The invention provides a thermoplastic resin composition having (A) a thermoplastic polymer comprising (a1) 5 mass % to less than 50 mass % of a propylene polymer having a melting point of 150° C. or higher, (a2) 10 mass % to less than 60 mass % of an ethylene polymer, (a3) 5 mass % to less than 50 mass % of, for example, a hydrogenated product of a block copolymer of an aromatic vinyl compound and a conjugated diene compound, and (a4) 1 mass % to less than 30 mass % of, for example, an unsaturated carboxylic acid-modified olefin polymer; (B) a softener for nonaromatic rubbers; (C) a metal hydrate; (D) an organic peroxide; (E) an antioxidant; and (F) a coupling agent.

An aqueous polymer dispersion is based on alkyl (meth)acrylates having long side chains. The aqueous polymer dispersion also contains at least one cosolvent and an emulsifier system containing at least two emulsifiers from the group of sulfosuccinates.

An aqueous polymer dispersion is based on alkyl (meth)acrylates having long side chains. The aqueous polymer dispersion also contains at least one cosolvent and an emulsifier system containing at least two emulsifiers from the group of sulfosuccinates.

Provided are a method for manufacturing a rubber composition for a tire and a method for manufacturing a tire including this manufacturing method for the rubber composition in the present invention, which are characterized by including the steps of: starting to knead a rubber component, a sulfur donor, and a sulfur atom-containing vulcanization accelerator together before kneading the rubber component with a filler; and then adding a filler to an obtained kneaded product and performing kneading at a kneading temperature of 120° C. or higher. According to the manufacturing methods of the present invention, a rubber composition for a tire and a tire which have good fracture property can be manufactured.

Provided are a method for manufacturing a rubber composition for a tire and a method for manufacturing a tire including this manufacturing method for the rubber composition in the present invention, which are characterized by including the steps of: starting to knead a rubber component, a sulfur donor, and a sulfur atom-containing vulcanization accelerator together before kneading the rubber component with a filler; and then adding a filler to an obtained kneaded product and performing kneading at a kneading temperature of 120° C. or higher. According to the manufacturing methods of the present invention, a rubber composition for a tire and a tire which have good fracture property can be manufactured.

A UV light curable adhesive is disclosed, comprising, at least one bi-active monomer, at least one polymerizable oligomer, a primary photoinitiator, and a monomer scavenger, wherein photopolymerization of the at least one bi-active monomer by the primary photoinitiator activates the monomer scavenger, reducing residual monomer content in a cured adhesive formed by the photopolymerization of the bi-active monomer in comparison to an otherwise identical comparative UV adhesive lacking the monomer scavenger. A method for curing the UV light curable adhesive is disclosed, including applying the UV light curable adhesive to a surface and exposing the UV light curable adhesive to UV light, free from heating the UV light curable adhesive other than any autogenous increases in temperature from exothermic polymerization reactions. A device with the UV light cured adhesive is disclosed, including the UV light cured adhesive joining a first surface to a second surface.

A UV light curable adhesive is disclosed, comprising, at least one bi-active monomer, at least one polymerizable oligomer, a primary photoinitiator, and a monomer scavenger, wherein photopolymerization of the at least one bi-active monomer by the primary photoinitiator activates the monomer scavenger, reducing residual monomer content in a cured adhesive formed by the photopolymerization of the bi-active monomer in comparison to an otherwise identical comparative UV adhesive lacking the monomer scavenger. A method for curing the UV light curable adhesive is disclosed, including applying the UV light curable adhesive to a surface and exposing the UV light curable adhesive to UV light, free from heating the UV light curable adhesive other than any autogenous increases in temperature from exothermic polymerization reactions. A device with the UV light cured adhesive is disclosed, including the UV light cured adhesive joining a first surface to a second surface.

This invention provides a scrollable and foldable transparent polysiloxane film and its preparation and self-healing method. 2-Hydroxyethyl disulfide, diisocyanate and alkane chloride were mixed and reacted to get disulfide-containing diisocyanate. α,ω-Aminopropyl terminated polydimethylsiloxane, diisocyanate and alkane chloride were mixed and reacted get linear chain-extended polydimethylsiloxane. Linear chain-extended polydimethylsiloxane, multi-amino terminated hyperbranched polysiloxane, disulfide-containing diisocyanate and alkane chloride were mixed and poured into a mould. After drying, the scrollable and foldable transparent polysiloxane film was obtained. The polysiloxane film described in this invention are constructed by dynamic physical crosslinking induced by hydrogen bond and permanent chemical crosslinking generated by hyperbranched polysiloxane. Hence, the polysiloxane film achieves both high stiffness and toughness. The good self-healing behavior of the polysiloxane films is originated from the temperature controlled dissociation of hydrogen bonds and exchange reaction rate of disulfide bonds.

The present invention relates to covalent adaptable networks (CANs) having exchangeable crosslinks which are able to undergo repeated covalent bond reshuffling through photo-activation at ambient temperatures. The invention provides covalent adaptable network forming compositions as well as methods of forming, remolding and recycling the CANs of the invention.

A resin composition, a light conversion layer and a light emitting device are provided. The resin composition includes a quantum dot (A), an alkali-soluble resin (B), an ethylenically unsaturated monomer (C), a photoinitiator (D), a solvent (E) and a phenyl-based compound (F). The phenyl-based compound (F) includes at least one of a compound represented by following Formula (F-1) and a compound represented by following Formula (F-2). Based on a total usage amount of the resin composition as 100 parts by weight, a usage amount of the phenyl-based compound (F) is 0.05 to 5 parts by weight. ##STR00001##
In Formula (F-1) and Formula (F-2), the definition of R.sup.1, R.sup.3, R.sup.4, Y, Z, m, n and p are the same as defined in the detailed description.