A structure has a flexible thermally conductive material having an adhesive surface and a non-adhesive surface, and a thermally conductive adhesive adhered to the adhesive surface of the flexible thermally conductive material leaving the non-adhesive surface exposed to an atmosphere in which the structure resides. A structure has a substrate having one or more conductive paths, and a flexible, thermally conductive material attached to at least a portion of the substrate to draw heat away from the conductive paths. An apparatus has a substrate having one or more conductive paths, a probe tip at one end of the substrate configured to electronically connect with a device under test, and a flexible, thermally conductive material attached to at least a portion of the substrate to draw heat away from the probe tip and conductive paths.

A multilayer adhesive tape is provided, including: a first outer adhesive layer; an intermediate adhesive layer; and a second outer adhesive layer sequentially. At least one of the first outer adhesive layer and the second outer adhesive layer includes a cured product of an outer adhesive composition including a high molecular weight prepolymer having a weight average molecular weight of 100,000 g/mol or more and 1,500,000 g/mol or less and a low molecular weight prepolymer having a weight average molecular weight of 1,000 g/mol or more and 80,000 g/mol or less.

The present disclosure provides a dust-purifying adhesive layer, a dust-purifying film, and a dust-purifying film sleeve. The dust-purifying adhesive layer comprises a substrate layer, an optically clear adhesive (OCA) layer, and a dust-purifying layer, the dust-purifying layer and the OCA layer respectively disposed on two sides of the substrate layer, wherein the dust-purifying layer is adapted for dust-purifying and air bubbles elimination. Compared with the prior art, the dust-purifying adhesive layer comprises a dust-purifying layer having functions of dust-purifying function and anti-foaming and when the dust-purifying film is arranged on the screen of the electronic device, the dust-purifying layer is in direct contact with the screen, and during the film-pasting process, air bubbles can be quickly eliminated, so that no air bubbles are generated during the film-pasting process.

A spacer tape is provided for spacing apart turns of a winding, which comprises a tape having an upper surface, a lower surface and a longitudinal axis, wherein the lower surface is adhesable and configured to be adhered to a conductor forming a turn of the winding, and spacers with an upper surface and a lower surface arranged on the tape, wherein the lower surface of the spacers is adhered to the upper surface of the tape, and wherein the upper surface of the spacers are adhesable and configured to be adhered to the conductor forming an adjacent turn of the winding.

The present invention relates to a pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer containing a base polymer and a pigment, wherein the light transmittance in the wavelength range of 380 to 500 nm is 25% or less and the light transmittance in the wavelength range of 800 to 2,500 nm is 60% or more.

The present invention aims to provide an adhesive tape that is easily peelable while capable of maintaining high adhesion at high temperature. The present invention also aims to provide a method for fixing an electronic device component or an in-vehicle device component using the adhesive tape and a method for producing an electronic device or an in-vehicle device. Provided is an adhesive tape including an adhesive layer containing: an acrylic copolymer; and 0.01 parts by weight or more and 10 parts by weight or less of a compound having a structure represented by the following formula (A) or (B) relative to 100 parts by weight of the acrylic copolymer:

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The present invention aims to provide an adhesive tape capable of exhibiting excellent adhesion to rough surfaces. The present invention also aims to provide a method for fixing an electronic device component or an in-vehicle device component using the adhesive tape and a method for producing an electronic device or an in-vehicle device. Provided is an adhesive tape including an adhesive layer containing an acrylic copolymer, the acrylic copolymer containing 30% by weight or more of a structural unit derived from n-heptyl (meth)acrylate and 0.01% by weight or more and 30% by weight or less of a structural unit derived from 1-methylheptyl (meth)acrylate.

A low-cost, multi-function adhesive tape platform with a form factor that unobtrusively integrates one or more transducers and one or more wireless communication devices in an adhesive product system. In an aspect, the adhesive product system integrates transducer and wireless communication components within a flexible adhesive structure in a way that not only provides a cost-effective platform for interconnecting, optimizing, and protecting the constituent components but also maintains the flexibility needed to function as an adhesive product that can be deployed seamlessly and unobtrusively into various applications and workflows, including sensing, notification, security, and object tracking applications, and asset management workflows such as manufacturing, storage, shipping, delivery, and other logistics associated with moving products and other physical objects.

An adhesive composition includes a resin, a crosslinking agent, and a light absorber. The light absorber includes at least one selected from the group consisting of a benzophenone-based compound, a cyanoacrylate-based compound having a ring structure, a benzotriazole-based compound, and a sterically hindered amine compound having a ring structure.

A semiconductor package includes: a first substrate; a second substrate including a semiconductor element formed thereon; a film layer between the first substrate and the second substrate; and a molding member surrounding the second substrate, wherein the film layer includes a crystalline spherical silica filler distributed in a matrix.