Patent classifications
C08G59/14
PHOTOSENSITIVE COMPOSITION, NEGATIVE PHOTOSENSITIVE COMPOSITION, PIXEL DIVISION LAYER AND ORGANIC EL DISPLAY DEVICE
The present invention provides a photosensitive composition which can suppress the generation of a development residue on the surface of an electrode and the corrosion of the electrode to form a black pixel division layer, and also can suppress the generation of off-pixel in an organic EL display device comprising the pixel division layer. Disclosed is a photosensitive composition comprising (a) a pigment, (b) a resin having two or more tertiary amino groups in the molecule, and (c) a photosensitive agent, wherein the component (b) contains a resin having a structure represented by the general formula (1).
Resist underlying film forming composition
A resist underlayer film forming composition contains a resin containing a unit structure represented by formula (1): [in formula (1), R1 represents a thiadiazole group which is optionally substituted with a C1-6 alkyl group optionally interrupted by a carboxy group, a C1-6 alkyl group optionally substituted with a hydroxyl group, or a C1-4 alkylthio group, and R2 represents a hydrogen atom or formula (2): (in formula (2), R1 is the same as defined above, and * represents a binding moiety)]. The resist underlayer film forming composition provides a resist underlayer film which has excellent solvent resistance, excellent optical parameters, an excellent dry etching rate, and excellent embeddability.
Resist underlying film forming composition
A resist underlayer film forming composition contains a resin containing a unit structure represented by formula (1): [in formula (1), R1 represents a thiadiazole group which is optionally substituted with a C1-6 alkyl group optionally interrupted by a carboxy group, a C1-6 alkyl group optionally substituted with a hydroxyl group, or a C1-4 alkylthio group, and R2 represents a hydrogen atom or formula (2): (in formula (2), R1 is the same as defined above, and * represents a binding moiety)]. The resist underlayer film forming composition provides a resist underlayer film which has excellent solvent resistance, excellent optical parameters, an excellent dry etching rate, and excellent embeddability.
Degradable silyl-containing thermosetting networks
A process of: providing a polyfunctional compound selected from polyisocyanate, polyacrylate, and polyepoxy; and reacting the polyfunctional compound with a hydroxyl- or amine-terminated silyl-containing compound. The polyfunctional compound and the silyl-containing compound are at least difunctional. A thermoset made by this process.
Epoxy resin, epoxy resin composition, epoxy resin cured product and composite material
An epoxy resin includes a reaction product between an epoxy compound and a compound having a naphthalene structure and a functional group that is reactive with an epoxy group.
Epoxy resin, epoxy resin composition, epoxy resin cured product and composite material
An epoxy resin includes a reaction product between an epoxy compound and a compound having a naphthalene structure and a functional group that is reactive with an epoxy group.
WATERBORNE EPOXY RESIN FOR ANTI-CORROSION COATING, AND PREPARATION METHOD AND USE THEREOF
The present disclosure discloses a waterborne epoxy resin for an anti-corrosion coating, and a preparation method and use thereof. In the preparation method, a strongly-hydrophilic polyethylene glycol (PEG) branch is introduced into a molecular chain of epoxy resin to realize the self-emulsification function of epoxy resin. Moreover, due to the short molecular chain, a solid content can reach up to 66.7% under the action of PEG. In addition, the waterborne emulsion can be prepared without adding any additional alcohol-soluble solvents and other high-boiling-point organic solvents, and a production process and a product use process both are very environmentally friendly. The waterborne epoxy resin can be mixed with a waterborne ammonia curing agent to form a film for corrosion protection.
Modified epoxy resin immobilized enzyme, preparation method therefor and application thereof
Disclosed are a modified epoxy resin immobilized enzyme, a preparation method therefor and an application thereof. Herein, the preparation method includes the following steps: modifying an epoxy resin, adding a polyethyleneimine to a modified epoxy resin for further modification, and then adding an enzyme to be immobilized and a glutaraldehyde for immobilization, to obtain the modified epoxy resin immobilized enzyme. The epoxy resin is modified, the polyethyleneimine is added to the modified epoxy resin for the further modification, and an aldehyde group in the resin and an amino group in the polyethyleneimine are covalently bound to each enzyme, then it is activated by the bifunctional reagent glutaraldehyde.
Ion exchange resin and method for preparing the same
An ion exchange resin and a method for preparing the same are provided. An ion exchange resin is formed by a composition, and the composition includes a crosslinking agent and an ionic compound with sulfonate ions. The ionic compound with sulfonate ions is formed by reacting an epoxy resin with an ionic monomer with sulfonate ions or an ionic polymer having sulfonate ions. The ionic monomer and the ionic polymer each has a hydroxyl group or an acid group at the ends. The ionic monomer or the ionic polymer is 40 to 80 parts by weight, and the epoxy resin is 15 to 25 parts by weight, based on 100 parts by weight of the ion exchange resin. An ion exchange resin with a network structure is formed after the ionic compound with sulfonate ions reacts with the crosslinking agent.
EPOXY RESIN AND ELECTRODEPOSITION PAINT
An epoxy resin, which is obtained by reacting at least a compound having one or more epoxy groups and a compound having a functional group that reacts with the epoxy groups, satisfies conditions (I) and/or (II): (I) the compound having a functional group that reacts with the epoxy groups includes a trihydric or higher phenol compound and/or a compound including a trifunctional or higher polyisocyanate; (II) the epoxy resin has an average degree of polyfunctionalization (X1) per molecule, as expressed by Formula (1), of 0.30 or more:
Average degree of polyfunctionalization (X1)=number of ends per molecule of epoxy resin−2. Formula (1):