The present disclosure is directed to a cured epoxy resin and a method of forming a cured epoxy resin. The method comprises: curing an epoxy resin in the presence of an amine compound comprising a diamine, a triamine, or a mixture thereof. The cured epoxy resin has a shear modulus at failure of 55 MPa or more as determined in accordance with ASTM 5045-14.

Provided is an adhesive comprising a reaction product of (A) an aliphatic polyisocyanate having a molecular weight of from 132 to 700; and (B) a polyaspartate comprising a reaction product of (B1) a polyamine having a molecular weight of at least 240, and (B2) a Michael addition receptor, wherein viscosity @ 23? C. according to ASTM D1084-16, remains below 150 cps after four hours, and wherein the adhesive develops an acceptable bond strength to a substrate, defined as having a minimum of 150 g/in. measured @ 23? C. according to ASTM D 1876-01 or substrate tear, in less than five days after the substrate is laminated with the adhesive. The inventive flexible packaging adhesives are free of aromatic amines and may find use in multilayer laminates for a variety of industries, including the food processing, cosmetics, and detergents industries.

Provided is an adhesive comprising a reaction product of (A) an aliphatic polyisocyanate having a molecular weight of from 132 to 700; and (B) a polyaspartate comprising a reaction product of (B1) a polyamine having a molecular weight of at least 240, and (B2) a Michael addition receptor, wherein viscosity @ 23? C. according to ASTM D1084-16, remains below 150 cps after four hours, and wherein the adhesive develops an acceptable bond strength to a substrate, defined as having a minimum of 150 g/in. measured @ 23? C. according to ASTM D 1876-01 or substrate tear, in less than five days after the substrate is laminated with the adhesive. The inventive flexible packaging adhesives are free of aromatic amines and may find use in multilayer laminates for a variety of industries, including the food processing, cosmetics, and detergents industries.

The present disclosure relates to an aqueous dispersion containing at least one semicrystalline polyurethane-polyurea polymer and at least one surface-deactivated polyisocyanate. The melting temperature of the semicrystalline polyurethane-polyurea polymer is at least 55? C. The disclosure also relates to a process for preparing the aqueous dispersion, the use of the aqueous dispersion for producing coated substrates or adhesive films, flat or three-dimensional substrates coated with the aqueous dispersion, a substrate coated with at least one semicrystalline polyurethane-polyurea polymer and at least one surface-deactivated polyisocyanate, an adhesive film including at least one semicrystalline polyurethane-polyurea polymer and at least one surface-deactivated polyisocyanate, and a dried adhesive film obtained from such an aqueous dispersion.

The present disclosure relates to an aqueous dispersion containing at least one semicrystalline polyurethane-polyurea polymer and at least one surface-deactivated polyisocyanate. The melting temperature of the semicrystalline polyurethane-polyurea polymer is at least 55? C. The disclosure also relates to a process for preparing the aqueous dispersion, the use of the aqueous dispersion for producing coated substrates or adhesive films, flat or three-dimensional substrates coated with the aqueous dispersion, a substrate coated with at least one semicrystalline polyurethane-polyurea polymer and at least one surface-deactivated polyisocyanate, an adhesive film including at least one semicrystalline polyurethane-polyurea polymer and at least one surface-deactivated polyisocyanate, and a dried adhesive film obtained from such an aqueous dispersion.

The present disclosure generally relates to adhesive compositions and articles including at least one of polydiorganosiloxane polyoxamide copolymer and/or silicone polyurea block copolymer and a silicate tackifying resin. Some embodiments of the adhesive composition include at least one of a polydiorganosiloxane polyoxamide copolymer and a silicate tackifying resin in an amount of between about 0.1 wt % and about 20 wt %; or a silicone polyurea block copolymer and a silicate tackifying resin in an amount of between about 0.1 wt % and about 30 wt %.

Disclosed is a method for improving interfacial adhesion of an adhesive to unprimed substrates and an improved adhesive composition, involving admixing an adhesive with an adhesive modifier, where the modifier is at least partially soluble in the at least one adhesive and includes either a non-aromatic polyol or a molecule having at least one ortho-hydroxyl substitution on a benzene ring.

Disclosed is a method for improving interfacial adhesion of an adhesive to unprimed substrates and an improved adhesive composition, involving admixing an adhesive with an adhesive modifier, where the modifier is at least partially soluble in the at least one adhesive and includes either a non-aromatic polyol or a molecule having at least one ortho-hydroxyl substitution on a benzene ring.

In the field of polyisocyanate compositions for the production of coatings and adhesives, the disclosed composition combines a polyisocyanate compound with biuret motifs, a protic, polar reactive diluent compound, one of the addition compounds thereof, and an aprotic reactive diluent compound. Also disclosed is a method for producing the composition, and to the use thereof for producing a coating or an adhesive.

In the field of polyisocyanate compositions for the production of coatings and adhesives, the disclosed composition combines a polyisocyanate compound with biuret motifs, a protic, polar reactive diluent compound, one of the addition compounds thereof, and an aprotic reactive diluent compound. Also disclosed is a method for producing the composition, and to the use thereof for producing a coating or an adhesive.