A composition that toughens and impact modifies epoxy resin based compositions comprising one or more co-polyamides and one or more block copolymers with polyamide and polyether blocks. The disclosure also relates to epoxy resin compositions containing the composition comprising one or more co-polyamides and one or more block copolymers with polyamide and polyether blocks and films, adhesives, foamable compositions and foamed compositions containing such a composition.

An adhesive application device is provided for carrying out a method for producing a lamination stack for rotors and stators of electric motors or generators, wherein a light-activated adhesive is applied to one side of electric steel prior to punching out laminations or to at least one side of already punched-out laminations, wherein the adhesive is irradiated and activated with a light of required wavelength immediately before the adhesive exits from an application unit, and wherein laminations are then punched out from the electric steel and stacked or the already punched-out laminations are stacked to a lamination stack. The adhesive application device has at least one application unit with at least one valve for discharging an adhesive. At least one radiation source is arranged in a region of the valve and emits radiation and directs the radiation to the adhesive provided in the region of the at least one valve.

An adhesive application device is provided for carrying out a method for producing a lamination stack for rotors and stators of electric motors or generators, wherein a light-activated adhesive is applied to one side of electric steel prior to punching out laminations or to at least one side of already punched-out laminations, wherein the adhesive is irradiated and activated with a light of required wavelength immediately before the adhesive exits from an application unit, and wherein laminations are then punched out from the electric steel and stacked or the already punched-out laminations are stacked to a lamination stack. The adhesive application device has at least one application unit with at least one valve for discharging an adhesive. At least one radiation source is arranged in a region of the valve and emits radiation and directs the radiation to the adhesive provided in the region of the at least one valve.

A method of manufacturing at least a part of a footwear in an automatic manufacturing line includes providing a footwear part in the form of a leather base layer, providing a footwear part in the form of a leather attachment layer, automatically stacking the leather base layer and the leather attachment layer against each other with an intermediate application of adhesive between them, automatically activating the adhesive, automatically forcing the leather base layer and the leather attachment layer against each other under a pressure with the adhesive between them, curing the adhesive and thereby bonding the leather base layer and the leather attachment layer to each other thereby providing at least a part of a footwear upper.

The present invention relates to a sensor package to be attached to an object, and the sensor package includes: a first substrate; an FBG sensor; a resin portion and a first pressure-sensitive adhesive layer positioned on the first substrate; and an adhesive layer positioned on a surface of the resin portion on a side opposite to the first substrate, in which the FBG sensor is held by the resin portion.

The present invention relates to a sensor package to be attached to an object, and the sensor package includes: a first substrate; an FBG sensor; a resin portion and a first pressure-sensitive adhesive layer positioned on the first substrate; and an adhesive layer positioned on a surface of the resin portion on a side opposite to the first substrate, in which the FBG sensor is held by the resin portion.

Debonding methods comprise: providing a bound article comprising, in order: a first adherend, a first primer layer, an adhesive layer, optionally a second primer layer, and a second adherend; heating the article to a release temperature; and separating the first and second adherends. At room temperature, the adhesive layer exhibits a high overlap shear of greater than 1.0 MPa (145 psi) or even greater than 5.0 MPa (725 psi), however, at release temperature, the adhesive layer exhibits an overlap shear of no more than 0.34 MPa (50 psi) or even no more than 0.21 MPa (30 psi). The release temperature may be a temperature between 100° C. and 150° C. The adhesive layer may comprise: a first film-forming polymer or oligomer; a cured polymer comprising a polymer of a first species comprising first unsaturated free-radically polymerizable groups; a first transition metal cation; and optionally a quaternary ammonium salt.

Debonding methods comprise: providing a bound article comprising, in order: a first adherend, a first primer layer, an adhesive layer, optionally a second primer layer, and a second adherend; heating the article to a release temperature; and separating the first and second adherends. At room temperature, the adhesive layer exhibits a high overlap shear of greater than 1.0 MPa (145 psi) or even greater than 5.0 MPa (725 psi), however, at release temperature, the adhesive layer exhibits an overlap shear of no more than 0.34 MPa (50 psi) or even no more than 0.21 MPa (30 psi). The release temperature may be a temperature between 100° C. and 150° C. The adhesive layer may comprise: a first film-forming polymer or oligomer; a cured polymer comprising a polymer of a first species comprising first unsaturated free-radically polymerizable groups; a first transition metal cation; and optionally a quaternary ammonium salt.

A bonding tool for bonding a first workpiece to a second workpiece on a bonding machine is provided. The bonding tool includes a body portion for bonding the first workpiece to the second workpiece on the bonding machine. The bonding tool also includes a curing system for curing an adhesive provided between the first workpiece and the second workpiece.

A bonding tool for bonding a first workpiece to a second workpiece on a bonding machine is provided. The bonding tool includes a body portion for bonding the first workpiece to the second workpiece on the bonding machine. The bonding tool also includes a curing system for curing an adhesive provided between the first workpiece and the second workpiece.