A dielectric welding film capable of achieving a tight welding through a short period of dielectric heating, and a welding method using the dielectric welding film are provided. The dielectric welding film is configured to weld a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a thermoplastic resin as an A component and a dielectric filler as a B component and satisfying the conditions (i) and (ii): (i) a melting point or softening point measured in accordance with JIS K 7121 (1987) is in a range from 80 to 200 degrees C.; and (ii) heat of fusion measured in accordance with JIS K 7121 (1987) is in a range from 1 to 80 J/g.

A low temperature rapid curing type low elastic conductive adhesive is provided which is useful as a conductive adhesive for component mounting in a field of FHE. The conductive resin composition contains (A) at least two types of urethane acrylate oligomers, (B) a radical polymerizable monomer, (C) a free radical generation curing agent, and (D) conductive particle. In the conductive resin composition, the component (A) preferably contains a high molecular weight urethane acrylate oligomer having a weight average molecular weight of 10,000 or more (A1), and a low molecular weight urethane acrylate oligomer having a weight average molecular weight of 9,999 or less (A2).

Polyester compositions are the reaction product of a reaction mixture including at least two different diacids, and at least two different diols. At least one diacid or diol has at least one pendant ethylenically unsaturated group, and at least one diacid or diol has at least one pendant ionic group. The polyester composition has a glass transition temperature in a range of −60° C to 12° C, and is a vibration-damping, pressure sensitive adhesive.

The insulation adhesive film material is composed of a three-layer structure, its insulation polymer composite is supported by a thin film material, and a surface of the insulation polymer composite is covered with a layer of protective film. A release force of a support film is 25-60 μN/mm, and a release force of the protective film is 2-60 μN/mm. A thickness of the insulation polymer composite is 1-300 μm. The insulation adhesive film material is prepared as follows: after a high molecular polymer, an inorganic filler, a high molecular polymer curing agent, a molding auxiliary agent, and a solvent are mixed, dispersion technologies such as ball milling, sand milling, ultrasound are conducted to prepare an electronic paste of the insulation polymer composite, and the electronic paste is then applied to a surface of a support film material, and bonded with the protective film to form the insulation adhesive film material.

Provided is an optical laminate having excellent resistance to the pressure from the surface and a display device including the same. The optical laminate includes a surface protective layer, a first pressure sensitive adhesive layer, a light absorption anisotropic layer, and a second pressure sensitive adhesive layer in this order, in which an indentation elastic modulus of the first pressure sensitive adhesive layer is greater than an indentation elastic modulus of the light absorption anisotropic layer, the light absorption anisotropic layer is a layer formed of a composition for forming a light absorption anisotropic layer containing a liquid crystal compound and a dichroic substance, and a thickness of the light absorption anisotropic layer is less than 5 μm.

Provided is a film for manufacturing a semiconductor part in which an evaluation step accompanied with a temperature change, a segmenting step, and a pickup step can be commonly performed, a method for manufacturing a semiconductor part, a semiconductor part, and an evaluation method. The film includes a base layer, and an adhesive layer disposed on one surface side of the base layer, wherein the ratio RE (=E′(160)/E′(−40)) of the elastic modulus of the base layer at 160° C. to the elastic modulus of the base layer at −40° C. is RE≥0.01, and the elastic modulus E′(−40) is 10 MPa to less than 1000 MPa. The method includes bonding the adhesive layer to a back surface of a semiconductor wafer, separating the semiconductor wafer into segments to obtain semiconductor parts, and separating the semiconductor parts from the adhesive layer, and includes a step of evaluating.

To provide a double-sided pressure-sensitive adhesive sheet having high flexing resistance that does not suffer flexure and exfoliation in a flexing test that is closer to the actual use environment. A double-sided pressure-sensitive adhesive sheet having no substrate, containing a pressure-sensitive adhesive composition containing a (meth)acrylate ester (co)polymer (A), and having a glass transition temperature (Tg) defined by a Tan δ peak temperature of dynamic viscoelasticity in a range of −50° C. to −20° C., a storage elastic modulus G′ at a frequency of 1 Hz and a temperature 100° C. in a range of 2.0×10.sup.3 to 3.0×10.sup.4 Pa, and a thickness of 10 μm or more and 150 μm or less.

The present invention provides an adhesion promoting composition, or a sulfide compound-containing polysiloxane composition, having good adhesion, capable of forming a laminate having high adhesion between a metal layer and a polysiloxane layer. The adhesion promoting composition according to the present invention is an adhesion promoting composition applied to between a metal layer and a polysiloxane layer, and comprises a sulfide compound having a certain structure and a solvent. The sulfide compound-containing polysiloxane composition according to the present invention comprises a sulfide compound having a certain structure, a polysiloxane, and a solvent.

Provided is a pressure-sensitive adhesive sheet for semiconductor wafer processing that is excellent in adhesiveness with a semiconductor wafer, and that has light peelability and suppresses adhesive residue. The pressure-sensitive adhesive sheet for semiconductor wafer processing includes in this order: a base material; an intermediate layer; and a UV-curable pressure-sensitive adhesive layer. The intermediate layer has a storage modulus of elasticity at room temperature, G′1.sub.RT, of from 300 kPa to 2,000 kPa, and a storage modulus of elasticity at 80° C., G′1.sub.80, of from 10 kPa to 500 kPa. The UV-curable pressure-sensitive adhesive layer has a storage modulus of elasticity at room temperature, G′2.sub.RT, of from 100 kPa to 1,000 kPa, and a storage modulus of elasticity at 80° C., G′2.sub.80, of from 10 kPa to 1,000 kPa. G′1.sub.RT/G′2.sub.RT is 1 or more.

A low-cost, multi-function adhesive wireless communications and transducer platform with a form factor that unobtrusively integrates one or more transducers and one or more wireless communication devices in an adhesive product system. In an aspect, the adhesive product system integrates transducer and wireless communication components within a flexible adhesive structure in a way that not only provides a cost-effective platform for interconnecting, optimizing, and protecting the constituent components but also maintains the flexibility needed to function as an adhesive product that can be deployed seamlessly and unobtrusively into various applications and workflows, including sensing, notification, security, and object tracking applications, and asset management workflows such as manufacturing, storage, shipping, delivery, and other logistics associated with moving products and other physical objects.