C08K5/54

RUBBER COMPOSITION AND PNEUMATIC TIRE USING SAME
20230203277 · 2023-06-29 · ·

An object of the invention is to provide a rubber composition having excellent durability while maintaining a low fuel cost, and a pneumatic tire using the rubber composition. A rubber composition contains silica in a diene rubber. A deformation amount of a rubber component in a sample obtained by vulcanizing the rubber composition when the sample is elongated by 200% is obtained by a force curve measurement with an atomic force microscope, and a ratio of a rubber component having a deformation amount smaller than a weighted average value thereof is 70 vol % or more in the rubber component.

Flame retardant resin composition and flame retardant resin molded article manufactured therefrom

The present invention relates to a flame retardant resin composition having excellent flame retardancy and improved thermal deformation properties, and a flame retardant resin molded article manufactured therefrom, and provides a flame retardant resin composition including a) a base resin including a polyarylene ether-based polymer; an aromatic vinyl-based polymer and a copolymer of vinylcyan monomer-conjugated diene monomer-aromatic vinyl monomer; b) an organophosphorus-based flame retardant; c) a hypophosphite compound; and d) a sulfur-containing compound including at least two sulfur atoms, wherein b) the organophosphorus-based flame retardant, c) the hypophosphite compound and d) the sulfur-containing compound are included in a weight ratio of 15 to 24:2 to 4:2 to 5.

Flame retardant resin composition and flame retardant resin molded article manufactured therefrom

The present invention relates to a flame retardant resin composition having excellent flame retardancy and improved thermal deformation properties, and a flame retardant resin molded article manufactured therefrom, and provides a flame retardant resin composition including a) a base resin including a polyarylene ether-based polymer; an aromatic vinyl-based polymer and a copolymer of vinylcyan monomer-conjugated diene monomer-aromatic vinyl monomer; b) an organophosphorus-based flame retardant; c) a hypophosphite compound; and d) a sulfur-containing compound including at least two sulfur atoms, wherein b) the organophosphorus-based flame retardant, c) the hypophosphite compound and d) the sulfur-containing compound are included in a weight ratio of 15 to 24:2 to 4:2 to 5.

FLUORINATED COUPLING AGENTS AND FLUORINATED (CO)POLYMER LAYERS MADE USING THE SAME

Fluorinated coupling agents and polymerizable compositions including such fluorinated coupling agents and at least one free-radically polymerizable monomer, oligomer, or mixture thereof. Multilayer films including a substrate and at least a first layer overlaying a surface of the substrate also are described, in which the at least first layer includes a (co)polymer obtained by polymerizing the foregoing polymerizable compositions. Processes for making a multilayer film using the polymerizable composition also are taught. Articles including the multilayer film also are disclosed, in which the article preferably is selected from a photovoltaic device, a display device, a solid-state lighting device, a sensor, a medical or biological diagnostic device, an electrochromic device, light control device, or a combination thereof.

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, RESIN COMPOSITION FOR TEMPORARY PROTECTION, AND RESIN FILM FOR TEMPORARY PROTECTION
20230197630 · 2023-06-22 ·

A method for producing an electronic component having an electromagnetic shield includes: sticking a temporary protective material to a body to be processed having irregularities on a surface thereof; curing the temporary protective material by light irradiation; singularizing the body to be processed and the temporary protective material; forming a metal film at a part of the singularized body where the temporary protective material is not stuck; and detaching the singularized body having the metal film formed thereon from the temporary protective material. The temporary protective material is formed from a resin composition having a shear viscosity at 35° C. of 5000 to 30000 Pa.Math.s before photocuring and having an elastic modulus at 25° C. of 100 MPa or less and an elongation percentage of 35% or more in a tensile test, after photocuring by light irradiation with an exposure amount of 500 mJ/cm.sup.2 or greater.

ADDITIVE ORGANOPOLYSILOXANE COMPOSITION, CURABLE COMPOSITION, AND FILM
20230192960 · 2023-06-22 ·

An (A) additive organopolysiloxane composition is disclosed, which includes (A1) a branched organopolysiloxane polymer comprising M, D and Q siloxy units, (A2) a silicone resin, and (A3) a polydiorganosiloxane oligomer. A curable composition is also disclosed, the curable composition including the (A) additive organopolysiloxane composition, (B) an organosilicon compound having at least two silicon-bonded hydrogen atoms per molecule, and (C) a hydrosilylation catalyst. A method of preparing the curable composition, and a method of forming a film with the curable composition are also disclosed. The compositions and methods are useful for forming silicone release coatings with high release force.

ADDITIVE ORGANOPOLYSILOXANE COMPOSITION, CURABLE COMPOSITION, AND FILM
20230192960 · 2023-06-22 ·

An (A) additive organopolysiloxane composition is disclosed, which includes (A1) a branched organopolysiloxane polymer comprising M, D and Q siloxy units, (A2) a silicone resin, and (A3) a polydiorganosiloxane oligomer. A curable composition is also disclosed, the curable composition including the (A) additive organopolysiloxane composition, (B) an organosilicon compound having at least two silicon-bonded hydrogen atoms per molecule, and (C) a hydrosilylation catalyst. A method of preparing the curable composition, and a method of forming a film with the curable composition are also disclosed. The compositions and methods are useful for forming silicone release coatings with high release force.

Temporary protective film for semiconductor encapsulation molding, lead frame provided with temporary protective film, encapsulated molded body provided with temporary protective film, and method for manufacturing semiconductor device

A temporary protective film for semiconductor sealing molding includes a support film and an adhesive layer provided on one surface or both surfaces of the support film and containing a resin and a silane coupling agent. The content of the silane coupling agent in the temporary protective film may be more than 5% by mass and less than or equal to 35% by mass with respect to the total mass of the resin.

ENCAPSULANT SHEET FOR SELF-LUMINOUS DISPLAY OR ENCAPSULANT SHEET FOR DIRECT BACKLIGHT, SELF-LUMINOUS DISPLAY, AND DIRECT BACKLIGHT
20230185131 · 2023-06-15 · ·

An encapsulant sheet suitable for encapsulating a light-emitting element in, for example, a self-luminous display or for direct backlights. The encapsulant sheet is a single-layer or multi-layer resin sheet that includes an adhesive layer exposed at a topmost surface. The Vicat softening point is greater than 60° C. and no higher than 100° C. The melt viscosity of the encapsulant sheet, at a shear velocity of 2.43×10 sec.sup.−1 and measured at a temperature of 120° C. is at least 5.0×10.sup.4 poise and no more than 1.0×10.sup.5 poise. The adhesive layer contains a polyolefin and a silane component, and a content of the silane component relative to the resin component of the adhesive layer is at least 0.03% by mass and less than 10% by mass.

SILANE FUNCTIONAL AMINE COMPOSITIONS AND THEIR USE IN RUBBER

The present disclosures are directed to a composition comprising at least one silane functional amine; a method of preparing a silane functional amine; a rubber composition comprising at least one silane functional amine, at least one diene-based polymer, silica, at least one process aid, and a vulcanizing package comprising at least one vulcanizing agent comprising sulfur and at least one accelerator; and a process of preparing a rubber composition.