Multilayer films and adhesive tapes that include such films, wherein the multilayer films include plasticized polyvinyl chloride and optionally one or more fillers.

A construction adhesive composition comprises between about 10 weight percent (wt. %) and about 30 wt. % of a vinyl acrylic latex, between about 30 wt. % and about 65 wt. % of calcium carbonate, and a surfactant.

A production method of a laminate including a substrate and a light-transmitting support plate that are laminated each other via an adhesive layer and a release layer that is altered through absorption of light, the method including a release layer forming step of coating a reactive polysilsesquioxane on a surface of the support plate, the surface being opposed to the substrate, and heating the reactive polysilsesquioxane to perform polymerization, thereby forming the release layer.

Adhesive tape having a carrier material comprising the following layers: a textile composed of fibers having a softening point greater than or equal to 200° C., and coated with fluoropolymers or silicone polymers, to the top side of which textile a first film composed of fluoropolymers is applied over the whole surface and to the bottom side of which textile a second film is applied over the whole surface, wherein a self-adhesive mass is applied to one side of the carrier material.

A laminate composite material (1), suitable for the packaging of food products and having a multilayer structure comprising: a first outer layer (21) of paper or plastic film; an inner layer (22) of adhesive; and an intermediate layer (23) interposed between the first and the second layer and made of sodium silicate (Na.sub.2O×SiO.sub.2).

A pressure sensitive adhesive film comprises a substrate film and a pressure sensitive adhesive (PSA) layer formed on a surface of the substrate film. The PSA layer is formed from a silicone composition comprising: a diorganopolysiloxane having at least two alkenyl groups in a molecule and having a viscosity at 25° C. of from 10,000 to 1,000,000 mPa.Math.s; (B) a diorganopolysiloxane having at least one alkenyl group in a molecule, and being raw and rubber-like at 25° C. or having a viscosity at 25° C. of more than 1,000,000 mPa.Math.s; (C) an organopolysiloxane resin represented by the following average unit formula: (R.sup.1.sub.3SiO.sub.1/2).sub.x(SiO.sub.4/2).sub.1.0, wherein each R.sup.1 represents a halogen-substituted or unsubstituted monovalent hydrocarbon group free from an alkenyl group and x is a number from 0.5 to 1.0; (D) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (E) silica fine powder; and (F) a hydrosilylation catalyst.

The invention aims to provide a method of manufacturing a carbon fiber resin tape capable of being adhered with a high adhesive strength without being pressurized at high pressure nor heated at high temperature. A method of manufacturing a carbon fiber resin tape F2 comprises: a first step of immersing a carbon fiber bundle F1 having several carbon fibers in reduced water having a negative oxidation-reduction potential to flatten the carbon fiber bundle; a second step of immersing the above-described carbon fiber bundle in an adhesive solution containing an adhesive S, alumina sol A, and potassium persulfate B after the above-described first step; and a third step of drying the above-described carbon fiber bundle after the above-described second step.

A method for producing a component includes a) providing at least two preforms each made of a carbon composite material, b) joining the at least two preforms at least at one respective connecting surface to form a composite, in which a joining compound is introduced between the joining surfaces of the preforms and then cured and the joining compound contains silicon carbide and at least one polymer adhesive, and c) siliconizing the composite to form the component. A component, such as an optical component produced thereby, is also provided.

A composition with latent adhesion, fuel cell stack with a bipolar plate assembly with latent adhesion and a method of assembling a fuel cell stack with a seal that has latent adhesion such that reactant or coolant leakage through the seal is reduced. Bipolar plates within the stack include reactant channels and coolant channels that are fluidly coupled to inlet and outlet flowpaths, all of which are formed within a coolant-engaging or reactant-engaging surface of the plate. One or more thin or low aspect-ratio seals are formed on a metal bead that is integrally-formed on a surface of the plate and is used to help reduce leakage by maintaining fluid isolation of the reactants and coolant as they flow through their respective channels and flowpaths that are defined between adjacently-placed plates. By proper formulation of the precursor materials that make up the seal, the activation of the adhesive bond formed between the seal and an adjacent surface within the fuel cell can be delayed to allow ample time to aligned and compressively join the cell assemblies in a stack housing. This in turn improves the ability of the seal and its adjacent surface to avoid seal damage and concomitant reactant or coolant leakage.

The present invention provides a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive force thereof does not change over the course of steps for manufacturing a semiconductor device or the like, and the adhesive can subsequently be easily de-bonded at room temperature under mild conditions; and a method for manufacturing a semiconductor device using the temporary-bonding adhesive. The present invention includes a temporary-bonding adhesive wherein a polyimide copolymer having at least an acid dianhydride residue and a diamine residue, the diamine residue including both of (A1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 1 to 15, and (B1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 16 to 100, the polyimide copolymer containing 40-99.99 mol % of the (A1) residue and 0.01-60 mol % of the (B1) residue.