Patent classifications
C08F222/04
POLYMERIZABLE COMPOSITION AND CURABLE RESIN COMPOSITION USING SAME
A polymerizable composition includes (a) at least one 2-methylene-1,3-dicarbonyl compound and (b) at least one ionic compound including a specific anion.
CYANOACRYLATE COMPOSITIONS
Cyanoacrylate compositions are provided, which when cured provide improved hot strength performance without compromising thermal resistance performance.
CYANOACRYLATE COMPOSITIONS
Cyanoacrylate compositions are provided, which when cured provide improved hot strength performance without compromising thermal resistance performance.
Conducting polymer, 1-octadecene, polymer with 2,5 furandione, metal salts used as a treatment means
A Polymer used as a treatment means, having an acid number greater than 100. The Polymer has a valent metal ion which is bonded to at least one reactive group. The characteristics of the Polymer include, conductivities of 4 S/cm to 200 S/cm or more, depending upon the concentration and nature of the metal bound. The conductivity proportional to the amount of metal bound, the ability of the Polymer to bind metals having a +1, +2, +3, +4, or +5 valence charge to the Polymer, and the ability to bind two or more different metals to separate binding sites on the Polymer.
Conducting polymer, 1-octadecene, polymer with 2,5 furandione, metal salts used as a treatment means
A Polymer used as a treatment means, having an acid number greater than 100. The Polymer has a valent metal ion which is bonded to at least one reactive group. The characteristics of the Polymer include, conductivities of 4 S/cm to 200 S/cm or more, depending upon the concentration and nature of the metal bound. The conductivity proportional to the amount of metal bound, the ability of the Polymer to bind metals having a +1, +2, +3, +4, or +5 valence charge to the Polymer, and the ability to bind two or more different metals to separate binding sites on the Polymer.
COPOLYMER SUITABLE FOR IMPROVING HEAT RESISTANCE OF METHACRYLIC RESIN
Provided is a copolymer that has a heat resistance improvement effect, with respect to a methacrylic resin, superior to that of the prior art, while not deteriorating compatibility with the methacrylic resin. According to the present invention, provided is a copolymer comprising 45 to 75% by mass of an aromatic vinyl monomer unit, 5 to 35% by mass of a (meth)acrylic acid ester monomer unit, and 20 to 25% by mass of an unsaturated dicarboxylic anhydride monomer unit, and having a haze of 5% or less measured along an optical path length of 10 mm through a 12% by mass chloroform solution of the copolymer in accordance with JIS K-7136.
Thiosulfate polymer compositions and articles
A thiosulfate polymer composition includes an electron-accepting photosensitizer component, either as a separate compound or as an attachment to the thiosulfate polymer. The thiosulfate polymer composition can be applied to various articles, or used to form a predetermined polymeric pattern after photothermal reaction to form crosslinked disulfide bonds, removing non-crosslinked polymer, and reaction with a disulfide-reactive material. Such thiosulfate polymer compositions can also be used to sequester metals in nanoparticulate form, and as a way for shaping human hair in hairdressing operations.
Process for cross-linked polyethylene production
A method of producing a silane cross-linked polyethylene is disclosed which includes maleating a polyethylene polymer to form a maleated polyethylene and reacting the maleated polyethylene with a primary or secondary amino silane to form a silane-grafted polyethylene. The method further includes treating the silane-grafted polyethylene in a moisture curing process to form the silane cross-linked polyethylene.
RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE
The resin composition of the present invention is a resin composition containing: a bismaleimide compound (A) containing a constituent unit represented by the following formula (1) and maleimide groups at both ends of the molecular chain; a compound (B) containing one or more carboxy groups; and a photo initiator (C).
##STR00001##
In the formula (1), R.sub.1 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms. R.sub.2 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms. Each R.sub.3 independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms. Each n independently represents an integer of 1 to 10.
RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE
The resin composition of the present invention is a resin composition containing: a bismaleimide compound (A) containing a constituent unit represented by the following formula (1) and maleimide groups at both ends of the molecular chain; a compound (B) containing one or more carboxy groups; and a photo initiator (C).
##STR00001##
In the formula (1), R.sub.1 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms. R.sub.2 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms. Each R.sub.3 independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms. Each n independently represents an integer of 1 to 10.