Disclosed are single component, stimuli-responsive adhesives that cure in response to an applied stimulus, including single component moisture-curable adhesives (e.g., moisture-curable (meth)acrylate/polyurethane hybrid adhesives). These adhesive compositions can combine the non-toxic, high strength properties of (meth)acrylate adhesives with the bonding characteristics of polyurethanes. The compositions described herein employ imitator systems which trigger polymerization/curing of the adhesive composition in response to a stimulus, such as ambient moisture, mild heat, and/or by physical stress. These strategies eliminate the need for mixing or an external energy stimulus to initiate curing. In this way, the benefits of polyurethane adhesive chemistry can be brought to the consumer market, in a system that is readily usable by the average individual.

The invention relates to a method for jacketing elongate articles, such as lines or cable harnesses in particular, by means of an adhesive tape comprising a tape-shaped substrate, which substrate has, on at least one side, a thermally curable, meltable, preferably pressure-sensitive adhesive layer, the adhesive layer comprising an epoxide-functionalized acrylonitrile-butadiene copolymer which has on average more than 1.5 epoxide groups per molecule and comprising the reaction product of phthalic anhydride and diethylene-triamine, the adhesive tape being led in a helix around the elongate article or the elongate article being enveloped by the adhesive tape in the axial direction, the elongate article together with the enveloping adhesive tape being brought into the desired arrangement, in particular into the cable harness plan, the elongate article being held in this arrangement, and the curable adhesive mass being cured by supplying thermal energy, in particular at a temperature of up to 110° C.

The invention relates to a method for jacketing elongate articles, such as lines or cable harnesses in particular, by means of an adhesive tape comprising a tape-shaped substrate, which substrate has, on at least one side, a thermally curable, meltable, preferably pressure-sensitive adhesive layer, the adhesive layer comprising an epoxide-functionalized acrylonitrile-butadiene copolymer which has on average more than 1.5 epoxide groups per molecule and comprising the reaction product of phthalic anhydride and diethylene-triamine, the adhesive tape being led in a helix around the elongate article or the elongate article being enveloped by the adhesive tape in the axial direction, the elongate article together with the enveloping adhesive tape being brought into the desired arrangement, in particular into the cable harness plan, the elongate article being held in this arrangement, and the curable adhesive mass being cured by supplying thermal energy, in particular at a temperature of up to 110° C.

An adhesive composition, a coverlay film containing the adhesive composition, and a printed circuit board containing the coverlay film are disclosed. The adhesive composition includes an epoxy resin, a binder resin containing at least one species of rubber, and an inorganic filler. The adhesive composition has a viscosity of at most 8,000 cps.

A process for producing a cured pressure-sensitive adhesive that comprises a composition including at least one solid acrylonitrile-butadiene rubber, at least one tackifier resin, and optionally at least one liquid acrylonitrile-butadiene rubber, comprises subjecting the composition to electron-beam irradiation (EBC) with an acceleration voltage of 1.8 to 2.38 kV per 1 pm layer thickness of the composition and with a total beam dose of 5 to 50 kGy. Also disclosed is a cured pressure-sensitive adhesive obtained or obtainable by the process. Further disclosed is a double-sidedly adhering, especially carrierless, adhesive tape, and also single- or double-sidedly adhering adhesive tape comprising, on a carrier layer, the cured pressure-sensitive adhesive. Disclosed finally is the use of the pressure-sensitive adhesive or of an adhesive tape made therefrom for bonding components in electronic devices, especially in mobile electronic devices, preferably tablets, mobile phones or smart watches.

A process for producing a cured pressure-sensitive adhesive that comprises a composition including at least one solid acrylonitrile-butadiene rubber, at least one tackifier resin, and optionally at least one liquid acrylonitrile-butadiene rubber, comprises subjecting the composition to electron-beam irradiation (EBC) with an acceleration voltage of 1.8 to 2.38 kV per 1 pm layer thickness of the composition and with a total beam dose of 5 to 50 kGy. Also disclosed is a cured pressure-sensitive adhesive obtained or obtainable by the process. Further disclosed is a double-sidedly adhering, especially carrierless, adhesive tape, and also single- or double-sidedly adhering adhesive tape comprising, on a carrier layer, the cured pressure-sensitive adhesive. Disclosed finally is the use of the pressure-sensitive adhesive or of an adhesive tape made therefrom for bonding components in electronic devices, especially in mobile electronic devices, preferably tablets, mobile phones or smart watches.

Pressure-sensitive adhesives based on acrylonitrile-butadiene rubbers having good shock-resistance combined with easy removability of the adhesives from the substrate shall be provided. This is solved by a pressure-sensitive adhesive which comprises at least one acrylonitrile-butadiene rubber; and at least one tackifier resin, and is characterized in that the acrylonitrile content of the acrylonitrile rubber is less than 30 wt %; the pressure-sensitive adhesive comprises at least one rosin resin as tackifier resin; and the entirety of all tackifier resins has an acid number of 6-150. The pressure-sensitive adhesive can be used for bonding parts in mobile electronic devices.

Pressure-sensitive adhesives based on acrylonitrile-butadiene rubbers having good shock-resistance combined with easy removability of the adhesives from the substrate shall be provided. This is solved by a pressure-sensitive adhesive which comprises at least one acrylonitrile-butadiene rubber; and at least one tackifier resin, and is characterized in that the acrylonitrile content of the acrylonitrile rubber is less than 30 wt %; the pressure-sensitive adhesive comprises at least one rosin resin as tackifier resin; and the entirety of all tackifier resins has an acid number of 6-150. The pressure-sensitive adhesive can be used for bonding parts in mobile electronic devices.

Pressure-sensitive adhesives based on acrylonitrile-butadiene rubbers having good shock-resistance combined with easy removability of the adhesives from the substrate shall be provided. This is solved by a pressure-sensitive adhesive which comprises at least one acrylonitrile-butadiene rubber; and at least one tackifier resin, and is characterized in that the acrylonitrile content of the acrylonitrile rubber is less than 30 wt %; the pressure-sensitive adhesive comprises at least one rosin resin as tackifier resin; and the entirety of all tackifier resins has an acid number of 6-150. The pressure-sensitive adhesive can be used for bonding parts in mobile electronic devices.

A radical-curable adhesive composition containing a rubber (a) having one or more (meth)acryloyl groups within a single molecular chain, a polymerizable monomer (b) having both an epoxy group and a (meth)acryloyloxy group in the molecule, and a radical polymerization initiator (c). The rubber (a) is preferably a polymer of a monomer containing at least acrylonitrile.