Patent classifications
C08G77/80
CURABLE ORGANOPOLYSILOXANE COMPOSITION HAVING EXCELLENT COLD RESISTANCE, PATTERN FORMING METHOD, ELECTRONIC COMPONENTS, ETC.
A curable organopolysiloxane composition having rheological properties suitable for precision application and fine pattern formation by a fine droplet coating apparatus such as a jet dispenser, along with a method for forming a pattern using the same, and an electronic component using the same, is provided herein. The curable organopolysiloxane composition is hydrosilylation reaction curable and can be precisely applied by a jet dispenser, etc. The composition has a viscosity at a strain speed of 1,000 (1/s) of 2.0 Pa.Math.s or less, while the viscosity at a strain speed of 0.1 (1/s) is a value 50.0-fold or more the viscosity at a strain speed of 1,000 (1/s). The content of silicon atom-bonded aromatic functional groups in the composition is within a range of from 1.0 to 6.0 mass %.
POLYCARBONATE RESIN COMPOSITION AND ARTICLE INCLUDING THE SAME
Provided is a polycarbonate resin composition and a molded product comprising same. The polycarbonate resin composition comprises a linear polycarbonate resin, a branched polycarbonate resin, a fluorinated sulfonate-based metal salt, a phenyl methyl silicone oil, and a phenyl methyl silicone resin. The linear polycarbonate resin and branched polycarbonate resin include a repeating unit of the following Chemical Formula 1:
##STR00001## wherein in Chemical Formula 1: R.sub.1 to R.sub.4 are each independently hydrogen, C.sub.1-10 alkyl, C.sub.1-10 alkoxy, or halogen; and Z is C.sub.1-10 alkylene unsubstituted or substituted with phenyl, C.sub.3-15 cycloalkylene unsubstituted or substituted with C.sub.1-10 alkyl, O, S, SO, SO.sub.2, or CO.
POLYMER, COMPOSITION, AND POLYSILOXANE-POLYIMIDE MATERIAL THEREOF
A polymer, a composition, and a polysiloxane-polyimide material thereof are provided. The polymer includes a first repeat unit and a second repeat unit. The first repeat unit has a structure represented by Formula (I) and the second repeat unit has a structure represented by Formula (II)
##STR00001##
wherein A.sup.1 and A.sup.3 are independently tetravalent moiety; A.sup.2 is a divalent moiety; n≥1; m≥1; R.sup.1 is independently hydrogen, C.sub.1-8 alkyl, C.sub.1-8 fluoroalkyl, C.sub.1-8 alkoxy, or C.sub.6-12 aryl; and R.sup.2 is independently hydrogen, C.sub.1-8 alkyl, C.sub.1-8 fluoroalkyl, C.sub.1-8 alkoxy, C.sub.6-12 aryl, or a reactive functional group.
SILOXANE-CONTAINING BLOCK COPOLYCARBONATES HAVING A SMALL DOMAIN SIZE
The present invention relates to a method for preparing a polysiloxane-polycarbonate block co-condensate, wherein a siloxane component containing both aliphatic and aromatic groups is used as a mediator. The invention also relates to a polycarbonate composition and also to the use of the special siloxane component for reducing the particle size distribution of the siloxane domains in a polysiloxane-polycarbonate block co-condensate.
MOLDABLE SILICONE ELASTOMERS HAVING SELECTIVE PRIMERLESS ADHESION
A composition for use in modifying the adhesion properties of silicone rubber compositions is described. The composition comprises alkoxy silanes, such as alkoxy silanes further comprising additional chemical functional groups such as epoxides, esters, and anhydrides; diffusion promoters that are completely or partially immiscible in the silicone rubber composition being modified; and compounds that can balance the hydride content of the silicone rubber compositions being modified. Modified curable silicone rubber compositions and methods of modifying the adhesive properties of silicone rubber compositions are also described. In particular, use of the presently disclosed compositions can provide modified silicone rubber compositions having selective adhesion for surfaces comprising thermoplastic and thermoset polymers as compared to metal surfaces.
CURABLE SILICONE COMPOSITION, CURED PRODUCT OF SAME, AND METHOD FOR PRODUCING SAME
Provided is a curable silicone composition and uses thereof. The composition which has hot-melt properties, strongly adheres to poorly adhesive substrates, and is particularly superior in flexibility and toughness at high temperatures from room temperature to approximately 150° C. in cured products such as overmolding, in addition to providing a cured product that does not easily warp or become damaged even when integrally molded with a lead frame or the like. The composition comprises: (A) organopolysiloxane resin microparticles where 20 mol % or more of all siloxane units is siloxane units represented by RSiO.sub.3/2 where R is a monovalent hydrocarbon group; (B) a silatrane derivative or a carbasilatrane derivative; (C) a curing agent; and (D) a functional inorganic filler. The content of component (D) is 50% or more by volume relative to the overall composition. The composition is solid at 25° C. and has hot-melt properties at a temperature of 200° C. or lower.
ADDITION CURABLE COMPOSITION COMPRISING SILOXANE-IMIDE COPOLYMERS
A curable silicone adhesive composition comprising a heat stable siloxane-imide copolymer is shown and described herein. The composition includes an alkenyl silicone, a silicone hydride based cross linker, hydrosilylation catalyst and additives that is curable at relatively low temperatures and shows good heat stability.
CONDENSATION CURABLE COMPOSITION COMPRISING SILOXANE-IMIDE CROSSLINKER
A condensation curable silicone adhesive composition comprising a condensation curable organopolysiloxane, siloxane-imide crosslinker, a condensation catalyst and an additive is shown and described herein. The composition is curable at relatively room temperatures and shows good heat stability
CONDENSATION CURABLE COMPOSITION COMPRISING SILOXANE-IMIDE BASE POLYMER
A condensation curable silicone adhesive composition comprising a siloxane-imide base polymer, condensation curable organopolysiloxane crosslinker, a condensation catalyst and an additive is shown and described herein. The composition is curable at relatively room temperatures and shows good heat stability
CHEMICALLY HOMOGENEOUS SILICON HARDMASKS FOR LITHOGRAPHY
Silicon hardmasks with a single-component polymer are disclosed. These hardmasks provide high optical homogeneity and high chemical homogeneity, thus minimizing or avoiding negative stochastic effects on feature critical dimension. The hardmasks further provide low porosity, higher density, and high silicon content and improve performance factors such as LER/LWR, defectivity, uniformity, and DoF.