufficient to form a base layer adhered to the composite structure.

The present disclosure provides a method for coating a composite structure comprising the steps of applying a first slurry of a first phosphate glass composition on an outer surface of the composite structure. The first slurry comprises a first additive including at least one of molybdenum disulfide or tungsten disulfide. The method may further include heating the composite structure to a temperature sufficient to form a base layer adhered to the composite structure.

Frontside metallization pastes for solar cell electrodes prepared from glass frit containing rare earth metals such as lanthanum and yttrium are disclosed. Electrodes prepared from the metallization pastes exhibit improved adhesion, reliability, and excellent electrical properties.

To provide a cover glass for light emitting diode package, which is capable of preventing deterioration in transmittance characteristics during use for a long period of time, and a light emitting device. The cover glass for light emitting diode package has a basic composition comprising, by mass % as calculated as oxides, from 55 to 80% of SiO.sub.2, from 0.5 to 15% of Al.sub.2O.sub.3, from 5 to 25% of B.sub.2O.sub.3, from 0 to 7% of Li.sub.2O, from 0 to 15% of Na.sub.2O, from 0 to 10% of K.sub.2O (provided Li.sub.2O+Na.sub.2O+K.sub.2O=from 2 to 20%), from 0 to 0.1% of SnO.sub.2 and from 0.001 to 0.1% of Fe.sub.2O.sub.3, it does not substantially contain As.sub.2O.sub.3, Sb.sub.2O.sub.3 and PbO, and it has an average thermal expansion coefficient of from 45 to 70×10.sup.−7/° C. in a temperature range of from 0 to 300° C.

To provide a cover glass for light emitting diode package, which is capable of preventing deterioration in transmittance characteristics during use for a long period of time, and a light emitting device. The cover glass for light emitting diode package has a basic composition comprising, by mass % as calculated as oxides, from 55 to 80% of SiO.sub.2, from 0.5 to 15% of Al.sub.2O.sub.3, from 5 to 25% of B.sub.2O.sub.3, from 0 to 7% of Li.sub.2O, from 0 to 15% of Na.sub.2O, from 0 to 10% of K.sub.2O (provided Li.sub.2O+Na.sub.2O+K.sub.2O=from 2 to 20%), from 0 to 0.1% of SnO.sub.2 and from 0.001 to 0.1% of Fe.sub.2O.sub.3, it does not substantially contain As.sub.2O.sub.3, Sb.sub.2O.sub.3 and PbO, and it has an average thermal expansion coefficient of from 45 to 70×10.sup.−7/° C. in a temperature range of from 0 to 300° C.

An housing for electronic components, such as LEDs and/or FETs, is provided. The housing has a base body having an upper surface that at least partially defines a mounting area for an electronic functional element, such that the base body provides a heat sink for the electronic functional element. The base body has a lower surface and a lateral surface and includes a connecting body for the electronic functional element, which is joined to the base body a glass layer formed by an alkali titanium silicate glass.

An housing for electronic components, such as LEDs and/or FETs, is provided. The housing has a base body having an upper surface that at least partially defines a mounting area for an electronic functional element, such that the base body provides a heat sink for the electronic functional element. The base body has a lower surface and a lateral surface and includes a connecting body for the electronic functional element, which is joined to the base body a glass layer formed by an alkali titanium silicate glass.

A display panel may include a first display substrate, a second display substrate disposed over the first display substrate, and a sealing member bonding the first display substrate and the second display substrate. The sealing member may include a frit sealing member including an outer region and an inner region, with the inner region disposed next to an inner side of the outer region and having a first crystallization temperature lower than a second crystallization temperature of the outer region, and an organic sealing member disposed next to an inner side of the frit sealing member.

Provided is a structure including a first member (2); a second member (3) disposed opposite to the first member (2); and a glass layer (4) disposed between the first member (2) and the second member (3) so as to bond the first member (2) and the second member (3). A glass transition point of the glass layer (4) is lower than a temperature of the glass layer (4) under operation. In the glass layer (4), at least either of ceramic and metallic particles 4b, 4c is dispersed. In a temperature region lower than the glass transition point of the glass layer (4), a thermal expansion coefficient thereof falls in between thermal expansion coefficients of the first member (2) and the second member (3). This allows thermal strain caused within the structure (1) to be reduced when the structure (1) is operated at a higher temperature than a room temperature.

Provided is a structure including a first member (2); a second member (3) disposed opposite to the first member (2); and a glass layer (4) disposed between the first member (2) and the second member (3) so as to bond the first member (2) and the second member (3). A glass transition point of the glass layer (4) is lower than a temperature of the glass layer (4) under operation. In the glass layer (4), at least either of ceramic and metallic particles 4b, 4c is dispersed. In a temperature region lower than the glass transition point of the glass layer (4), a thermal expansion coefficient thereof falls in between thermal expansion coefficients of the first member (2) and the second member (3). This allows thermal strain caused within the structure (1) to be reduced when the structure (1) is operated at a higher temperature than a room temperature.