There is provided a photocurable and thermosetting resin composition which suppresses decrease of adhesive strength in a moisture resistance test of the cured resin composition, and has a sufficiently long pot life. The resin composition includes (A) an acrylic resin, (B) a multifunctional nitrogen-containing heterocyclic compound represented by a specific chemical formula, (C) a latent curing agent, (D) a radical polymerization inhibitor, and (E) an anionic polymerization retarder. The resin composition preferably further includes (F) a compound having a glycidyl group, other than the acrylic resin.

Aspects of the present invention relate to polymers, and particularly to farnesene polymers functionalized with one or more oxirane groups and, optionally, one or more hydroxyl groups. According to one aspect of the invention, provided is an epoxidized and optionally hydroxyl-functionalized polyfarnesene. The epoxidized farnesene polymer has at least one of a side chain or a main backbone functionalized with at least one oxirane group and, optionally, at least one terminal end functionalized with a hydroxyl group. In accordance with another aspect of the invention, a method is provided for preparing an epoxidized and optionally hydroxyl-functionalized polyfarnesene. The method includes epoxidizing a farnesene polymer, which may optionally contain one or more terminal hydroxyl groups, to functionalize at least one of a side chain or a main backbone of the farnesene polymer with an oxirane group.

With respect to a laminate of a film formed of a thermoplastic resin or thermoplastic elastomer composition and a layer formed of a rubber composition in which an epoxidized natural rubber is blended, the adhesion between the film and the layer of the rubber composition is improved without using a large amount of the epoxidized natural rubber. A laminate of a film formed of a thermoplastic resin or thermoplastic elastomer composition and a layer formed of a rubber composition, said laminate being characterized in that: 5-60% by mass of a rubber component contained in the rubber composition is composed of an epoxidized natural rubber and 20-50% by mass of the rubber component is composed of a butadiene rubber; and the rubber composition contains an unsubstituted or substituted aromatic carboxylic acid having a pKa of 1.5-4.0 in an amount of 0.5-5 parts by mass per 100 parts by mass of the rubber component.

With respect to a laminate of a film formed of a thermoplastic resin or thermoplastic elastomer composition and a layer formed of a rubber composition in which an epoxidized natural rubber is blended, the adhesion between the film and the layer of the rubber composition is improved without using a large amount of the epoxidized natural rubber. A laminate of a film formed of a thermoplastic resin or thermoplastic elastomer composition and a layer formed of a rubber composition, said laminate being characterized in that: 5-60% by mass of a rubber component contained in the rubber composition is composed of an epoxidized natural rubber and 20-50% by mass of the rubber component is composed of a butadiene rubber; and the rubber composition contains an unsubstituted or substituted aromatic carboxylic acid having a pKa of 1.5-4.0 in an amount of 0.5-5 parts by mass per 100 parts by mass of the rubber component.

In some aspects, the disclosure relates to thermoset polymeric compositions consisting of functional bio-based epoxies and/or their derivatives (e.g. epoxidized vegetable oil(s)), along with carboxyl functional acrylics and/or polyesters. When cured, example compositions yield high performance products suitable for composite, coating, adhesive, sealant, and/or elastomer applications. When used in stone composite formulations with suitable fillers like quartz and titanium dioxide, example products have high hardness, very low water absorption, and high mechanical strength along with stain, chemical, and heat resistance. When used in coating formulations, example cured films have excellent adhesion, high gloss, clarity, toughness, low water absorption, solvent and chemical resistance, flexibility, and impact resistance without compromising hardness. Coating formulation properties may also include exterior durability. The composition properties may be selectively modified to hard, soft, tough, or elastomeric by selecting the appropriate stoichiometry and type of functional resin to react with epoxy(ies)/derivative(s).

In some aspects, the disclosure relates to thermoset polymeric compositions consisting of functional bio-based epoxies and/or their derivatives (e.g. epoxidized vegetable oil(s)), along with carboxyl functional acrylics and/or polyesters. When cured, example compositions yield high performance products suitable for composite, coating, adhesive, sealant, and/or elastomer applications. When used in stone composite formulations with suitable fillers like quartz and titanium dioxide, example products have high hardness, very low water absorption, and high mechanical strength along with stain, chemical, and heat resistance. When used in coating formulations, example cured films have excellent adhesion, high gloss, clarity, toughness, low water absorption, solvent and chemical resistance, flexibility, and impact resistance without compromising hardness. Coating formulation properties may also include exterior durability. The composition properties may be selectively modified to hard, soft, tough, or elastomeric by selecting the appropriate stoichiometry and type of functional resin to react with epoxy(ies)/derivative(s).

In some aspects, the disclosure relates to thermoset polymeric compositions consisting of functional bio-based epoxies and/or their derivatives (e.g. epoxidized vegetable oil(s)), along with carboxyl functional acrylics and/or polyesters. When cured, example compositions yield high performance products suitable for composite, coating, adhesive, sealant, and/or elastomer applications. When used in stone composite formulations with suitable fillers like quartz and titanium dioxide, example products have high hardness, very low water absorption, and high mechanical strength along with stain, chemical, and heat resistance. When used in coating formulations, example cured films have excellent adhesion, high gloss, clarity, toughness, low water absorption, solvent and chemical resistance, flexibility, and impact resistance without compromising hardness. Coating formulation properties may also include exterior durability. The composition properties may be selectively modified to hard, soft, tough, or elastomeric by selecting the appropriate stoichiometry and type of functional resin to react with epoxy(ies)/derivative(s).

A resin composition contains a polyphenylene ether compound, a styrene block copolymer, a polybutadiene compound, and a curing agent. The polyphenylene ether compound has, in a molecule thereof, at least one of a group expressed by formula (1) or a group expressed by formula (2). The polybutadiene compound has an epoxy group in a molecule thereof. The curing agent contains an allyl compound expressed by formula (3). In the formula (1), p indicates an integer from 0 to 10, Z indicates an arylene group, and R.sub.1 to R.sub.3 each independently indicate either a hydrogen atom or an alkyl group. In the formula (2), R.sub.4 indicates either a hydrogen atom or an alkyl group. In the formula (3), R.sup.A indicates either an alkyl group or an alkenyl group, each having 8 to 22 carbon atoms.

The current invention includes coating compositions having a lignin, methods for coating substrates using the coating compositions, and substrates coated with the coating compositions.

In some embodiments of the invention, a coating composition having a mixture of a) a lignin, b) a solvent, and c) a crosslinker, wherein the lignin has a neutral or negative charge. The current invention also includes a coating composition having a mixture of a) a lignin, b) a polymeric epoxy crosslinker having glycidyl (meth)acrylate, and c) a solvent. Additionally, the current invention includes a coating composition having a mixture of a) a lignin, b) a solvent, and c) a phenolic crosslinker.

The present invention relates to a halogen-free resin composition and a prepreg and a laminated board prepared therefrom. The halogen-free resin composition contains the following components in parts by weight: 50-100 parts of an epoxy resin; 20-70 parts of benzoxazine; 5-40 parts of a polyphenyl ether; 5-40 parts of allyl benzene-maleic anhydride; 10-60 parts of a halogen-free flame retardant; 0.2-5 parts of a curing accelerator, and 20-100 parts of a filler. The prepreg and laminated board prepared from the halogen-free resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance, cohesiveness and moisture resistance, etc., and are suitable for use in a halogen-free high multilayer circuit board.